[paper] Logic Without CMOS

Jonathan Hall and Manus Hayne

Logic Without CMOS: A III-V Semiconductor, Single Charge Carrier Approach to Digital Logic

WOCSDICE-EXMATEC 2023, Palermo (Italy), 21-25 May 2023

Department of Physics, Lancaster University, Lancaster, United Kingdom

Abstract: A new patent-pending approach to digital logic devices is proposed as an alternative to complimentary metal-oxide-semiconductor (CMOS) logic. A novel III-V semiconductor digital logic device combines both the “n” and “p” equivalents of CMOS into a single heterostructure device using just one type of charge carrier. The device, which forms an inverter, consists of two charge-accepting channel layers which sandwich a central electron (or hole) reservoir. Under zero bias the charge remains in the reservoir with both channel layers absent of free charge carriers (off state). Once a bias is applied to the gate, charge is either pushed into the bottom channel (negative bias) or pulled into the top channel (positive bias) turning one channel on whilst the other remains off. Thus, the complementary behaviour of logic, in which one part of the logic element is on and the other is off, is achieved without the asymmetry of hole and electron mobility. Proof of concept devices have been designed in both the well documented GaAs/AlxGa1-xAs system and in the 6.1Å family of semiconductors. One-dimensional, room temperature energy-band simulations using nextnano++ (software for semiconductor devices) [1] have shown effective and symmetric logic function at low voltage and an excess of 1,000× charge density ratio between the two channels under operation. Proof of concept devices are currently undergoing fabrication.

Fig: Proposed device architecture for an inverter, utilising electrons as the charge carrier. The “N” and “P” charge-accepting layers represent the equivalent CMOS transistors. With positive VG, the electrons are pulled from the reservoir into the upper channel, and with negative VG, the electrons are pushed into the lower channel. With zero bias, the charge remains within the reservoir and the channels are resistive (off). The barrier layers can consist of grown semiconductor or deposited dielectric.

Acknowledgments: Thanks to the Leverhulme Trust for a PhD studentship for Jonathan Hall and to nextnano for access to their software.

[papers] Biosensors for Agriculture, Environment and Food

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J. Ajayan, P. Mohankumar, R. Mathew, L. R. Thoutam, B. K. Kaushik and D. Nirmal

"Organic Electrochemical Transistors (OECTs)

Advancements and Exciting Prospects for Future Biosensing Applications" 

in IEEE Transactions on Electron Devices, vol. 70, no. 7, pp. 3401-3412, July 2023

DOI: 10.1109/TED.2023.3271960

Abstract: Over the past few decades, the field of organic electronics has depicted proliferated growth, due to the advantageous characteristics of organic semiconductors, such as tunability through synthetic chemistry, simplicity in processing, cost-effectiveness, and low-voltage operation, to cite a few. Organic electrochemical transistors (OECTs) have recently emerged as a highly promising technology in the area of biosensing and flexible electronics. OECT-based biosensors are capable of sensing brain activities, tissues, monitoring cells, hormones, DNAs, and glucose. Sensitivity, selectivity, and detection limit are the key parameters adopted for measuring the performance of OECT-based biosensors. This article highlights the advancements and exciting prospects of OECTs for future biosensing applications, such as cell-based biosensing, chemical sensing, DNA/ribonucleic acid (RNA) sensing, glucose sensing, immune sensing, ion sensing, and pH sensing. OECT-based biosensors outperform other conventional biosensors because of their excellent biocompatibility, high transconductance, and mixed electronic–ionic conductivity. At present, OECTs are fabricated and characterized in millimeter and micrometer dimensions, and miniaturizing their dimensions to nanoscale is the key challenge for utilizing them in the field of nanobioelectronics, nanomedicine, and nanobiosensing. URL

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Y. Wu et al., 

"A Dynamic Concentration-Dependent Analytical I,–V Model for LG-GFET Biosensor" 

in IEEE Transactions on Electron Devices, vol. 70, no. 6, pp. 3255-3262, June 2023, 

DOI: 10.1109/TED.2023.3268139.

Abstract: In the past few years, liquid-gated graphene field-effect transistors (LG-GFETs) have been widely used in biological detection due to their unique advantages. An accurate transistor model is the basis of biological detection circuit design, however, the reported GFET models are mainly focusing on solid-gated GFETs. Therefore, it is essential to conduct the research on LG-GFET model. In this article, an improved  IV  model of LG-GFET is presented based on Fregonese’s model. An improved electric double-layer capacitor model is proposed for LG-GFET. Then, the relationship among iron concentration, bias voltages, and current is studied comprehensively. Furthermore, the drain current response change with time is taken into account and the dynamic concentration-dependent model is established. To verify the accuracy of the proposed model, LG-GFET is simulated in TCAD software and fabricated to perform the measurement. The simulation results and measurement results are compared with the model results, respectively. These results show that the relative root-mean-square error (RMSE) to both simulation and measurement results is less than 5.7%. It is revealed that the proposed model can be applied to biological detection and achieve high accuracy.URL

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Special Issue "Biosensors for Agriculture, Environment and Food"

Biosensors (ISSN 2079-6374) an Open Access Journal by MDPI

Editor-in-Chief Prof. Dr. Giovanna Marrazza 

Department of Chemistry “Ugo Schiff”, University of Florence, Italy

Food safety has become a hot issue concerned by governments, people and society. Biosensors have been playing a greater vital role in monitoring agro-products and their production process to ensure end-foods’ quality and safety, and they usually demonstrate a lot of benefits, such as being sensitive, rapid, portable, cheap and especially suitable for on-site testing. So, this topic will concern the development of biosensors and analytical methods, especially for chemicals, microorganisms, biotoxins in agriculture, environment and food samples. It is suggested that biosensors should be in line with the trend of five “S”, Sensitivity, Specificity (Selection), Speed, Simultaneously, Small (Smart), and that all detection methods should be validated using agriculture, environment or food samples. Interdisciplinary research and integrative application research related to biosensors are also encouraged, including review articles and research articles.

[mos-ak] [Final Program] 5th International MOS-AK/LAEDC Workshop, July 2, 2023, Puebla (MX)

Arbeitskreis Modellierung von Systemen und Parameterextraktion 

Modeling of Systems and Parameter Extraction Working Group

5th International MOS-AK/LAEDC Workshop

July 3, 2023, Puebla (MX)

Final Workshop Program

Together with Profs Benjamin Iñiguez Nicolau, and Roberto S. Murphy Arteaga, local MOS-AK/LAEDC workshop coordinators, the LAEDC Organizers as well as all the Extended MOS-AK TPC Committee, would like to invite you to the 4th International MOS-AK/LAEDC Workshop which will be organized as the virtual/online event on July 3, 2022, between 8:00am - 12:00pm (local MX time) as an in-person event in Puebla (MX) providing an opportunity to meet with modeling engineers and researchers from Europe and Latin America.

The final program of the 5th International MOS-AK/LAEDC Workshop is available online:

https://www.mos-ak.org/puebla_2023/

Online Event Registration is open; any related enquiries can be sent to registration@mos-ak.org or laedc@ieee.org 

Important Dates: 

• Final Workshop Program: June 2023
  
• MOS-AK: July 2, 2023, Puebla (MX)
• 8:00am -  12:00pm (local MX time) MOS-AK Workshop

W.Grabinski for Extended MOS-AK Committee

WG210623

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[book] Device Circuit Co-Design Issues in FETs

Device Circuit Co-Design Issues in FETs

Editors: Shubham Tayal, Billel Smaani, Shiromani Balmukund Rahi, Samir Labiod, Zeinab Ramezani

ISBN 9781032414256280 Pages 269 B/W Illustrations 

August 22, 2023 by CRC Press

Description

This book provides an overview of emerging semiconductor devices and their applications in electronic circuits, which form the foundation of electronic devices. Device Circuit Co-Design Issues in FETs provides readers with a better understanding of the ever-growing field of low-power electronic devices and their applications in the wireless, biosensing, and circuit domains. The book brings researchers and engineers from various disciplines of the VLSI domain together to tackle the emerging challenges in the field of engineering and applications of advanced low-power devices in an effort to improve the performance of these technologies. The chapters examine the challenges and scope of FinFET device circuits, 3D FETs, and advanced FET for circuit applications. The book also discusses low-power memory design, neuromorphic computing, and issues related to thermal reliability. The authors provide a good understanding of device physics and circuits, and discuss transistors based on the new channel/dielectric materials and device architectures to achieve low-power dissipation and ultra-high switching speeds to fulfill the requirements of the semiconductor industry. This book is intended for students, researchers, and professionals in the field of semiconductor devices and nanodevices, as well as those working on device-circuit co-design issues.

Table of Contents

1. Modeling for CMOS Circuit Design. 

2. Conventional CMOS Circuit Design. 

3. Compact modeling of junctionless Gate-All-Around MOSFET for circuit simulation. 

4. Novel Gate-Overlap Tunnel FETs for Superior Analog, Digital, and Ternary Logic Circuit Applications. 

5. Phase Transition Materials for Low Power Electronics. 

6. Impact of total ionizing dose effect on SOI-FinFET with spacer engineering. 

7. Scope and Challenges with Nanosheet FET based Circuit design. 

8. Scope with TFET based Circuit and System Design. 

9. An overview of FinFET based Capacitorless 1T-DRAM. 

10. Literature Review of the SRAM Circuits Design Challenges. 

11.Challenges and Future Scope of Gate-All-Around (GAA) Transistors: 

Physical Insights of Device-Circuit Interactions. 

[review] TCAD Simulations of Semiconductor Piezoresistance

Takaya Sugiura, Kazunori Matsuda*, Nobuhiko Nakano

Review: Numerical Simulations of Semiconductor Piezoresistance for Computer-Aided Designs

in IEEE J-EDS, vol. 11, pp. 325-336, 2023

DOI: 10.1109/JEDS.2023.3281866

  Department of Electronics and Electrical Engineering, Keio University, Yokohama, Kanagawa, Japan

* Division of Electrical, Electronic and Infocommunications Engineering, Osaka University, Suita, Japan

Abstract: The field of piezoresistance has mainly advanced through experimental research; however, the improved accuracy of simulations and the emergence of new materials have increased the importance of simulations in this field. This review discusses the methods and current topics related to simulations of piezoresistive devices. Advancing simulation modeling will facilitate the computer-aided design of piezoresistive devices, and this review introduces the means of establishing these models by discussing the current studies on simulations and calculations in this field. Two simulation methods currently exist namely, device simulations and first-principles theoretical analysis. This review focuses on numerical simulation approaches for modeling of the piezoresistive effect using the multiphysics simulations of the mechanical and electrical behaviors of piezoresistive materials.

FIG: Basic simulation flow for studies on semiconductor piezoresistors.

[paper] Vertical Junction-Less Nanowire FETs

C. Maneux (University of Bordeaux), C. Mukherjee (CNRS), M. Deng (University of Bordeaux), G. Larrieu (CNRS), Y. WANG, B. Wesling, and H. Rezgui (University of Bordeaux)

Strategies for Characterization and Parameter Extraction of Vertical Junction-Less Nanowire FETs Dedicated to Design Technology Co-Optimization

H02-1863 (Invited) at 243rd ECS Meeting and SOFC-XVIII 

Boston, MA, May 29 - June 2, 2023

Abstract: In the era of emerging computing paradigms and artificial neural networks, hardware and functionality requirements are in the surge. In order to meet low power and latency criteria, new architectures for in-memory computing are being explored as alternatives to traditional von Neumann machines, which requires technological breakthrough at the semiconductor device level such as vertical gate-all-around junctionless nanowire field effect transistors (VNWFET), that can address many process challenges such as downscaling, short-channel effects, compactness and electrostatic control. Its integration in the mainstream design flow is not straightforward and requires design technology co-optimization (DTCO) at an early stage. This invited paper explores strategies for accurate characterization and parameter extraction of the VNWFETs to feed the DTCO compact models

Fig: Final verification using full 3D multiphysics device thermal simulation, accounting for both ballistic and diffusive heat flux

[paper] FDSOI Threshold Voltage Model

Hung-Chi Han1, (Student, IEEE), Zhixing Zhao2, Steffen Lehmann2,

Edoardo Charbon1, (Fellow, IEEE), and Christian Enz1 (Life Fellow, IEEE)

Novel Approach to FDSOI Threshold Voltage Model Validated at Cryogenic Temperatures

in IEEE Access, DOI: 10.1109/ACCESS.2023.3283298

1 Ecole Polytechnique Fédérale de Lausanne (EPFL), 2000 Neuchâtel, Switzerland
2 GlobalFoundries, 01109 Dresden, Germany

Abstract: The paper presents a novel approach to to the modeling of the back-gate dependence of the threshold voltage of Fully Depleted Silicon-On-Insulator (FDSOI) MOSFETs down to cryogenic temperatures by using slope factors with a gate coupling effect. The FDSOI technology is well-known for its capability to modulate the threshold voltage efficiently by the back-gate voltage. The proposed model analytically demonstrates the threshold voltage as a function of the back-gate voltage without the pre-defined threshold condition, and it requires only a calibration point, i.e., a threshold voltage with the corresponding back-gate voltage, front- and back-gate slope factors, and work functions of front and back gates. The model has been validated over a wide range of the back-gate voltages at room temperature and down to 3 K. It is suitable for optimizing low-power circuits at cryogenic temperatures for quantum computing applications

FIG: Room temperature back-gate coefficient η versus VT−VB for an n-type conventional well (RVT) FDSOI FET with 1 µm of gate length and width. The θ=0 happens at VT−VB = −0.63V due to −0.63V of the front-back gate work function difference 

Acknowledgment: The authors would like to thank Claudia Kretzschmar from GlobalFoundries Germany and GlobalFoundries University Partnership Program for providing 22 FDX® test structures and support. Hung-Chi Han would like to thank Davide Braga from Fermi National Accelerator Laboratory for his valuable support. This project has received funding from the European Union’s Horizon 2020 Research & Innovation Program under grant agreement No. 871764. SEQUENCE.

[paper] Vacuum Electron Devices

R. Lawrence Ives, Life Senior Member, IEEE

Advanced Fabrication of Vacuum Electron Devices

(Invited Paper)

IEEE TED, Vol. 70, No. 6, June 2023

DOI: 10.1109/TED.2023.3268629

Abstract: RF source scientist and engineers continuously push the envelope with new designs, striving for improved performance with higher efficiency, higher frequency, greater bandwidth, increased gain, smaller size, lower voltage, and myriad other parameters required for ever more demanding applications. Invariably, it becomes more challenging to achieve the required fabrication and assembly performance with increasing complexity and precision. This publication reviews recent development on advanced fabrication technologies and describes the current state of the art in machining, assembly, and alignment capabilities.

FIG: Assembled 11.4-GHz accelerating structure assembled with elastic averaging

Acknowledgment: Several people assisted with this article, and the author would like to acknowledge their contributions. These include Jeff Herman at Ron Witherspoon, Inc., Colin Joye at the Naval Research Laboratory, Daniel Busbaher at 3M Technical Ceramics, Diana Gamzina at Elvespeed, Emma Snively at SLAC National Accelerator Laboratory, and Philipp Borchard at Dymenso. The author would like to thank RWI for access to their facilities to see their micro-CNC and software capabilities in operation.

[paper] Microchips for Memristive Applications

Kaichen Zhu, Sebastian Pazos, Fernando Aguirre, Yaqing Shen, Yue Yuan, Wenwen Zheng, Osamah Alharbi, Marco A. Villena, Bin Fang, Xinyi Li, Alessandro Milozzi, Matteo Farronato, Miguel Muñoz-Rojo, Tao Wang, Ren Li, Hossein Fariborzi, Juan B. Roldan, Guenther Benstetter, Xixiang Zhang, Husam N. Alshareef, Tibor Grasser, Huaqiang Wu, Daniele Ielmini & Mario Lanza 

Hybrid 2D–CMOS microchips for memristive applications

Nature 618, 57–62 (2023)

DOI: 10.1038/s41586-023-05973-1

Abstract: Exploiting the excellent electronic properties of two-dimensional (2D) materials to fabricate advanced electronic circuits is a major goal for the semiconductor industry1,2. However, most studies in this field have been limited to the fabrication and characterization of isolated large (more than 1 µm2) devices on unfunctional SiO2–Si substrates. Some studies have integrated monolayer graphene on silicon microchips as a large-area (more than 500 µm2) interconnection3 and as a channel of large transistors (roughly 16.5 µm2) (refs. 4,5), but in all cases the integration density was low, no computation was demonstrated and manipulating monolayer 2D materials was challenging because native pinholes and cracks during transfer increase variability and reduce yield. Here, we present the fabrication of high-integration-density 2D–CMOS hybrid microchips for memristive applications—CMOS stands for complementary metal–oxide–semiconductor. We transfer a sheet of multilayer hexagonal boron nitride onto the back-end-of-line interconnections of silicon microchips containing CMOS transistors of the 180 nm node, and finalize the circuits by patterning the top electrodes and interconnections. The CMOS transistors provide outstanding control over the currents across the hexagonal boron nitride memristors, which allows us to achieve endurances of roughly 5 million cycles in memristors as small as 0.053 µm2. We demonstrate in-memory computation by constructing logic gates, and measure spike-timing dependent plasticity signals that are suitable for the implementation of spiking neural networks. The high performance and the relatively-high technology readiness level achieved represent a notable advance towards the integration of 2D materials in microelectronic products and memristive applications.

FIG: Structure of the considered SNN. Each MNIST image is reshaped as a 784x1 column vector, and the intensity of the pixels is encoded in terms of the firing frequency of the input neurons. The only trainable synapses are those connecting the input layer with the excitatory layer, and they are modelled with the STDP characteristic of the CMOS-h-BN based 1T1M cells. The learning is unsupervised, and the neurons are labelled only after the training. These label-neuron assignments are then feed to the decision block altogether with the firing patterns of the neurons, to infer the class of the image presented in the input. 

Acknowledgements: This work has been supported by the Ministry of Science and Technology of China (grant nos. 2019YFE0124200 and 2018YFE0100800), the National Natural Science Foundation of China (grant no. 61874075) and the Baseline funding scheme of the King Abdullah University of Science and Technology.

[Workshop] Open Source PDKs and EDA

 Workshop 1: Open Source PDKs and EDAs, 

Community Experiences toward Democratization of Chip Design

RIHGA Royal Hotel Kyoto, Horikawa Shiokoji, Shimogyo ku, Kyoto 600 8237, Japan.

Date & Time: 5:30pm.-7:15pm on June 11 (Sun), 2023

Since its launch in 2020, the Open MPW shuttle program has received over 500 project submissions spanning 9 shuttles. This workshop will explore various topics related to designers' experiences, including measured results, foundry perspectives, and governmental expectations.

Organizers: 

• Makoto Ikeda (The University of Tokyo)
• Mehdi Saligane (University of Michigan)

Program:

1. Design experience: “The Journey of Two Novice LSI Enthusiasts: Tape-Out of CPU+RAM in Just One Month”, Kazuhide Uchiyama, University of Electro-Communications and Yuki Azuma, University of Tsukuba
2. From Zero to 1000 Open Source Custom Designs in Two Years, Mohamed Kassem, Co-founder and CTO, Efabless
3. The SKY130 Open Source PDK: Building an Open Source Innovation Ecosystem, Steve Kosier, Skywater technology
4. Open Source Chip Design on GF180MCU – A foundry perspective, Karthik Chandrasekaran, Global Foundries
5. Japan Foundries' Perspectives on Silicon design democratization, Shiro Hara, Minimal Fab & AIST
6. Google's perspective on Open source PDKs, Open source EDA tools, and OpenMPW shuttle program, Johan Euphrosine and Tim Ansell, Google
7. The Nanofabrication Accelerator Project, Matthew Daniels, NIST
8. Japanese government perspective on Silicon design democratization, Yohei Ogino, The Ministry of Economy, Trade and Industry METI

VLSI Symposium Workshop1 "Open Source PDKs and EDA" Audience

[book] Tunneling Field Effect Transistors

Tunneling Field Effect Transistors
Design, Modeling and Applications

Edited By T. S. Arun Samuel, Young Suh Song, Shubham Tayal, P. Vimala, Shiromani Balmukund Rahi

ISBN 9781032348766
1st Edition; 316 Pages; 15 Color & 232 B/W Illustrations
June 8, 2023 by CRC Press

Description: This book will give insight into emerging semiconductor devices from their applications in electronic circuits, which form the backbone of electronic equipment. It provides desired exposure to the ever-growing field of low-power electronic devices and their applications in nanoscale devices, memory design, and biosensing applications.

Tunneling Field Effect Transistors: Design, Modeling and Applications brings researchers and engineers from various disciplines of the VLSI domain to together tackle the emerging challenges in the field of nanoelectronics and applications of advanced low-power devices. The book begins by discussing the challenges of conventional CMOS technology from the perspective of low-power applications, and it also reviews the basic science and developments of subthreshold swing technology and recent advancements in the field. The authors discuss the impact of semiconductor materials and architecture designs on TFET devices and the performance and usage of FET devices in various domains such as nanoelectronics, Memory Devices, and biosensing applications. They also cover a variety of FET devices, such as MOSFETs and TFETs, with various structures based on the tunneling transport phenomenon.

The contents of the book have been designed and arranged in such a way that Electrical Engineering students, researchers in the field of nanodevices and device-circuit codesign, as well as industry professionals working in the domain of semiconductor devices, will find the material useful and easy to follow.

Table of Contents:

Chapter 1. Challenges of Conventional Cmos Technology in Perspective of Low Power Applications

Chapter 2. Basic Science and Development of Subthreshold Swing Technology

Chapter 3. Historical Development of MOS technology to Tunnel FETs

Chapter 4. Modeling of Gate Engineered TFETs: Challenges and Opportunities

Chapter 5. Modeling of Gate Engineered TFET: challenges and Opportunities.

Chapter 6. Evolution of Heterojunction Tunnel Field Effect Transistor and its Advantages

Chapter 7. Analog / RF performance analysis of TFET device

Chapter 8. DC Analysis and Analog/HF Performances of GAA-TFET with Dielectric Pocket

Chapter 9. Investigation on Ambipolar Current Suppression in Tunnel FETs

Chapter 10. Analysis of Channel Doping Variation on Transfer Characteristics to High Frequency performance of F-TFET

Chapter 11. Design of Nanotube TFET Biosensor

Chapter 12. TFET-based Memory Cell Design with Top-down Approach

Chapter 13. Designing of nonvolatile memories utilizing Tunnel Field Effect Transistor

Chapter 14. TFET-based Universal

Chapter 15. TFET-based Level Shifter Circuits for Low Power Applications

[Commemorative] History of Junction Technologies

Hiroshi Iwai

History of Junction Technologies

Commemorative talk for the 75th anniversary of the transistor

IWJT 2023; T-Cosponsored by IEEE EDS; 

Kyoto (J) June 8-9, 2023

1 International College of Semiconductor Technology, National Yang Ming Chiao Tung University, Hsinchu, Taiwan
2 Tokyo Institute of Technology, Japan

Abstract: In this paper, I describe the history of junction technologies for ICT (Information and Communication Technology) devices. Junctions serve as functional interfaces between materials in these devices. Over the past 200 years, since the inception of electrical engineering, a wide range of junction technologies have been developed as key components for device operation, playing a significant role in advancing intelligence in human society.

FIG: The first idea of FET (MISFET) by J. Lilienfeld "Method and apparatus for controlling electric current", Canadian Patent CA272437TA, filed October 22, 1925

Acknowledgements: I [author: Hiroshi Iwai] would like to express my sincere appreciation to the Tokyo Institute of Technology Library for granting me access to historically significant documents. The information available on the Computer History Museum (CHM) website was instrumental in understanding the timeline of device development. I am deeply grateful to Prof. Kazuo Tsutsui of Tokyo Institute of Technology for providing me with a conducive environment to concentrate on writing this manuscript. I would also like to extend my gratitude to the IWJT committee members for granting me the valuable opportunity to document the history of junction technologies, logic and memory device technologies, as well as reviewing the lengthy manuscript. In particular, I am grateful to Dr. Michael Current for his meticulous review of the manuscript. Finally, I would like to thank my colleagues in both industry and academia who have dedicated their time and expertise to the advancement of integrated circuit technology over the years.

[paper] Perovskite Photodiodes

Dong Li and Anlian Pan

Perovskite sensitized 2D photodiodes

Light Sci Appl 12, 139 (2023)

DOI: 10.1038/s41377-023-01187-2

Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, State Key Laboratory of Chemo/Biosensing and Chemometrics, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, Hunan University, Changsha, China

Abstract: A new type of perovskite sensitized programmable WSe2 photodiode is constructed based on MAPbI3/WSe2 heterojunction, presenting flexible reconfigurable characteristics and prominent optoelectronic performances. The unique design of MAPbI3/WSe2 device provides a new idea to fabricate high-performance programmable photodiodes. In addition, the combination of atomic thin 2D materials and ionic solids enables effective coupling between electronic transport and ionic transport, which may open up a new pathway for unconventional computing, information storage systems, and programmable optoelectronic devices.

FIG: Schematic view of MAPbI3/WSe2 device structure and working mechanism 

of the programmable perovskite sensitized WSe2 photodiode

[paper] Teaching Traditional TCAD New Tricks

Sanghoon Myung¹, Wonik Jang¹, Seonghoon Jin²

Myung Choe¹, Changwook Jeong¹, and Dae Sin Kim¹

Restructuring TCAD System:

Teaching Traditional TCAD New Tricks

DOI: 10.1109/IEDM19574.2021.9720616

1Data and Information Technology Center, Samsung Electronics.
2Device Lab, Samsung Semiconductor Inc.

Abstract : Traditional TCAD simulation has succeeded in predicting and optimizing the device performance; however, it still faces a massive challenge - a high computational cost. There have been many attempts to replace TCAD with deep learning, but it has not yet been completely replaced. This paper presents a novel algorithm restructuring the traditional TCAD system. The proposed algorithm predicts three-dimensional (3D) TCAD simulation in real-time while capturing a variance, enables deep learning and TCAD to complement each other, and fully resolves convergence errors.

Fig: (a) A TCAD process simulation result. (b) A prediction result of RTT process model.

(c) 1D doping concentration plot in the horizontal direction below the gate.

(d) 1D doping concentration plot in the vertical direction at the center of drain.