The IJHSES Call for Papers
Special Issue on Advances in the Compact/SPICE Modeling
and its Verilog-A Standardization
Compact/SPICE models for circuit level simulation are essential element of supporting CAD/EDA tools for advanced integrated circuit designs. Rapid mainstream CMOS technology expansion and its scaling into the nanometer regime demands development of a fully physical as well as technology predictive compact/SPICE models for circuit simulation which provides adequate, full range DC, AC, RF, and noise characteristics and its geometry, bias, temperature scaling. These tasks becomes a major R&D challenge. Fast new technology nodes developments also impose new challenges on the compact/SPICE models maintenance and development as well as on its Verilog-A standardization for the model implementation, validation and dissemination.
Standard, core compact models should include and update noise/mismatch and reliability/variability models as well as proximity effects to adequately model nanoscale devices and technologies including nonclassical MOSFETs, multigate FinFETs and nanowire FETs partially/fully-depleted ultra thin body (UTB) SOI, and thin-film transistors (TFTs). High-frequency, high-voltage high-power, high-temperature devices have been extensively investigated, and their compact models to be reviewed, too. Heterogeneous integration opens a new perspectives to the CMOS platform to integrate different materials (III-V/Ge channel, organic and different source/drain injection mechanisms (Schottky-barrier, tunneling, junctionless FETs, and others) and new nonclassical devices, high GHz/THz range detectors, Bio/Med sensors, actuators, MEMS, among others, to support emerging device in future VLSI, IoT applications and beyond.
Therefore, there is an emerging need for an new special issue to review status, challenge and advancement in the compact/SPICE modeling for nanoscaled and emerging technologies as well as beyond. The IJHSES Editors seek original manuscripts for a special issue on advanced in the Compact/SPICE Modeling and its Verilog-A standardization.
Topics to be covered include the following, but are not limited to:
Advances in semiconductor technologies and processing
Compact Modeling (CM) of the electron devices
Verilog-A language for CM standardization
New CM techniques and extraction software
FOSS TCAD/EDA modeling and simulation
CM of passive, active, sensors and actuators
Emerging Devices, TFT CMOS and SOI-based memory cells
Organic, Bio/Med devices/technology modeling
Microwave, RF device modeling, HV/Power device modeling
Nanoscale CMOS devices and circuits
Technology R&D, DFY, DFT and IC Designs
Foundry/Fabless Interface Strategies
Paper Submission and Review Schedule:
First call for papers: April 2017
Second announcement: June 2017
Special Issue Due: Dec. 2017
Rensselaer Polytechnic Institute (USA)
MOS-AK Association (EU)
DEEEA, ETSE, URV (SP)
EPFL Lausanne (CH)
ITE Warsaw (PL)
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