Friday, November 30, 2007
from the Philips Research Labs., Eindhoven.
They review compact modelling from its beginnings, and explain two different examples (the PSP model, obiously, and a compact model for integrated inductors). It is quite interesting as a first (or second...) contact with this world.
By the way, the paper (An industrial view on Compact Modelling) is here.
Thursday, November 29, 2007
MSM is the main technical forum to present the latest research and development in design, modeling and simulation methods, tools and applications in the MEMS, microelectronic, semiconductor, sensor, materials and biotechnology fields. Process, device and circuit simulation is one of the topics explicitly mentioned. Semiconductors and Microelectronics is indicated as one of the application areas.
The Electronics and Microsystems suite of symposia at Nanotech 2008 has become a premier annual event in the Micro and Nano technologies arena. This Electronics and Microsystems suite of symposia is composed with the MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, andthe MSM conference The deadline for abstract submission is December 6 2007.
Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line magazine ‘Sensors & Transducers’ (S&T e-Digest).
The Workshop on Compact Modeling (WCM) is one of the largest event devoted to the Compact Modeling field. WCM has become a very important open forum for discussion among experts in this field as well as feedback from technology developers, circuit designers, and EDA tool vendors.
The suggested topics include all important aspects of compact model development and application: intrinsic models, extrinsic/interconnec models, atom/quantum models, statistical models, and model extraction and interface.
A limited number of papers will be selected for oral presentations and the remaining accepted papers will be planned for poster presentations with oral briefing. The deadline for abstract submission is December 6 2007.
The Chairman of WCM is Professor Xing Zhou (from Nanyang Technological University, Singapore). He was the person who created WCM and has made this workshop very successful.
I think that it is a must for Compact Modeling researchers to attend WCM. Many of the last advances in this field are presented there.
Suggested topics include Devices, Technology, Applications, Modeling and Quantum Simulations. Compact modeling for circuit design is explicitly mentioned as one of the topics.
The deadline for paper submission is April 30 2008, and the publication date will be November 2008.
Saturday, November 10, 2007
Threshold voltage stability of organic field-effect transistors for various chemical species in the insulator surface
Kouji Suemori, Sei Uemura, Manabu Yoshida, Satoshi Hoshino, Noriyuki Takada, Takehito Kodzasa, and Toshihide Kamata
Appl. Phys. Lett. 91, 192112 (2007) (3 pages)
High performance n-channel thin-film transistors with an amorphous phase C60 film on plastic substrate
Jong H. Na, M. Kitamura, and Y. Arakawa
Appl. Phys. Lett. 91, 193501 (2007) (3 pages)
The influence of visible light on transparent zinc tin oxide thin film transistors
P. Görrn, M. Lehnhardt, T. Riedl, and W. Kowalsky
Appl. Phys. Lett. 91, 193504 (2007) (3 pages)
Flexible programmable logic gate using organic ferroelectric multilayer
Satoshi Horie, Kei Noda, Hirofumi Yamada, Kazumi Matsushige, Kenji Ishida, and Shuichiro Kuwajima
Appl. Phys. Lett. 91, 193506 (2007) (3 pages)
Numerical modeling study of the unipolar accumulation transistor
Stephen J. Fonash, Md Mash-hud Iqbal, Florin Udrea, and Piero Migliorato
Appl. Phys. Lett. 91, 193508 (2007) (3 pages)
Interface effects on the external quantum efficiency of organic bulk heterojunction photodetectors
Y. Kim, M. Ballarotto, D. Park, M. Du, W. Cao, C. H. Lee, W. N. Herman, and D. B. Romero
Appl. Phys. Lett. 91, 193510 (2007) (3 pages)
Friday, November 9, 2007
| Two new product demos/tutorials have been added to Mentor's online event library. Both events are available on-demand and you can attend one or both at your convenience. |
| Mentor Graphics Corporation |
Tuesday, November 6, 2007
IWCM is an interesting forum to present and discuss the recent advances in compact modeling and simulation of semiconductor devices and integrated circuits. Actually IWCM is one of the few existing Workshops devoted mostly to compact modeling, and the only one who takes place in Asia.
IWCM is collocated with the 13th Asian and South Pacific Design Automation Conference (ASP-DAC'08).
The topics of IWCM are:
- Compact modeling for all kinds of devices
- Parameter extraction methodology and strategy
- Circuit simulation techniques
Abstracts should be submitted by November 2007.
The invited speakers will be: W. Fichtner (
Monday, November 5, 2007
| San Jose, CA and Feldkirchen, Germany -- Cadence Design Systems, GmbH announced the formation of an academic network in Europe to promote the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence. This initiative will establish a knowledge network among selected European universities, research institutes, industry advisors and Cadence to facilitate the sharing of technology expertise in the areas of verification, design and implementation of microelectronic circuits. |
Universities were selected with particular strengths and competencies in mind-- such as analog mixed-signal, radio frequency (RF), and low power design, all of which have been identified as key challenges for the coming years by the electronics industry. Under the initiative, Cadence will provide software, training and design methodology instruction to each of the institutions. Trained on the latest techniques with leading-edge software, the universities will then share their knowledge with other academic and research institutions. Students from these universities will graduate with an in-depth knowledge of how to tackle the pressing design issues that the industry is facing, learned on the most advanced design automation products available today.
So far three universities have joined the network in lead roles: The University of Heidelberg will lead high-level verification methodology; the Technical University of Ilmenau will concentrate on RF design methodology; and the Albert-Ludwigs-University of Freiburg will be the lead university for analog mixed-signal methodology. Planning to join the initiative shortly are the Polytechnic University of Bucharest, Romania, the University of Bristol, UK, and the University of Pavia in Italy.
"Our high standards in teaching and research have led Cadence to select us to be the lead university for analog mixed-signal methodology," said Prof. Dr.-Ing. Yiannos Manoli, head of the Microelectronics Group at IMTEK, University of Freiburg and Director of HSG-IMIT. "The increasing demand for highly skilled graduates in microelectronic design requires a solid and broad theoretical knowledge combined with a practical skill set in state-of-the-art techniques. Being part of this network will enable us to instruct our students using leading-edge technology."
Sean Redmond, vice president, EMEA for Cadence, said: "With the increase in development of complex industrial electronic systems, our customers are finding that they need engineers with broad technology competence. This network provides an exchange platform for the industry, academia and Cadence to stimulate the use of leading-edge technology at these universities. We are enthusiastic about this initiative and believe that the broad portfolio of Cadence solutions provides a perfect instrument to transfer up-to-date design methodology."
Saturday, November 3, 2007
|Compact Model Engineer - Device Physics, C, Matlab, Compact Modeling|
|Category : Software, Hardware/ EDP|
|Role : Hardware Design Engineer|
|Openings (15) Expires on : 30th Nov 2007|
|Note: denote mandatory requirements|