Thursday, March 25, 2010

IPL group releases PDK standard

What's next? Under this framework, OpenPDK will base its PDK technology on the OpenAcess database. It will also use several of the components developed by IPL: OA schematic symbols, component description format (CDF) and callbacks. For its part, Si2 will attempt to get the industry to develop standards around several other components: Spice models, tech files and DRC/LVS/LPE. [more]

Monday, March 22, 2010

Design, Test, Integration & Packaging of MEMS/MOEMS

DTIP 2010, 5-7 May 2010 , Seville, Spain
DTIP 2010 will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland in 2006, in 2007 in Stresa, Italy, in 2008 in Nice, France and in 2009 in Rome, Italy. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and CMP.

Download the call for participation.

Sunday, March 21, 2010

Friday, March 19, 2010

Big Success in Dresden for new DATE 2010

The conference again proved its World-Wide leadership with attendees from 39 Countries. Germany accounts for a fourth of the attendees, followed by USA and France. China showed a substantial increase and was already number 4 of the participating countries. The number of attendees (1,300) again reached the very high level of the previous years [more].

The proceedings of DATE10 are now available on-line.

Wednesday, March 17, 2010

[mos-ak] Final Program MOS-AK/GSA Workshop in Rome

Please visit the MOS-AK/Rome Workshop web site: with final workshop program

April 8-9, 2010 Sapienza Università di Roma

* Free On-line Registration Form:

* Venue and Recommended Hotels:

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Monday, March 15, 2010

Angelov FET Model Documents at Uni.Chalmers

New web page with collection of some documents, files and papers on Angelov's FET Large Signal Nonlinear Transistor Mode [link]

Friday, March 5, 2010

Top 10 cited papers in Solid-State Electronics

I wish to congratulate some friends, because their papers are ranked 4th and 5th in the top 10 cited papers published in Solid-State Electronics... and these are also the first papers in the list about compact modelling...
Many congratulations Adelmo, Francisco, Jean-Michel and Christian !

By the way, the papers are:

Rigorous analytic solution for the drain current of undoped symmetric dual-gate MOSFETs

Volume 49, Issue 4, 2005, Pp 640-647
Ortiz-Conde, A. | Sánchez, F.J.G. | Muci, J.

A design oriented charge-based current model for symmetric DG MOSFET and its correlation with the EKV formalism
Volume 49, Issue 3, 2005, Pp 485-489
Sallese, J.-M. | Krummenacher, F. | Prégaldiny, F. | Lallement, C. | Roy, A. | Enz, C.

Tuesday, March 2, 2010

Compact TFT Modelling Workshop (C-TFT)

The Third International Workshop on Compact Thin-Film Transistor Modelling (C-TFT) will be held in Tarragona, Spain, on July 2 2010.

This workshop will provide a forum for discussions and current practices on compact TFT modeling. The workshop is sponsored by the Universitat Rovira i Virgili in collaboration with the IEEE EDS Compact Modeling Technical Committee and the University College London .

A partial list of the areas of interest includes:

- Physics of TFTs and operating principles
- Compact TFT device models for circuit simulation
- Model implementation and circuit analysis techniques
- Model parameter extraction techniques
- Applications of compact TFT models in emerging products
- Compact models for interconnects in active matrix flat panels
Other details:
Prospective authors are invited to submit an abstract of up to 500-word to:

Important dates:

- Deadline for abstract submission: May 7, 2010
- Notification of acceptance: May 21, 2010
- Camera-ready version: Jun 18, 2010

Technical comitee members:

General chair person: Prof. Benjamin Iniguez, University Rovira i Virgili, Spain

Rodrigo Picos, Universitat de les Illes Balears, Spain
Bill Milne, Cambridge University, UK
Maria Merlyne De Souza, Sheffield University, UK
Arokia Nathan, University College London, UK
Norbert Fruehauf, University of Stuttgart, Germany
Samar Saha, Silterra Corp., USA
Jamal Deen, McMaster University, Canada
Magali Estrada, CINVESTAV, Mexico
James B. Kuo, National Taiwan University, Taiwan
Hyun Jae Kim, Yonsei University, Korea
Zhou Xing, Nanyang Technological University, Singapore

Local Committee Members:

Benjamin Iniguez, Universitat Rovira i Virgili, Spain
Lluis F. Marsal, Universitat Rovira i Virgili, Spain
Josep Pallares, Universitat Rovira i Virgili, Spain
Josep Ferre, Universitat Rovira i Virgili, Spain
Roger Cabre, Universitat Rovira i Virgili, Spain
Pilar Formentin, Universitat Rovira i Virgili, Spain
Francois Lime, Universitat Rovira i Virgili, Spain
Bogdan Nae, Universitat Rovira i Virgili, Spain

Directions and maps:

University of Rovira i Virgili Campus Map

Tarragona is well connected with the spanish airports of Madrid, Barcelona or Reus by means of trains or buses.

For train tickets, please visit the national railroad company, RENFE. For bus information, please visit La Hispano Igualadina company.

About Tarragona:
Tarragona is located in the south of Catalonia, in the northeast corner of the Iberian Peninsula. Tarraco (the Roman name for Tarragona) was one of the most important cities in the Roman Empire. On 30 November 2000, the UNESCO committee officially declared the Roman archaeological complex of Tarraco a World Heritage Site. This recognition is intended to help ensure the conservation of the monuments, as well as to introduce them to the broader international public.