Sunday, December 30, 2018

(stream now) Crowdfunding, #FOSDEM, cases, contributions and self-assembly https://t.co/WuZj64zQ92 #opensource


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December 30, 2018 at 08:03PM
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Friday, December 21, 2018

[mos-ak] [press note] 11th International MOS-AK Workshop, Silicon Valley, December 5, 2018

Modeling of Systems and Parameter Extraction Working Group
11th International MOS-AK Workshop
Silvaco Inc. Headquarters, Silicon Valley, December 5, 2018
Summary

The MOS-AK Compact Modeling Association, a global standardization forum for semiconductor device models, held its 11th MOS-AK Workshop at the Silvaco Inc. headquarters in Santa Clara, Calif. on December 5, 2018. The event was co-located with the 2018 IEEE International Electron Devices (IEDM) and the Q4 Compact Modeling Coalition (CMC) meetings. The workshop receives technical program co-sponsorship from the IEEE Santa Clara Valley-San Francisco Chapter of the Electron Devices Society, Europractice, IJHSES as well as NEEDS of nanoHUB.org.

Bogdan Tudor, Silvaco Inc. and Wladek Grabinski, MOS-AK, welcomed more than 30 international academic researchers and modeling engineers. The nine technical compact modeling presentations covered nanoscale technologies, semiconductor devices modeling and advanced IC design.

The MOS-AK speakers shared their latest perspectives on compact/SPICE modeling and Verilog-A standardization in response to the dynamically evolving semiconductor industry and academic R&D efforts. The event featured advanced technical presentations covering compact model development, implementation, and deployment. For more information about each of the presentations, including full abstracts, go online to MOS-AK Workshop Silicon Valley 2018.

The nine topics presented were the following:
  1. Silvaco GaN HEMT Compact Modeling Perspective, Bogdan Tudor, Colin Shaw and Sungwon Kong, Silvaco, Inc.
  2. GaN HEMT Devices and Modeling for Operational Electronics at Harsh Environments, Saleh Kargarrazi, XLab, Stanford University
  3. Impact of Basal Plane Dislocations and Ruggedness of 10 kV 4H-SiC Transistors, Victor Veliadis, PowerAmerica, North Carolina State University
  4. Direct measurement of white noise in MOSFETs, Kenji Ohmori, Device Lab Inc.
  5. NEREID Technology Roadmap, Enrico Sangiorgi, NEREID, University of Bologna
  6. A Physics-Based Compact Model of RRAM for Emerging Applications, Paolo Pavan, University of Modena and Reggio Emilia
  7. From Physics to Power, Performance, and Parasitics, Oskar Baumgartner, Global TCAD Solutions GmbH
  8. MOS-AK FOSS Compact Modeling Perspective, Wladek Grabinski, IEEE EDS DL, MOS-AK
  9. Compact Model of Single TeraFET Spectrometer, Michael Shur, Rensselaer Polytechnic Institute
There were also presentations of Late News with the following topics:
  1. CMC Developer Model Software Licenses, Peter Lee, Micron
  2. Xyce Parallel Electronic Simulator (Ver. 6.10), Jason Verley, Sandia National Laboratories
  3. Call for Papers for ESSDERC/ESSCIRC 2019 in Krakow, Wladek Grabinski, MOS-AK
Photo: Some of the participants of the 11th MOS-AK Workshop at Silvaco Inc. Headquarters in Silicon Valley.

The MOS-AK Association plans to continue its standardization efforts by organizing future compact modeling meetings, workshops and courses in India, China, Europe, USA and, for the very first time, in Latin America, throughout the coming year, including:
About Silvaco:
Silvaco, Inc. is a leading EDA tools and semiconductor IP provider used for process and device development for advanced semiconductors, power IC, display and memory design. For over 30 years, Silvaco has enabled its customers to develop next generation semiconductor products in the shortest time with reduced cost. We are a technology company outpacing the EDA industry by delivering innovative smart silicon solutions to meet the world's ever-growing demand for mobile intelligent computing. The company is headquartered in Santa Clara, California and has a global presence with offices located in North America, Europe, Japan and Asia.

About Europractice IC Service:
The EUROPRACTICE IC Service brings ASIC design and manufacturing capability within the technical and financial reach of any company that wishes to use ASICs. The EUROPRACTICE IC Service, offered by IMEC and Fraunhofer, offers low-cost ASIC prototyping and ASIC small volume production ramp-up to high volume production through Multi Project Wafer - MPW - and dedicated wafer runs.

About MOS-AK Association:
MOS-AK is an international compact modeling association primarily focused in Europe, to enable international compact modeling R&D exchange in the North/Latin Americas, EMEA and Asia/Pacific Regions. The MOS-AK Modeling Working Group plays a central role in developing a common information exchange system among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact/SPICE modeling and its Verilog-A standardization and related CAD/EDA tools including FOSS for compact/SPICE model development, validation/implementation and distribution. For more information please visit mos-ak.org

Thursday, December 20, 2018

[C4P] EuroSOI-ULIS April 1-3, 2019, Grenoble (F)

5th Joint International EUROSOI and ULIS Conference
at Minatec, Grenoble (F) 
on April 1-3, 2019

The Conference Committee hopes that you will actively participate by submitting high quality papers and will enjoy the conference. The Conference Technical Digest will be published by IEEE and will be available online through IEEE Xplore. The abstract submission deadline is January 15, 2019.

Invited Speakers:
  • Dr. Ionut RADU, SOITEC : "SOI technology: from niche to mainstream applications"
  • Dr. Anabela VELOSO, IMEC: "Nanowire for ultra-scaled, high-density logic and memory applications"
  • Dr. Marc GAILLARDIN, CEA: "Radiation effects in innovative devices"
  • Prof. Ru HUANG, Peking University: "Steep slope devices"
More information are provided in the attached 2nd C4P and on the Conference website

DEVSIM 1.0.0 Release #Opensource, #DEVSIM uses finite volume methods to predict behavior of semiconductor devices. In addition to drift-diffusion equations, the density-gradient method can be used to account for quantum effects near boundaries. https://t.co/q4fiJ9IMWK


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December 20, 2018 at 10:49AM
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Wednesday, December 19, 2018

Compact Transistor Modeling with Radiation Effects

A Radiation-Hardened Instrumentation Amplifier for Sensor Readout Integrated Circuits in Nuclear Fusion Applications

Kyungsoo Jeong 1, Duckhoon Ro 1, Gwanho Lee 2  Myounggon Kang 2* and Hyung-Min Lee 1*

1 School of Electrical Engineering, Korea University, Seoul 02841, Korea; jksoo2002@korea.ac.kr (K.J.); roduckhoon@korea.ac.kr (D.R.)
2 Department of Electronics Engineering, Korea National University of Transportation, Chungju 27469, Korea; ghlee@ut.ac.kr

* Correspondence: mgkang@ut.ac.kr (M.K.); hyungmin@korea.ac.kr (H.-M.L.); Tel.: +82-43-841-5164 (M.K.); +82-2-3290-3219 (H.-M.L.)

Abstract: A nuclear fusion reactor requires a radiation-hardened sensor readout integrated circuit (IC), whose operation should be tolerant against harsh radiation effects up to MGy or higher. This paper proposes radiation-hardening circuit design techniques for an instrumentation amplifier (IA), which is one of the most sensitive circuits in the sensor readout IC. The paper studied design considerations for choosing the IA topology for radiation environments and proposes a radiation-hardened IA structure with total-ionizing-dose (TID) effect monitoring and adaptive reference control functions. The radiation-hardened performance of the proposed IA was verified through model-based circuit simulations by using compact transistor models that reflected the TID effects into complementary metal–oxide–semiconductor (CMOS) parameters. The proposed IA was designed with the 65 nm standard CMOS process and provides adjustable voltage gain between 3 and 15, bandwidth up to 400 kHz, and power consumption of 34.6 µW, while maintaining a stable performance over TID effects up to 1 MGy.

Electronics 2018, 7, 429; doi:10.3390/electronics7120429
Received: 22 November 2018; Accepted: 9 December 2018; Published: 12 December 2018

Why #NASA #opensource the #Rover https://t.co/BtUmzR7hzr


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December 19, 2018 at 07:41AM
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Tuesday, December 18, 2018

ESSDERC/ESSCIRC 2019 Conference Kraków, POLAND - 1st Call for Papers

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ESSDERC/ESSCIRC annual Conference is the most important European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
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ESSCIRC tracks:
Analog
Data Converters
RF and mm-Wave
Frequency Generation
Wireless and Wireline Systems
Sensors, Imager and Biomedical
Digital, Security and Memory
Power Management
ESSDERC tracks:
CMOS Devices and Technology
Opto-, Power and Microwave Devices
Physical Modeling of Materials and Devices
Compact Modeling of Devices and Circuits
Memory Devices and Technology
Emerging non-CMOS Devices and Technologies
Sensor Devices and Technology
 
Post-conference publications
All accepted ESSDERC and ESSCIRC papers will be included in the conference proceedings and posted on IEEE Xplore after the conference.
Co-publication of qualified papers in SSC-L
Upon acceptance, outstanding ESSCIRC papers will be invited to submit to a Special Issue of IEEE Solid-State Circuit Letters (SSC-L, 4 pages format) on the ESSCIRC, subject to additional editorial and quality reviews. Publication on IEEE Xplore of the SSC-L Special Issue is timed to be September 1, 2019
Special JSSC issue
Authors of outstanding papers will be invited to submit their work to a Special Issue of IEEE Journal of Solid-State Circuits (JSSC, up to 10-12 pages format) on the ESSCIRC to appear in July 2020, with an opportunity to provide additional material, such as mathematical analysis, in-depth circuit description, more experimental results and benchmarking data.
Special J-EDS issue
Authors of selected outstanding ESSDERC papers will be invited to submit their work to the special issue of IEEE Journal of the Electron Devices Society. The authors will be asked to revise the conference version of the paper by adding at least 30% new material. All manuscripts will undergo additional editorial and quality review process.
 
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Technical Co-Sponsorship

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ESSDERC Financial Sponsor

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ESSCIRC Financial Sponsor

 
ORGANIZERS
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DIAMOND SPONSOR
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CALL FOR PAPERS



All submissions must be received by 8th April 2019


PAPER SUBMISSION


Manuscript guidelines as well as instructions on how to submit electronically will be soon available on the Conference website. Papers must not exceed four A4 pages with all illustrations and references included.

Papers submitted for review must clearly state:

    - the purpose of the work
    - how and to what extent it advances the state-of-the art
    - specific results and their impact


After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by 31th May 2019.


At the same time, the complete program will be published on the Conference website. An oral presentation will be given at the Conference for each accepted paper. No-shows will result in the exclusion of the papers from any conference related publication.

The submitted final PDF files should be IEEE Xplore compliant.


For each paper independently, at least one co-author is required to register for the Conference (one registration-one paper policy).


ESSDERC
49th European Solid-State Device Research Conference

ESSCIRC 45th European Solid-State Circuits Conference

September 23-26, 2019
Kraków, POLAND


https://esscirc-essderc2019.org

LOCAL SCIENTIFIC SECRETARIAT


Krzysztof Kasinski (AGH UST, PL)
krzysztof.kasinski@agh.edu.pl
Robert Szczygiel (AGH UST, PL)
robert.szczygiel@agh.edu.pl


ESSDERC
/ESSCIRC 2019
ORGANIZING SECRETARIAT


Foundation for AGH
University of Science and Technology

www.fundacja.agh.edu.pl
e-mail
: kf@agh.edu.pl
Anna Inglot – Conference Manager
phone: +48 504 004 517

 
Regarding the GDPR policy we need to inform you about the registration and mailing receiving procedure during the ESSDERC/ESSCIRC Conference 2019. Data protection Act. We are confident you will appreciate our effort to share the principles which inspire our data management policy and allow Foundation for AGH UST in Cracow:
AUTHORIZATION OF DATA MANAGEMENT FOR COMMUNICATION PURPOSES to include you in mailing lists finalized to communicate future events, in the same field of the event you are registering for.

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Monday, December 17, 2018

Friday, December 14, 2018

#FOSDEM 2019 - CAD and Open Hardware devroom with #GnuCap and #ngspice presentations https://t.co/SKNe2toLrP #opensource https://t.co/3jAKTwYk2S


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December 14, 2018 at 03:36PM
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Thursday, December 13, 2018

IEEE Cledo Brunetti Award 2018 presented to Prof.Dr. Siegfried Selberherr


One of the founders of modern Technology Computer Aided Design (TCAD), Siegfried Selberherr has provided modeling and software development tools invaluable to the continued miniaturization of semiconductor devices. TCAD involves the use of computer simulation to develop and optimize semiconductor processing technologies. Selberherr developed MINIMOS for two-dimensional predictive simulation of the electrical characteristics of miniaturized devices to understand and control the short-channel effects and doping profiles encountered as device sizes shrink. MINIMOS was later enhanced for three-dimensional simulation to address energy transport and interface physics. He also created the ZOMBIE and PROMIS simulators, which incorporated mesh generation and programming interfaces. Selberherr then developed the Vienna Integrated System for TCAD Applications (VISTA) to combine both process and device simulation tools in a common framework. An IEEE Fellow, Selberherr is a professor with the Institute for Microelectronics at the Technische Universität Wien, Vienna, Austria.