Monday, December 17, 2018

Friday, December 14, 2018

Thursday, December 13, 2018

IEEE Cledo Brunetti Award 2018 presented to Prof.Dr. Siegfried Selberherr

One of the founders of modern Technology Computer Aided Design (TCAD), Siegfried Selberherr has provided modeling and software development tools invaluable to the continued miniaturization of semiconductor devices. TCAD involves the use of computer simulation to develop and optimize semiconductor processing technologies. Selberherr developed MINIMOS for two-dimensional predictive simulation of the electrical characteristics of miniaturized devices to understand and control the short-channel effects and doping profiles encountered as device sizes shrink. MINIMOS was later enhanced for three-dimensional simulation to address energy transport and interface physics. He also created the ZOMBIE and PROMIS simulators, which incorporated mesh generation and programming interfaces. Selberherr then developed the Vienna Integrated System for TCAD Applications (VISTA) to combine both process and device simulation tools in a common framework. An IEEE Fellow, Selberherr is a professor with the Institute for Microelectronics at the Technische Universität Wien, Vienna, Austria.

Wednesday, December 12, 2018

Determination of full S-parameters of a low-loss two-port device from uncalibrated measurements #paper

from Twitter

December 12, 2018 at 06:20PM

What is #OpenSource & Why Should You Care?

from Twitter

December 12, 2018 at 10:56AM

Monday, December 10, 2018

[C4P] ESSDERC / ESSCIRC September 23-26, 2019 Kraków, POLAND

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September 23-26, 2019
Kraków, POLAND
ESSDERC/ESSCIRC annual Conference is the most important European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
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ESSCIRC tracks:
Data Converters
RF and mm-Wave
Frequency Generation
Wireless and Wireline Systems
Sensors, Imager and Biomedical
Digital, Security and Memory
Power Management
ESSDERC tracks:
CMOS Devices and Technology
Opto-, Power and Microwave Devices
Physical Modeling of Materials and Devices
Compact Modeling of Devices and Circuits
Memory Devices and Technology
Emerging non-CMOS Devices and Technologies
Sensor Devices and Technology
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Technical Co-Sponsorship

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ESSDERC Financial Sponsor

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ESSCIRC Financial Sponsor

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All submissions must be received by
8th April 2019


Manuscript guidelines as well as instructions on how to submit electronically will be soon available on the Conference website. Papers must not exceed four A4 pages with all illustrations and references included.

Papers submitted for review must clearly state:

    - the purpose of the work
    - how and to what extent it advances the state-of-the art
    - specific results and their impact

After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by 
31th May 2019.

At the same time, the complete program will be published on the Conference website. An oral presentation will be given at the Conference for each accepted paper. No-shows will result in the exclusion of the papers from any conference related publication.

The submitted final PDF files should be IEEE Xplore compliant.

For each paper independently, at least one co-author is required to register for the Conference (one registration-one paper policy).

 49th European Solid-State Device Research Conference

ESSCIRC 45th European Solid-State Circuits Conference
September 23-26, 2019Kraków, POLAND


Krzysztof Kasinski (AGH UST, PL)
Robert Szczygiel (AGH UST, PL)


Foundation for AGH
University of Science and Technology
Anna Inglot – Conference Manager
phone: +48 504 004 517
Copyright 2018 Foundation for AGH UST in Cracow. All rights reserved.
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Sunday, December 9, 2018

New Czech law makes ICT #neutrality a #right #paper

from Twitter

December 09, 2018 at 12:40PM