Software #model multi-level #photonic #IC designs https://t.co/24rtqqVTBH

Software #model multi-level #photonic #IC designs https://t.co/24rtqqVTBH

— Wladek Grabinski (@wladek60) October 14, 2017

from Twitter https://twitter.com/wladek60

October 15, 2017 at 01:05AM
via IFTTT

5 #benefits of contributing to #opensource projects https://t.co/qKsBgkR9Uh

5 #benefits of contributing to #opensource projects https://t.co/qKsBgkR9Uh

— Wladek Grabinski (@wladek60) October 12, 2017

from Twitter https://twitter.com/wladek60

October 12, 2017 at 09:30AM
via IFTTT

Intern/Student in SW Eng. for Power Management f/m

Job Description: You will be responsible for developing a SW tool enabling an user friendly and efficient framework to program system-on-chip. The flexibility of our power management solution thanks to enhanced customization is indeed a critical asset requiring a reliable tool from programming definition to release. You will be part of an enthusiastic and international system engineering team located in Munich and will get in touch locally with several design and validation teams [read more...]

Your main tasks in this full time position min 5 months up to 12 months will be to:

• Create several functions/add-ons enhancing entry interface
• Develop a compiler to better explore new chip architectures-Integrate compiler output with existing tools
• Implement sanity checkers detecting
• Develop test scenarios and requirements for chip validation
• Contribute to the reporting and documentation for other teams and management

[read more...]

#Linux Now Has its First #OpenSource #RISC-V Processor https://t.co/cdM2NNXBoE

#Linux Now Has its First #OpenSource #RISC-V Processor https://t.co/cdM2NNXBoE

— Wladek Grabinski (@wladek60) October 7, 2017

from Twitter https://twitter.com/wladek60

October 07, 2017 at 11:33PM
via IFTTT

#Apple #Opensource-d the #iOS Kernel for #ARM CPUs https://t.co/LUUYUnRSm2 https://t.co/91YMe1jKV1

#Apple #Opensource-d the #iOS Kernel for #ARM CPUs https://t.co/LUUYUnRSm2 http://pic.twitter.com/91YMe1jKV1

— Wladek Grabinski (@wladek60) October 5, 2017

from Twitter https://twitter.com/wladek60

October 05, 2017 at 12:06PM
via IFTTT

[paper] A Novel Reconfigurable sub-0.25V Digital Logic Family Using the Electron-Hole Bilayer TFET

Cem Alper, Jose Luis Padilla, Pierpaolo Palestri, Senior Member, IEEE

and Adrian M. Ionescu, Fellow, IEEE

IEEE Journal of the Electron Devices Society

doi: 10.1109/JEDS.2017.2758018

Abstract: We propose and validate a novel design methodology for logic circuits that exploits the conduction mechanism and the presence of two independently biased gates (”n-gate” and ”p-gate”) of the electron-hole bilayer TFET (EHBTFET). If the device is designed to conduct only under certain conditions e.g. when Vn-gate = VDD and Vp-gate = 0, it then shows an ’XOR-like’ behavior that allows the implementation of certain logic gates with a smaller number of transistors compared to conventional CMOS static logic. This simplifies the design and possibly results in faster operation due to lower node capacitances. We demonstrate the feasibility of the proposed EHBTFET logic for low supply voltage operation using mixed device/circuit simulations including quantum corrections [read more...]

FIG: Sketch of the hetero-gate InGaAs EHBTFET and its circuit symbol.

[mos-ak] [press note] 15th MOS-AK Workshop at ESSDERC/ESSCIRC September 11, 2017 Leuven

Arbeitskreis Modellierung von Systemen und Parameterextraktion

Modeling of Systems and Parameter Extraction Working Group

15th MOS-AK Workshop at ESSDERC/ESSCIRC

September 11, 2017 Leuven

 The MOS-AK Compact Modeling Association, a global compact/SPICE modeling and Verilog-A standardization forum, held its 15th consecutive workshop as an integral engineering event at the ESSDERC/ESSCIRC on September 11, 2017 in Leuven (B). The event was coorganized by Jean-Michel Sallese, EPFL and Daniel Tomaszewski ITE (PL); its technical program was coordinated by Larry Nagel, OEC (USA) and Andrei Vladimirescu, UCB (USA); ISEP (FR) representing the International MOS-AK Board of R&D Advisers. Technical MOS-AK program promotion was provided by the Eurotraining and NEEDS of nanoHUB.org

A group of the international academic researchers and modeling engineers attended 13 technical compact modeling presentations covering full development chain form the nanoscaled technologies thru semiconductor devices modeling to advanced IC design support. The MOS-AK speakers have shared their latest perspectives on compact/SPICE modeling and Verilog-A standardization in the dynamically evolving semiconductor industry and academic R&D. The event featured advanced technical presentations covering compact model development, implementation, deployment and standardization covering full engineering R&D chain: TCAD/processing, device modeling, transistor level IC design support. These contributions were delivered by leading academic and industrial experts [1-12]. The presentations are available online for download at <http://www.mos-ak.org/leuven_2017/>. Selected best presentation will be recommended for further publication in the IJHSES.

The ESSDERC Track4 Devices and Circuit Compact Modeling has followed the MOS-AK workshop. The Track4 has been organized for very first time to highlight importance of the international compact/SPICE modeling R&D and foster its Verilog-A standardization. The ESSDERC Conference participants have attended four subsequent modeling sessions: Cross-Domain Compact Modeling [13-15]; Parameter Extraction [16-19]; Modeling of Emerging Devices [20-23]; Traps and Noise [24-28]. All the conference papers are available at IEEE Xplore and selected best papers will be recommended for further publication in J-EDS.

The MOS-AK Modeling Working Group has various deliverable and initiatives including a book entitled "Open Source TCAD/EDA Tools for Compact Modeling" and an open Verilog-A directory with models and supporting CAD/EDA software. The MOS-AK Association plans to continue its standardization efforts by organizing additional compact modeling meetings, workshops and courses in Europe, USA, India and China throughout 2017/2018 including:

• 10th International MOS-AK Workshop in Silicon Valley (US) Dec. 2017
  
• Spring MOS-AK Workshop in Strasbourg (F) March 2018
  
• 3rd Sino MOS-AK Workshop in Beijing (CN) June, 2018
  
• 16th MOS-AK ESSDERC/ESSCIRC Workshop in Dresden (D) Sept, 2018

About MOS-AK Association:

MOS-AK, an international compact modeling association primarily focused in Europe, to enable international compact modeling R&D exchange in the North/Latin Americas, EMEA and Asia/Pacific Regions. The MOS-AK Modeling Working Group plays a central role in developing a common language among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact/SPICE modeling and its Verilog-A standardization and related CAD/EDA tools for the compact models development, validation/implementation and distribution. For more information please visit: mos-ak.org

REFERENCES:

MOS-AK/Leuven 2017 Workshop; Sept. 11, 2017

[1] ASCENT: Access to Leading European Nanoelectronics Technology

Jim Greer Tyndall (IRL)

[2] Junctionless Nanowire Transistors Performance: Static and Dynamic Modeling

Marcelo Antonio Pavanello Centro Universitario FEI (BR)

[3] Modeling and Analysis of Full-Chip Parasitic Substrate Currents

Renaud Gillon and Wim Schoenmaker ONSEMI (B), MAGWEL (B)

[4] Small- and large-signal RF modeling of silicon-based substrates

Martin Rack and Jean-Pierre Raskin Université catholique de Louvain (B)

[5] Tunnel FET C-V modeling: Impact of TFET C-V characteristics on inverter circuit performance

Chika Tanaka, Tetsufumi Tanamoto, and Masato Koyama, Toshiba (J)

[6] ASCENT Open Access to 14nm PDKs

T. Chiarella, N. Cordero, O. Faynot, Tyndall (IRL)

[7] Modelling of Surface Traps Effect on Semiconductor Nanowires

Ashkhen Yesayan*, Stepan Petrosyan*, Jean-Michel Sallese** *IRa, Armenia, **EPFL (CH)

[8] Measurement and modelling of specific behaviors in 28nm FD SOI UTBB MOSFETs of importance for analog / RF amplifiers

D. Flandre, V. Kilchytska, B. Kazemi, C. Gimeno and J.-P. Raskin UC Louvain

[9] IEEE EDS Compact Model Standardization

Benjamin Iniguez URV (SP)

[10] Is it possible to reduce the PDK development cost when demand for data is continuously increasing?

Andrej Rumiantsev MPI Corporation

[11] Optimal measurement parameters for accurate time-domain and spectral analyses of RTN

Léopold Van Brandt*, Valeriya Kilchytska*, Jean-Pierre Raskin*, Bertrand Parvais** and Denis Flandre*  *ELEN department, ICTEAM Institute, Université catholique de Louvain **imec

[12] Compact modeling for CMOS technology development and IC design

Daniel Tomaszewski ITE Warszaw (PL)

ESSDERC Trac4: Compact Modeling; Tuesday September 12, 2017 (11:00-12:20)

Cross-Domain Compact Modeling 

Chair: Wladek Grabinski - MOS-AK; Cristell Maneux – LIMS;

[13] INVITED: SPICE Modeling in Verilog-a: Successes and Challenges

Colin McAndrew

[14] SPICE Modeling of Light Induced Current in Silicon with 'generalized' Lumped Devices

Chiara Rossi, Pietro Buccella, Camillo Stefanucci, Jean-Michel Sallese

[15] Total Ionizing Dose Effects on Analog Performance of 28 nm Bulk MOSFETs

Chun-Min Zhang, Farzan Jazaeri, Alessandro Pezzotta, Claudio Bruschini, Gulio Borghello, Serena Mattiazzo

ESSDERC Trac4: Compact Modeling; Tuesday September 12, 2017 (14:00-15:20)

Parameter Extraction 

Chair: Thierry Poiroux - CEA; Marco Bellini – ABB;

[16] Nanometer CMOS Characterization and Compact Modeling at Deep-Cryogenic Temperatures

Rosario Marco Incandela, Lin Song, Harald Homulle, Fabio Sebastiano, Edoardo Charbon, Andrei Vladimirescu

[17] Cryogenic Characterization of 28 nm Bulk CMOS Technology for Quantum Computing

Arnout Beckers, Farzan Jazaeri, Andrea Ruffino, Claudio Bruschini, Andrea Baschirotto, Christian Enz

[18] A New Method for Junctionless Transistors Parameters Extraction

Renan Trevisoli, Rodrigo Doria, Michelly de Souza, Sylvain Barraud, Marcelo Pavanello

[19] Avalanche Compact Model Featuring SiGe HBTs Characteristics Up to BVCBO

Mathieu Jaoul, Didier Céli, Cristell Maneux, Michael Schröter, Andreas Pawlak

ESSDERC Trac4: Compact Modeling; Tuesday September 12, 2017 (16:40-18:00)

Modeling of Emerging Devices 

Chair: Jean-Michel Sallese - EPFL; Daniel Tomaszewski - ITE;

[20] Equivalent Circuit Model for the Electron Transport in 2D Resistive Switching Material Systems

Enrique Miranda, Chengbin Pan, Marco Villena, Na Xiao, Jordi Suñe, Mario Lanza

[21] Analytical Drain Current Model for Schottky-Barrier CNTFETs

Igor Bejenari, Michael Schroter, Martin Claus

[22] A General Circuit Model for Spintronic Devices Under Electric and Magnetic Fields

Meshal Alawein, Hossein Fariborzi

[23] Compact Physical Model of a-IGZO TFTs for Circuit Simulation

Matteo Ghittorelli, Fabrizio Torricelli, Carmine Garripoli, Jan-Laurens van der Steen, Gerwin Gelinck, Sahel Abdinia

ESSDERC Trac4: Compact Modeling; Wednesday September 13, 2017 (14:20-15:40)

Traps and Noise 

Chair: Benjamin Iniguez - URV; Sadayuki Yoshitomi - Toshiba;

[24] Modeling of Dynamic Trap Density Increase for Aging Simulation of Any MOSFET Circuits Mitiko Miura-Mattausch, Hidenori Miyamoto, Hideyuki Kikuchihara, Dondee Navarro, Tapas K. Maiti, Nezam Rohbani

[25] Comprehensive Compact Electro-Thermal GaN HEMT Model

Muhammad Alshahed, Mina Dakran, Lars Heuken, Mohammed Alomari, Joachim Burghartz

[27] Trap-Assisted Carrier Transport Through the Multi-Stack Gate Dielectrics of HKMG nMOS Transistors: a Compact Model

Apoorva Ojha, Nihar Ranjan Mohapatra

[28] A New Verilog-a Compact Model of Random Telegraph Noise in Oxide-Based RRAM for Advanced Circuit Design

Francesco Maria Puglisi, Nicolò Zagni, Luca Larcher, Paolo Pavan

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