Friday, 21 October 2016

#Compact #Modeling of Surface Potential, Charge, and Current in Nanoscale Transistors Under Quasi-Ballistic Regime

from Twitter

October 21, 2016 at 04:54PM

Thursday, 20 October 2016

Free Semiconductor Books on SemiWiki

Download free PDF versions of three pivotal semiconductor books available on
  1. Mobile Unleashed: The History of ARM
  2. Fabless: The Transformation of the Semiconductor Industry
  3. EDAGraffiti: 25 years of experience in EDA
Only registered SemiWiki members can access these wiki pages so if you are not already a member please join as a guest:

Wednesday, 19 October 2016

[mos-ak] [2nd Announcement and Call for Papers] 9th International MOS-AK Workshop Berkeley DEC.7, 2016

 9th International MOS-AK Workshop  
  Berkeley December 7, 2016 
    2nd Announcement and Call for Papers   

Together with the MOS-AK workshop host, Prof. Jaijeet Roychowdhury, UCB and International MOS-AK Board of R&D Advisers: Larry Nagel, Omega Enterprises Consulting (USA), Andrei Vladimirescu, UCB (USA); ISEP (FR) as well as all the Extended MOS-AK TPC Committee, we have pleasure to invite to the 9th International MOS-AK Workshop which will be held at EECS Department, University of California, Berkeley on December, 7, 2016. Planned MOS-AK workshop is organized with aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors.

Important Dates:
  • Preannouncement - Sept 2016
  • Call for Papers - Oct. 2016
  • Final Workshop Program - Nov. 2016
  • MOS-AK Workshop - Dec. 7 2016
EECS Department
University of California, Berkeley

Topics to be covered include the following among other related to the compact/SPICE modeling :
  • Compact Modeling (CM) of the electron devices
  • Advances in semiconductor technologies and processing
  • Verilog-A language for CM standardization
  • New CM techniques and extraction software
  • Open Source TCAD/EDA modeling and simulation
  • CM of passive, active, sensors and actuators
  • Emerging Devices, TFT, CMOS and SOI-based memory cells
  • Microwave, RF device modeling, high voltage device modeling
  • Nanoscale CMOS devices and circuits
  • Technology R&D, DFY, DFT and reliability/ageing IC Designs
  • Foundry/Fabless Interface Strategies
Online MOS-AK Abstract Submission:
Prospective authors should submit online 
(any related inquiries can be sent to

Online Workshop Registration:
(any related inquiries can be sent to

Postworkshop Publications:
Selected best MOS-AK technical presentation will be recommended for further publication in a special issue of the International Journal of High Speed Electronics and Systems

Extended MOS-AK Committee

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Monday, 17 October 2016

Reliable Gate Stack And Substrate Parameter Extraction Based On CV Measurements For 14nm FDSOI Technology #papers

from Twitter

October 17, 2016 at 02:19PM

Saturday, 15 October 2016

Theoretical analysis and modeling for nanoelectronics #papers #feedly

from Twitter

October 15, 2016 at 10:00PM

Friday, 14 October 2016

FOSDEM 2017 EDA Devroom Call for Participation

This is the call for participation in the FOSDEM 2017 devroom on Free/Open Source Software (FOSS) Electronic Design Automation (EDA) tools, to be held on Sunday 5 February 2017 in Brussels, Belgium. We are looking for contributions under the form of talks and tutorials covering the following main topics:
  • Printed Circuit Board (PCB) design tools (e.g. KiCad and gEDA)
  • Analogue and digital simulators (e.g. ngspice, Qucs, Gnucap, Xyce, GHDL, Icarus and Verilator)
  • Any other EDA tools such as high-level tools for digital hardware design (e.g. Migen) and HDL synthesis tools (e.g.Yosys)
  • Inter-project opportunities for collaboration
We hope to provide an opportunity for attendees to bring themselves up to date on the latest FOSS EDA developments, share knowledge and identify opportunities to collaborate on development tasks. Have a look at last year's event for a taste of what the EDA devroom is about.

The submission process
Please submit your proposals at 
before 1 December 2016.

If you already have a Pentabarf account (for example as a result of having submitted a proposal in the past), make sure you use it to log in and submit your proposal. Do not create a new account if you already have one. Please provide a bit of information about yourself under Person -> Description -> Abstract. When you submit your proposal (creating an "Event" in Pentabarf), make sure you choose the "Electronic Design Automation (EDA) devroom" in the track drop-down menu. Otherwise your proposal might go unnoticed. Fill in at least a title and abstract for the proposed talk and a suggested duration. Bear in mind that a lot of the value in these meetings comes from the discussions, so please be reasonable regarding the duration of the talk.

Important dates
  • 1 December 2016: deadline for submission of proposals
  • 11 December 2016: announcement of final schedule
  • 5 February 2017: devroom day
The FOSDEM organisers hope to be able to live-stream and record all the talks. The recordings will be published under the same licence as all FOSDEM content (CC-BY). Only presentations will be recorded, not informal discussions and whatever happens during the lunch break. By agreeing to present at FOSDEM, you automatically give permission to be recorded. The organisers will agree to make exceptions but only for exceptional and well-reasoned cases.
Mailing list

Feel free to subscribe to the mailing list of the EDA devroom to submit ideas, ask questions and generally discuss about the event.

Spread the word!
This is the third EDA devroom at FOSDEM. The first two were very well received. Let's make sure as many projects and developers as possible are present. Thanks!

Thursday, 13 October 2016

[call for papers] 1st EDTM 2017

Submission deadline: November 4th, 2016
Camera ready, one page text and one page figures

At Toyama International Conference Center, Toyama, Japan
February 28th to March 2nd, 2017

Why EDTM has been started: System performance continues to grow, even though device scaling is saturated. Based on strong manufacturing technologies, Asia has strong potential to take an initiative for system integration. Deep-dive discussions among technical communities on materials, processes, and devices are aimed to accelerate manufacturing innovations through this forum.

1. Technical sessions

EDTM 2017 and beyond will have a strong specific technical focus, and this year’s focus being on devices and process technologies for advanced applications, IoE (Internet of Everything) and related low-power devices, advanced memories, sensors, actuators, MEMS, bio.-chips, passive devices, and all types of (exploratory) devices related to advance applications and IoE. Papers/Posters on materials and processes for enabling above-menHoned devices building in heterogeneous integration such as 2.1, 2.5 and 3D structures using wafer-level packaging process (e.g.) are of great focus. EDTM aims for highest quality, and all papers accepted would be subject to IEEE-EDS standard review processes and conference publishing guidelines. Accepted and presented papers will be published in EDTM proceedings. A selected number of high impact EDTM papers would be invited for the consideration of publication in the IEEE Journal of Electron Devices Society (J- EDS) as extended version of EDTM conference papers following the IEEE publication policy and J-EDS author-guidelines.

2. Education

  • Tutorials: We will provide both the basic and advanced programs. Basic program will be presented in local language.
  • Poster sessions: Primarily intended for young engineers and students. The best poster will be awarded in the conference.
  • Short courses: Will bring high level programs.

3. Exhibition

Given the strong semiconductor manufacturing base in Asia, we intend to offer exhibits that will demonstrate products and technology. All of the exhibitors will have an opportunity to offer technical insight and share their knowhow. Moreover, we hope to offer Forum Making Session to engage and allow deeper discussions between device, material, and equipment engineers and technologists.

Papers in the following areas are requested by Subcommittee on:

  • Devices and Manufacturing for “Cloud and Edge”
  • Packaging and Manufacturing for “Cloud and Edge”
  • Process, Tools, and Manufacturing
  • Semiconductor Materials
  • Reliability & Modeling (including compact/SPICE)