Showing posts with label OpenPDK. Show all posts
Showing posts with label OpenPDK. Show all posts

Oct 17, 2026

[paper] ACM3 Compact MOSFET Model

Deni Germano Alves Neto; Márcio Cherem Schneider; Manuel J. Barragan; 
Sylvain Bourdel; Carlos Galup-Montoro,
ACM3 - An Advanced Compact MOSFET Model for Analog IC Design and Simulation
in IEEE Access, DOI: 10.1109/ACCESS.2026.3742180

1.) Federal University of Santa Catarina, 88040-900 Florianópolis (BR)
2.) Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA F-38000 Grenoble (F)

Abstract: This paper presents ACM3, an advanced compact MOSFET model that extends the designoriented ACM2 formulation by introducing gate-voltage dependencies for the slope factor n, the draininduced barrier lowering (DIBL) coefficient σ, and inversion charge dependence for the specific current IS. ACM3 preserves a single-piece, charge-based description of the drain current, valid from weak to strong inversion and from the linear to the saturation regions, while relying on an efficient analytical approximation of the Lambert W -function suitable for Verilog-A implementation. A robust yet straightforward parameterextraction flow is proposed, in which all eight DC parameters (VT 0, IS0, Φ, γ, θ, σWI , σSI and ζ) are obtained directly from ID–VGB and ID–VDS curves through a differential evolution (DE) algorithm that minimizes the root-mean-square percentage error between the reference and the modeled drain current. A distinctive feature of this flow is that the reference curves may originate either from silicon measurements or from another compact model, making the extraction equally applicable to measured and simulated data. At the device level, the parameters are extracted from silicon measurements of an open-source 130 nm BiCMOS technology, yielding agreement with the measured data for both short- and long-channel transistors across all regions of operation. At the circuit level, ACM3 is validated through simulations of a common-source amplifier, a self-biased current source, and a CMOS latch in a 180 nm CMOS technology, where the ACM3 parameters are extracted from BSIM4-generated characteristics and the results are compared against the foundry BSIM4 model. Representative process, voltage, and temperature (PVT) robustness is also evaluated against BSIM4. The ACM3 model has been implemented in Verilog-A and integrated into open-source circuit simulators, via OpenVAF, enabling accurate and intuitive analog IC design within fully open design flows.

TAB: Comparison of ACM3 with representative industrial 
and design-oriented compact MOSFET models

Aknowlegements: This study was financed in part by the Coordenação de Aperfeiçoamento de Pessoal de Nível Superior, (BRAZIL), Conselho Nacional de Desenvolvimento Científico e Tecnológico, (BRAZIL), and TIMA laboratory, Grenoble (FRANCE).

Oct 15, 2026

eSim 2.6 Release

A Big Milestone for FOSSEE eSim - eSim 2.6 IS HERE!


The release of eSim 2.6 is bringing exciting improvements, enhanced workflows, and new capabilities to our open-source Electronic Design Automation (EDA) tool developed by the FOSSEE Project, IIT Bombay.

Download eSim 2.6: https://esim.fossee.in/downloads
Explore eSim 2.6 Release Notes: https://github.com/FOSSEE/eSim/releases/tag/v2.6

What's New in eSim 2.6?
  • Refreshed User Interface
  • Enhanced Simulation and Waveform Analysis
  • Improved HDL Workflows and Icarus Verilog Support
  • Compatibility with Newer KiCad Versions
  • IHP OpenPDK Support
  • Native Windows Installer
  • Reduced Installer Size
  • OpenROAD Integration (Work in Progress)
Celebrating the Team Behind the Release:

A special shout-out to Varadha RS, Akshat Sharma, and more than 100 hardworking interns for their dedication and contributions to eSim 2.6. From implementing new features and resolving issues to testing workflows and improving usability, their efforts have helped bring this release to life.

A heartfelt thank you to all eSim and FOSSEE team members for their invaluable contributions, technical expertise, guidance, and continued support. Every contribution matter, and milestones like this are the result of collaboration, persistence, and teamwork.
Acknowledging Our Supporters

Our sincere gratitude goes to the FOSSEE Project, Indian Institute of Technology Bombay, National Mission on Education Through ICT (NMEICT), and the Ministry of Education, Government of India, New Delhi, for their continued support in advancing open-source engineering tools and education.
Building the Future of Open-Source EDA

At FOSSEE, IIT Bombay, we are committed to making circuit design, simulation, PCB design, and semiconductor design more accessible through open-source technologies.

Thank you to everyone who has been part of this journey. Special thanks to our collaborators and the wider open-source community:
  • Wladek Grabinski, 
  • Steve Hoover, 
  • Indira Iyer Almeida
  • OpenPDK IHP - Leibniz Institute for High-Performance Microelectronics
  • The OpenROAD Project

Oct 12, 2026

APCI Program: SBMicro Projects

APCI Program
Support for SBMicro Integrated Circuit Projects



TAB: Universities Involved in IC Design and EDA/CAD Tool Development

University #Profs #PhDs #MSCs
CEFET-MG - Centro Federal de Educação Tecnológica de Minas Gerais803
CEFET-RJ - Federal Center for Technological Education Celso Suckow da Fonseca210
FEI - Centro Universitário da FEI203
FURG - Universidade Federal do Rio Grande311
IFSP - Instituto Federal de São Paulo500
ITA - Instituto Tecnológico de Aeronáutica1005
PUCRS - Pontifícia Universidade Católica do Rio Grande Do Sul8159
UCPEL - Universidade Católica de Pelotas306
UEA - Universidade do Estado do Amazonas100
UERGS - State University of Rio Grande do Sul500
UFABC - Federal University of ABC602
UFAM - Universidade Federal de Manaus440
UFBA - Universidade Federal da Bahia5138
UFC - Universidade Federal do Ceará353
UFERSA - Mossoró104
UFERSA - Pau dos Ferros513
UFG - Federal University of Goiás810
UFMG - Universidade Federal de Minas Gerais639
UFPB - Universidade Federal da Paraíba112
UFPEL - Universidade Federal de Pelotas13132
UFPR - Universidade Federal do Paraná725
UFRGS - Universidade Federal do Rio Grande do Sul173245
UFRJ - Federal University of Rio de Janeiro624
UFRN - Federal University of Rio Grande do Norte432
UFS - Universidade Federal do Sergipe301
UFSC - Universidade Federal de Santa Catarina111211
UFSM - Universidade Federal de Santa Maria805
UFV - Universidade Federal de Viçosa233
UNB - Universidade de Brasília939
UNESP - Universidade Estadual Paulista401
UNICAMP - Universidade Estadual de Campinas81621
UNIFEI - Universidade Federal de Itajubá723
UNIFEI - Itabira303
UNIPAMPA - Universidade Federal do Pampa402
UNISANTOS - Universidade Católica de Santos100
UNISINOS - Universidade do Vale do Rio dos Sinos303
UNIVALI - Universidade do Vale do Itajaí303
USP - Universidade de São Paulo8112
USP-EESC - Escola de Engenharia de São Carlos312
UTFPR - Universidade Tecnológica Federal do Paraná100

Oct 11, 2026

[OpenSUSI] First Tyepout

J. I. Okamura
New Semiconductor Design Programs with Japan’s Open Source Ecosystem
[Society News] in IEEE Solid-State Circuits Magazine, vol. 18, no. 3, pp. 87-88, Summer 2026, 
doi: 10.1109/MSSC.2026.3708432

Abstract: Open Source Utilized Silicon Initiatives (OpenSUSI), founded in April 2024 as a nonprofit organization, has been working closely with two Japanese legacy foundries to foster an open source silicon ecosystem in Japan. On 19 September 2025, TOKAI RIKA Co., Ltd., a 6-inch legacy foundry in Japan, announced the release of a non-disclosure-free process design kit (PDK) as an open source platform [1]. This new open source PDK, called TR-1um [2], was released via the OpenSUSI GitHub repository, and, since last October, we have been cleaning up and maintaining it alongside our collaborators.


Fig. First Tapeout application form on the OpenSUSI homepage.


Oct 10, 2026

[OpenPDK] GT2N

This the initial release for the GT2N PDK with 72 standard cells: <https://github.com/azadnaeemi/GT2N>.
It is based on 2nm GAAFET with BSPDN. All the device models are based on 3-stack nanosheets


Standard cell layouts can also be imported using the .gds file: GT2N/gds/gt2_6t_std_cells.gdsLVS and DRC rulesets for icvalidator are present in "GT2N/icv_runset".
Libraries are composed of 3 process corners (under development), 2 nanosheet width (W) flavors, and 5 threshold voltage (VT) flavors. (In the order of decreasing VT, HVT > SVT > LVT > ULVT > ELVT)

The collaterals required for synthesis and PnR are (depending on the process corner and W/VT flavor):
LIB: GT2N/lib/tt/gt2_6t_w31_lvt_tt_0p7v25c.lib
LEF: GT2N/lef/tt/gt2_6t_w31_lvt.lef
Techlef: GT2N/techlib/gt2_tech.lef
ICT: GT2N/qrc/GT2.ict
QRCTech: GT2N/qrc/GT2_qrc.tch
ITF: GT2N/nxtgrd/GT2.itf
NXTGRD: GT2N/nxtgrd/GT2.nxtgrd

The thermal-calibrated GAAFET (3-stack nanosheet) model card is (depending on the process corner and W/VT flavor):
GT2N/device/tt/gt2_w31_lvt_tt.sp

[ref] D. Jang, P. Kumar, M. N. H. Shazon, S. J. Ram, A. Svizhenko, V. Moroz, A. Ceyhan, N. A. Radhakrishn, and A. Naeemi, "GT2N: An Open-Source 2nm Nanosheet PDK Enabling Multi-Width/VT Benchmarking" in IEEE International Symposium on Circuits and Systems (ISCAS) 2026  








Oct 9, 2026

[ICTA2026 ] Special OpenPDK Session

IEEE International Conference on Integrated Circuits, Technologies & Applications
ICTA 2026 Special Session “OpenPDK - Global FOSS Scholar Platform"
21st - 24th (Wed - Sat) October 2026
Grand Copthorne Waterfront Hotel, Singapore


The OpenPDK initiative delivers a global FOSS Scholar Platform supporting analog/RF, mixed‑signal, and digital IC design. Central to this effort are accurate SPICE models for low‑power sensing MOSFETs, RF HBTs, and emerging RRAM devices, validated across cryogenic temperatures for space and quantum‑computing applications. The initiative also advances Verilog‑A compact‑model standardization, ensuring result reproducibility and seamless integration into open‑source design flows. Supported by the EU Chips JU, OpenPDK fosters collaboration among academia, startups, and industry, while providing FOSS IC‑design tools covering schematic capture, simulation, layout, and verification up to tape‑out. Similar to the EU Chips JU program, Zhejiang CoreXin in China offers an open‑source PDK together with tape‑out services for its 55nm CMOS process. To accelerate the semiconductor‑industry development across the Asia‑Pacific and Southeast‑Asia regions, semiconductor model development and parameter extraction techniques should be pursued in a more focused manner. This special session brings together experts to present and discuss advances in device characterization, compact modeling, simulation methodologies, and validation techniques for a broad range of solid‑state devices, including Si, III/V semiconductors, power devices, nanoscale structures, and emerging 2.5D/3D advanced packaging technologies [ read more...]

ICTA 2026 Special OpenPDK Session Presenters
  • SPICE/Verilog-A standard models and OpenPDK practice
    Wladek Grabinski, GMC Consulting, Switzerland
  • Open-Source Ecosystem Updates and Semiconductor Design Development Programs in Japan
    Jun-ichi Okamura, AIST Solutions, OpenSUSI, Japan
  • Open-Source EDA Meets Industrial IC Design
    Ehrenfried Seebacher, ams-OSRAM AG, Austria
  • Building an Open-Source Process Platform, Empowering VLSI Innovation and Development
    Da Zhang, Zhejiang University/CTO, Zhejiang Chuangxin Integrated Process Platform, China
  • From Silicon to Design: Intelligent Measurement and Modeling for DTCO
    Yutao Ma, VP of R&D, Primarius Technologies. Ltd. China
  • Beyond Moore, Application-Driven IC Innovation International Cooperation Opportunities at NICE
    Alex Gu, National Innovation Center Par Excellence (NICE), China
  • 2.5D/3D IC: AI+EDA Reshaping the System-Design-Technology Co0ptimization (STCO) Paradigm for Advanced Packaging
    Alex Zhao, Founder/CEO Zhuhai SiChip Technology Co., Ltd., China
  • Modelling of semiconductor devices: the heart of innovation bridging academia and industrial applications
    Fujiang Lin, University of Science and Technology of China (USTC), China
Special OpenPDK Session progeam include the panel discussion: 
How to have a close loop for PDK, EDA, PDA and ICS simulation?


Oct 8, 2026

Schematic to Silicon with Mini MOSbius

Zero To ASIC Course and Tiny Tapeout by Matt Venn
Schematic to Silicon with Mini MOSbius 
https://www.youtube.com/watch?v=NM5cLWYWqG0

MOSbius

Take Matt Venn TT course: 
https://www.zerotoasiccourse.com/
Buy a copy of Mini MOSbius, part of the TT IP library, here: 
https://store.tinytapeout.com/products/TTSKY25b-Development-Kit-p849160072
Check the configurator: 
https://github.com/mattvenn/mini-mosbius-configurator

Mini MOSbius is available on these chips
  • [OK] TTSKY25a - delivered July 2026 - available in the store
  • [OK] TTSKY25b - delivered August 2026 - available in the store
  • TTSKY26b - tapeout May 2026
  • TTSKY26c - tapeout September 2026
  • GF180 - will be taped out December 2026
and finally check out the original MOSBius: https://mosbius.org/ If you are interested to acquire MOSbius kits, review the express license and email Peter Kinget for kit availability before placing an order.


Oct 6, 2026

[paper] Open Source EZ130 8T standard cell library

Oscar Castaneda, Lavinia Recchioni, Tobias Senti, Flurin Cahenzli, Marco Ferroni, Thorben Heekenjann, Robert Kenter, Stefan Odermatt, Daniel Richner, Gabriel Altendorfer, Davide Cannone, Miguel Correa, Ivan Herger, Lars Kroger, Nicolas Nanzer, Darja Nonaca, Christopher Reinwardt, Lukas Winklhofer, Enrico Zelioli, Yiheng Zhang, Yingxue Zhang, Domenic Keller, Seyed Hadi Mirfarshbafan, Zerun Jiang, Beat Muheim, Arianna Rubino, Jeremy Guichemerre, Frank K. Gurkaynak, and Christoph Studer
An Open-Source Standard-Cell Library for IHP 130 nm Developed by Students
arXiv:2609.29965v1 [cs.AR] 24 Sep 2026

1. Department of Information Technology and Electrical Engineering, ETH Zurich, Switzerland
* The open-source EZ130 8T standard-cell library is available at https://ez.ethz.ch

Abstract: Standard-cell libraries form the critical interface between transistor-level circuit design and automated digital design flows, yet their design and characterization are rarely covered in depth in digital VLSI courses. This paper presents VLSI 5, a graduate-level course at ETH Zurich in which students design, lay out, characterize, and integrate their own standard cells using IHP’s open-source 130 nm SG13G2 process design kit. In the first course offering, 19 students developed EZ130 8T, an open-source eight-track standard-cell library comprising 220 cells. We evaluate successive library versions using eight synthesis benchmarks, across which EZ130 8T achieves significant area reduction compared to the SG13G2 library at competitive timing. For a postlayout 8×8 matrix-vector multiplier, EZ130 8T reduces cell area by 35% and energy by 39% while maintaining virtually the same clock period. The library has already been adopted in other ETH Zurich VLSI courses, enabling the creation of chips entirely designed by students down to the transistor level.
FIG: a.) ETH Zurich course series on digital VLSI design. By teaching students to create a standard-cell library, the new VLSI 5 course closes the gap between transistor-level and HDL-level IC design;
b.) and c.) Layout of two example standard cells from the EZ130 8T library.

Aknowlegements: This work has received funding from the Swiss State Secretariat for Education, Research, and Innovation (SERI) under the SwissChips initiative. The authors thank Cadence for their support by providing licenses to design and characterize the EZ library. The authors also thank H. Pretl, T. Benz, and P. Sauter for their feedback on preliminary versions of the EZ library.

Oct 4, 2026

[webinar] Colombia in OpenSilicon Age

IEEE SSCS: Colombia in OpenSilicon Age

  • Date: Thursday, October 8, 2026
  • Time: 1:00 PM – 2:30 PM (Colombia, GMT-5)
  • Platform: Cisco Webex
  • Access: Free/Open access

This open online event is the first IEEE SSCS Colombia session. It shares a vision for creating a strong microelectronics ecosystem in Colombia by bringing universities and industry together and helping develop highly skilled engineers. The event will review the current state of microelectronics in Colombia, discuss the future of integrated circuit (IC) design, present recent semiconductor policy initiatives, and explain the goals of the IEEE SSCS Colombia chapter. Speakers from Colombia and abroad will share their experience in IC design, open-source silicon, semiconductor education, and industry development. The session aims to encourage collaboration between academia, industry, and government to support the growth of the semiconductor sector in Colombia.

Featured Panelists and Keynote Speakers

  • Made in Colombia: Review of Colombian Microelectronics
    Javier Ardila, Onsilicon, UIS and President, IEEE SSCS
  • ColombiaThe Global Map of CI Design: Tools, Foundry and Methodology
    Hugo Hernández, Teradar, Boston, MA
  • OpenSilicon Opportunities
    Fernando Guarín IEEE Division 1
  • Bill for the promotion of the electronics and semiconductor industry
    Lorena García Founder, Colombian Network of Electronics and Semiconductors


Sep 30, 2026

[EUMW.EU] IHP Open Source Toolchain

Open-source Toolchain in RF and Digital Design
08:30 - 12:50; Monday 5 October 2026
European Microwave Week 

The European Chips Act serves as a strategic roadmap to secure technological sovereignty by aiming for a 20% global market share in semiconductors by 2030. The goal is to minimize the geopolitical supply chain risks and foster a self-sufficient ecosystem. Democratization of hardware development through the development of open-source EDA tools is a key pillar in these aspects. This would lower the entry barriers for SMEs and researchers and ultimately accelerate a collaborative and transparent era of European silicon innovation. There are multiple EU funded projects have started from last few years. These projects are set to offer robust process design kits (PDK) for open-source tools. In parallel, existing open-source tools for IC design are being further enhanced to include necessary functionalities for complete design flow for digital, analogue and RF design. Aligning with above mentioned goals, multiple private, academic, and commercial entities have stepped up towards the development. This workshop aims to share a glimpse of activities in open-source EDA tools developments and chip design activities in Europe. It would begin with a talk about current EU projects and the statuses in open-source EDA development. Then there will be two talks about digital and RF design flow using open-source tools. The final talk is about electro-magnetic simulation for RF circuits. Overall, this workshop is targets to publicize the open-source activities towards the building of a collaborative society in chip design domain. 

The event is aimed at IC designers, researchers, PhD candidates and engineers who already have a basic understanding of chip design and EDA workflows. Familiarity with digital, analogue or RF design will help you get the most from the sessions.

This workshop, chaired by the IHP Team: Corrado Carta, Sergei Andreev, and Farabi Ibne Jamal, gives you a practical view on the following Open-Source R&D Topics:
  • European Open-Source EDA projects currently stand
    • Sergei Andreev, IHP
  • How digital design flows can be built with Open-Source tools
    • Frank Kagan Gurkaynak, ETH Zürich
  • How Open-Source tools are being applied to RF design 
    • Harald Pretl, Johannes Kepler Universität Linz
  • How Open-Source EM simulation fits into RF circuit development
    • Giovanni Di Pietrantonio, IHP and Volker Mühlhaus, MCS, GmbH
Join the IHP OpenPDK Team if you want to understand where open-source chip design is heading, what is already usable today, and how these tools could complement your own work. Register at the EuMW website.






Sep 29, 2026

[paper] TCAD Modeling of SB Diode

Pedro Paulo Pessoa Oliveira1,2, Andreas Mai1,3, Norbert Herfurth1, 
and Davies William de Lima Monteiro2
TCAD Modeling of Schottky-Diode in an open-source SiGe BiCMOS technology
In 2026 40th Symposium on Microelectronics Technology and Devices 
SBMicro, pp. 1-4. IEEE, 2026
DOI: 10.1109/SBMicro70495.2026.11684441

1. IHP, Frankfurt (Oder), Germany
2. Department of Electrical Engineering, UFMG - Belo Horizonte-MG, Brazil
3. University of Applied Sciences Wildau, Germany

Abstract: Accurate simulation of Schottky barrier diodes (SBDs) is challenging because standard idealized models fail to capture non-ideal interface physics, such as Fermi-level pinning and image-force lowering. This paper presents an enhanced Technology Computer-Aided Design (TCAD) methodology to model an SBD from the IHP SG13G2 130-nm open-source SiGe BiCMOS technology. To overcome limitations of conventional simulations that often rely on oversimplified assumptions and empirical fitting, this work explicitly incorporates interface en- ergy states into the simulation, specifically modeling the fun- damental pinning mechanisms driven by Metal-Induced Gap States (MIGS). By calibrating the TiSi2/Si interface using the theoretical slope parameter, a value of 0.503 V was determined for the zero-bias barrier height. The resulting physics-based model captures the true rectifying nature of the contact and accurately reproduces the electrical characteristics targeted by the empirical model, achieving a nominal forward voltage drop of 0.39 V and a realistic reverse leakage current of 29.3 nA at -2.5 V. Ultimately, this paper shows the innovation and education gain of open- source foundry data by showcasing an open innovation path for a targeted near-industry device development flow.
FIG: a.) Energy band diagram of the Schottky diode at V=0V. Thecoordinate x = 0 corresponds to the TiSi2/n-Si Schottky interface. The inset displays the 2D device schematic, with the solid black line indicating the multi-segment cut-path used to extract the energy levels across the anode, n-buried layer and n-well RT to cathode contact. b.) Comparison of the simulated DC current-voltage (IV) characteristics between the proposed TCAD model and the standard SPICE macromodel.

Acknowledgment: The authors thank IHP for the open-source PDK and the collaborative research. They also thank Universidade Federal de Minas Gerais (UFMG) and the Brazilian Microelectronics Society (SBMicro) for supporting this work. Finally, gratitude is extended to S. Srivastava and B. Sake for their valuable guidance.

Aug 17, 2026

[ICMC] 2026 Award Winners

Thank you to all of the great paper and poster presentations at ICMC 2026!

Below the ICMC 2026 Best Paper Award Winners:
  • Best Paper Award
    Zhengxing Zhang & Substitute Presenter Xu Wang
    Cadence Design Systems, Port Moody, Canada
    “Compact Time-Domain Modeling of Parameterized Frequency-Dependent Photonic Components in Verilog-A”
  • Best Student Paper Award
    Tasnia Jahan
    Arizona State University, Tempe, USA
    “Physics-Informed Neural Networks for Predicting Characteristics of β-Ga2O3 based Devices”
  • Best Poster Award
    Dylan Ma & Substitute Presenter Lan Wei
    University of Waterloo, Waterloo, Canada
    “Virtual-Source-Based Cryogenic FET Model”
and more ICMC2026 photos

Aug 14, 2026

[release] IHP Open ADK

IHP Open Assembly Design Kit 
(#OpenAKD)
https://github.com/IHP-GmbH/IHP-Open-ADK


is preview ready and officially available on the IHP GitHub. This release comes with several tools to enable the workflow, including the IHP open source interposer technology process (OpenIntM4TM2). It is Assembly-level Design Kit (OpenADK) for heterogeneous chiplet integration. The OpenADK operates one abstraction layer above all process‑specific PDKs, providing the rule set and assembly tooling that define chiplet placement, routing, and interposer‑level connectivity. The interposer and the chiplet dies remain ordinary PDKs.
Status Warning ADK is currently a preview release only! v0.2.0. The KLayout assembly DRC, its runner, the KiCad DRU generator, and the IHP interposer adapter are implemented and exercised by the regression suite.

● Current ADK documentation
https://ihp-open-adk-docs.readthedocs.io/en/latest/index.html
● Quick start ADK commands
https://ihp-open-adk-docs.readthedocs.io/en/latest/quickstart.html


Apr 13, 2026

[OpenSUSI] Kicks off Five-Year Plan

Industry-Academia Collaboration Project Launches for Real Chip Manufacturing 
Using NDA-Free PDK - Tokai Rika, Kyushu University, AIST Solutions, 
OpenSUSI Kicks Off Five-Year Plan for FY2026

Tokai Rika Co., Ltd., Kyushu University, AIST Solutions Co., Ltd., and OpenSUSI have announced a joint project on a five-year plan to develop semiconductor human resources and verify their implementation through industry-academia collaboration to actually manufacture chips using PDK (Process Design Kit) that does not rely on NDAs (non-disclosure agreements). The 2026 launch ceremony was held. The biggest feature of this project is that it allows students to experience a series of processes from design to chip manufacturing under an open design environment using NDA-free PDKs #OpenPDKs

Positioning and future development in FY2026 as the first year that this project will be fully developed over a five-year span. Based on an open design and manufacturing environment utilizing NDA-free PDK #OpenPDK, we will continue and develop the following initiatives:
  • Continuation and advancement of hands-on semiconductor human resource development
  • Providing opportunities for actual chip manufacturing and verification using NDA-free PDK
  • Building a practical and highly reproducible education and implementation model through industry-academia integration
  • In exchange for the cost support for this program, we will embed the company's logo on the prototype chip to spread awareness of semiconductor design human resource development as a social contribution activity
(From left) Junichi Okamura, Representative Director of OpenSUSI, 
Haruichi Kanaya, Professor of Kyushu University, 
Taketoshi Sakurai, Executive Officer of Tokai Rika, 
and Seiji Osaka, President and CEO of AIST Solutions

If you are interested or interested in this matter, please contact us at:
OpenSUSI Secretariat <secretary@opensusi.org>

 

Apr 10, 2026

[DATE2026] Open Source Related Talks


DATE 2026 Verona, Italy
Open Source Related Talks
Monday, 20 April - Wednesday, 22 April 2026
<https://date26.date-conference.com/programme>

  Label   Title Authors
TS02.8 ML-DSA-OSH: An Efficient, Open-Source Hardware Implementation of ML-DSA Quinten Norga; Suparna Kundu; Ingrid Verbauwhede
LK03 Democratizing Silicon: The Rise of Open-Source EDA and Europe’s Strategic Roadmap Luca Benini
TS10.1 PICOSNN: Partially Incoherent Configurable Optical Computing Architecture for SNN Acceleration Bowen Duan; Zhenhua Zhu; Zhengyang Duan; Huazhong Yang; Yuan Xie; Yu Wang
TS16.1 Non-Volatile Spintronic Flip-Flops with Checkpoint Preservation Supported in RISC-V Platform Jiongzhe Su; Mingtao Chen; Zhanpeng Qiu; Bo Liu; Hao Cai
LBR01.4 Float Fight - Verifying Floating-Point Behavior In Risc-V Simulators Katharina Ruep, Manfred Schlaegl and Daniel Grosse
LBR01.7 Hybrid Virtual Platform + FPGA Co-Emulation Framework Lorenzo Ruotolo; Giovanni Pollo; Mohamed Amine Hamdi; Matteo Risso; Yukai Chen; Enrico Macii; Massimo Poncino; Sara Vinco; Alessio Burrello; Daniele Jahier Pagliari
TS20.1 Fault-Tolerance Mapping of Spiking Neural Networks to RRAM-Based Neuromorphic Hardware Yuqing Xiong; Chao Xiao; Zhijie Yang; Lei Wang; Mengying Zhao
TS21.4 Substrate: A Statically Typed Framework for Designing Highly Configurable Analog and Mixed-Signal Circuit Generators Rahul Kumar; Rohan Kumar; Borivoje Nikolic
SD03 Open-Source Hardware Landscape
SD03.1   Open Silicon Fabrication – Made in Europe Gerhard Kahmen, IHP GmbH, DE
SD03.2 From Schematic To Silicon: Mixed Signal Ic Design In Open Source Flows Harald Pretl, JKU Linz, AT
SD03.3 Bringing Software Design Thinking To Chip Design Tomi Rantakari, ChipFlow, GB

Mar 2, 2026

Aalto Microelectronics Fair

Aalto Microelectronics Fair
March 20, 2026, 9.00-15.30
Aalto Yliopisto, Kandidaattikeskus, H304, Otakaari 1, 02150 Espoo

Time Session
8:30–9:00 Morning coffee
9:00–9:15Opening
Aleksi Korsman
Keynotes
9:15–10:00Keynote 1: “OpenPDK - Global Scholar Platform”,
Wladek Grabinski, Open PDK Initiative


10:05–10:50Keynote 2: “Open Source Design Tools in SME IC Design Companies”,
Ari Paasio, Kovilta




Research overviews
11:00–11:15Research overview: Kari Stadius
11:15–11:30Research overview: Prof. Marko Kosunen
11:30–11:45Research overview: Prof. Kwantae Kim
11:45–12:45Lunch (and posters)
12:45–13:15Student talk: “Five years of RISC‑V processor design at Aalto”,
Aleksi Korsman
13:15–13:45Student talk: “Beyond Neural Networks: Overcoming the Symbolic Bottleneck via Approximate Logarithm Acceleration”,
Lingyun Yao
Posters
13:45–14:00Poster intro
14:00–15:00Posters with coffee and snacks
15:00–15:30Feedback and closing

Should you have any questions, please email Marko Kosunen

Nov 15, 2025

[Free Session] Tokai Rika OpenPDK

Tokai Rika Shuttle Open PDK Commentary Free Session
Saturday, December 13, 2025 13:00~17:00 [and online]
WeWork Hibiya FORT TOWER 9th Floor, Conference Room 9R
1-1 Nishi-Shimbashi, Minato-ku, Tokyo
Time Speaker Topic
12:50 ISHI Club 1F Gathering
13:00 ISHI Club Opening
13:00-13:30 OpenSUSI Overview of Tokai Rika Shuttle PDK and future plans
13:30-14:30 jun1okamura Outline of the production of DRC and LVS of Tokai Rika Shuttle PDK and explanation of contents
14:30-15:00 OpenSUSI Break & Information Exchange
15:00-15:30 Mitch Bailey Detailed explanation of LVS (Japanese lecture)
15:30-16:00 Hota (SIG's Playground) How to 🚶 walk through open source PDK: "What is PDK in the first place?" "Where do you want to "read" PDK? "If you want to make your own PDK, where do you start?" and "Examples of what you have done so far".
16:00-16:30 OpenSUSI PDK Conversation: jun1okamura x Hota x Mitch Bailey: Mr. Hota, an expert in commercial PDK development at a major domestic company, and Mitch Bailey, an expert in open PDK who has been performing structural checks and PDK maintenance of GDS submitted by eFabless, etc.
16:30-17:00 OpenSUSI PDK Conversation / Honest Edition (No more online streaming will be done from now on): Continuing from the above, we plan to talk about things that cannot be said publicly. In a sense, this may be the real thing.
17:00 ISHI Club Closing

Discord invitation link 
https://discord.gg/Sj47dJk8x7 
https://discord.gg/RwAWF5mZSR

Sep 1, 2025

FOSSEE eSim Marathon – Circuit Design & Simulation with IHP SG13G2

Design, Simulate, Showcase
Unlock Open-Source VLSI Design  using eSim + IHP SG13G2 OpenPDK!!!

The eSim Marathon - Circuit Design & Simulation with IHP SG13G2 is a nationwide circuit design competition where participants use eSim, an open-source EDA tool developed by FOSSEE, IIT Bombay, to design and simulate circuits using the IHP OpenPDK for 130nm SG13G2 BiCMOS technology from IHP Microelectronics, Germany.

Key Highlights:
  • Tool Used: eSim - a free and open-source alternative to commercial circuit design tools 
  • OpenPDK Used: IHP SG13G2 - enables design of analog, digital, and RF circuits at 130 nm BiCMOS.
  • Objective: Design, simulate, and submit functional analog/digital/mixed-signal circuits.
  • Eligibility: Open to individuals - students, hobbyists, and early-career professionals.
  • Learning Outcomes: Participants gain hands-on VLSI design experience using a real foundry OpenPDK, develop schematics, run simulations, and build documentation - entirely with open tools.

Timeline

Date Activity Description
1 Sept. - 15 Sept. 2025 Registration for the Marathon Complete the participation form
16 Sept. 2025 Marathon Inauguration Webinar FOSSEE Team will introduce through eSim, IHP and Marathon process
16 Sept. - 23 Sept. 2025 Literature Survey Participants need to research the topic available in papers/journals on the web
23 Sept. 2025 Report Submission Submit one-page research conclusion and circuit implementation plan
23 Sept. - 5 Oct. 2025 Implementation Design, characterise and simulate using eSim platform
5 Oct. - 8 Oct. 2025 Report Submission & Documentation Upload reference and actual circuit/waveform using eSim
25 Oct. 2025 Result Declaration (Provisional) Announcement of provisional results