Apr 15, 2014

[mos-ak] [on-line publications] Spring MOS-AK Workshop in London

  
Recent, Spring MOS-AK Workshop at the London Metropolitan University was organized to discuss SPICE/compact modeling and its standardization with following Qucs GPL circuit simulation tutorial. The workshop's presentations are available on-line at <http://www.mos-ak.org/london_2014/>.
   
Please also distribute further information about next MOS-AK related events among all who are interested in the SPICE/compact modeling and its Verilog-A standardization:
Already now, I am looking forward to meet you at one of our MOS-AK modeling events, soon.

-- with regards - wladek for the Extended MOS-AK/GSA Committee;
--
Arbeitskreis Modellierung von Systemen und Parameterextraktion 
Modeling of Systems and Parameter Extraction Working Group
--
Over two decades of Enabling Compact Modeling R&D Exchange
--
-- 
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i-MOS version 201404 release

The i-MOS Team has announced  new release of the interactive Modeling and On-line Simulation
Platform (i-MOS), version 201404. In this release, there are several new services listed as follows:

  • Integrating the model benchmark testing suites in Model page
  • Including first three benchmark tests for model evaluations
  • Constructing the Developer page for device model submissions
  • Implementing one industry standard MOSFET model HiSIM2
  • Uploading presentation files from IWCM 2014 for your references

For more details, please visit the i-MOS website.

Apr 3, 2014

ESSDERC/ESSCIRC 2014 - Paper submission deadline extension

the Organizing Committee decided to extend the paper submission deadline of the 44th ESSDERC and 40th ESSCIRC to:
April 16th, 2014 23:59 (GMT - 07:00 am)

This is a hard deadline and no further extensions will be granted. After the deadline is elapsed, further paper submissions will not be accepted. The notification of paper acceptance, May 27, 2014, has not changed. Detailed information about the conferences is provided at the ESSCIRC/ESSDERC 2014 website.

[read more...]

VI Regional Seminar MNE & MS 2014

VI Regional Seminar on Computer Modeling and Designing in Micro- and Nanoelectronics and in Microelectromechanical Systems (MNE & MS 2014),
Orel, Russia, March 28 2014
  1. С.И. Матюхин1, Welcome and Seminar Openning,
    1Госуниверситет-УНПК
  2. Турин В.О.1, Кильчицкая М.В.2, Герасимов К.А.2Simulation of power bipolar transistor,
    1Госуниверситет-УНПК, 2БГТУ, г. Брянск
  3. Ващенко В.А., The physical ESD design for integrated circuits and electronic devices,
    Maxim Integrated Corp., г. Сан Хосе, Калифорния, США
  4. Цырлов А.М., Development of CMOS optocoupler,
    ОАО «Протон», г. Орёл
  5. Студенников А.С., Development of CMOS ICs,
    ОАО «Протон», г. Орёл
  6. Малый Д.О.1, Матюхин С.И.2, Ставцев А.В.1"Proton-Elektroteks" IGBT-devices JSC: basic approaches of production and quality assurance,
    1ЗАО «Протон-Электротекс», г. Орёл, 2Госуниверситет-УНПК
  7. Макулевский Г.Р., Матюхин С.И., Current-voltage characteristics of laser diodes based on AlGaAs,
    Госуниверситет-УНПК
  8. Матюхин С.И., Гришин В.О., Radiation effects of on the current-voltage characteristic of power diodes and thyristors,
    Госуниверситет-УНПК
  9. Писарев А.А.1, Матюхин С.И.2, Сурма А.М.1, Черников А.А.1Electrical characteristics of fast diodes with soft recovery,
    1ЗАО «Протон-Электротекс», г. Орёл, 2Госуниверситет-УНПК
  10. Koziol Z., Aestimo quantum mechanical software for modeling quantum wells in nanoelectronics,
    TU Rzeszow, Polska

Mar 25, 2014

Possible VTH Variation Sources

with 16 nm FinFET devices, the nature of the VTH variation changes.  On planar CMOS, random dopant fluctuations (RDFs) had the biggest influence. 
Possible VTH Variations
Ideal FinFETs have no doping, and therefore no RDFs.  However, this only works for low voltage operation.  We also need high-speed devices, which requires multiple threshold voltages (Vth's).  For FinFETs, this requires doping leading to RDF variation.  



Mar 20, 2014

New IJNM Paper

 
Open-source circuit simulation tools for RF compact semiconductor device modelling (Invited Paper)
 
Wladek Grabinski (Editor), Mike Brinson, Paolo Nenzi, Francesco Lannutti, Nikolaos Makris, Angelos Antonopoulos and Matthias Bucher
 
Keywords:
CAD; GNU; Qucs; QucsStudio; ngspice; compact modelling; EKV3; RF; MOSFET; Verilog-A
 
Article first published online: 18 MAR 2014 DOI: 10.1002/jnm.1973

Mar 10, 2014

website http://www.tcad.com is up and running

The www.tcad.com website promoting open source Technology Computer Aided Design and posting related news is up and running. Among other news there is also update of the DEVSIM Open Source TCAD Simulator which is available for download at SourceForge, now.  Packages are available for:
  • Mac OS X Mavericks
  • Red Hat 6.5
  • Ubuntu 12.04
For more information about the project, including source code availability, please visit DEVSIM webpage. Additional resource are also available at the TCADCentral 

[source]

Mar 7, 2014

Free And Open Source Simulator Software For Engineers

Free And Open Source Simulator Software For Engineers

0. Qucs
Download Link: http://qucs.sourceforge.net/download.html
Supported OS: Windows, Linux, Mac OSX
License:  Qucs is released under the GPL license and so it is free for free programmers and users !
Qucs stands for Quite Universal Circuit Simulator. So far Qucs is not yet finished, but it is already packed with features. Take a look at the screenshots to get a feel for what it can do.

1. CEDAR
Download Link: http://sourceforge.net/projects/cedarlogic/files/latest/download
Supported OS: Windows
License: Freeware
CEDAR LS is an interactive digital logic simulator to be used for teaching of logic design or testing simple digital designs. It features both low-level logic gates as well as high-level components, including registers and a Z80 microprocessor emulater

2. Logisim
Download Link: http://sourceforge.net/projects/circuit/files/latest/download
Supported OS: Windows, Linux
License: Freeware
Logisim is an educational tool for designing and simulating digital logic circuits. With its simple toolbar interface and simulation of circuits as you build them, it is simple enough to facilitate learning the most basic concepts related to logic circuits.

3. FreeMat
Download Link: http://sourceforge.net/projects/freemat/files/latest/download?source=files
Supported OS: Windows, Linux
License: GPL
FreeMat is a free environment for rapid engineering and scientific prototyping and data processing. It is similar to commercial systems such as MATLAB from Mathworks, and IDL from Research Systems, but is Open Source. FreeMat is available under the GPL license.

4. Logic Gate Simulator
Download Link: http://sourceforge.net/projects/gatesim/files/latest/download
Supported OS: Windows
License: GPL
Logic Gate Simulator is an open-source tool for experimenting with and learning about logic gates. Features include drag-and-drop gate layout and wiring, and user created "integrated circuits".

5. Maxima
Download Link: http://sourceforge.net/projects/maxima/files/latest/download?source=recommended
Supported OS: Windows
License: GPL
Maxima is a fairly complete computer algebra system written in Common Lisp with an emphasis on symbolic computation.

6. Ngspice
Download Link: http://sourceforge.net/project/showfiles.php?group_id=38962
Supported OS: Windows, Linux
License: GPL
Ngspice is a mixed-level/mixed-signal circuit simulator. Its code is based on three open source software packages: Spice3f5, Cider1b1 and Xspice. Ngspice is part of gEDA project, a full GPL'd suite of Electronic Design Automation tools.

7. Qfsm
Download Link: http://sourceforge.net/projects/qfsm/files/latest/download
Supported OS: Windows, Linux
License: GPL
A graphical tool for designing finite state machines

8. QSapecNG
Download Link: http://sourceforge.net/projects/qsapecng/files/latest/download?source=directory
Supported OS: Windows
License: GPL
QSapecNG is a Qt-based symbolic analysis program for linear analog circuits. In fact, it consists of two indipendently parts: the SapecNG framework engine, and the application gui QSapecNG.

[source for 1-8]

SISPAD2014: 2nd Call for Papers

Second Call for Papers
SISPAD2014
September 9 – 11, 2014
Workshop, September 8, 2014
Mielparque Yokohama, Yokohama, JAPAN
Co-sponsored by Japan Society of Applied Physics Technical 
Co-sponsored by IEEE Electron Devices Society

This conference provides an opportunity for the presentation and discussion of the latest advances in modeling and simulation of semiconductor devices, processes, and equipment for integrated circuits.

Topics:
  • Modeling and simulation of all sorts of semiconductor devices, including FinFETs, ultra-thin SOI devices, emerging memory devices, optoelectronic devices, TFTs, sensors, power electronic device, widegap semiconductor devices, spintronic devices, tunnel FETs, SETs, carbon-based nanodevices, organic electronic devices, and bioelectronic devices
  • Modeling and simulation of all sorts of semiconductor processes, including first-principles material design and growth simulation of nano-scale fabrication
  • Fundamental aspects of device modeling and simulation, including quantum transport, thermal transport, fluctuation, noise, and reliability
  • Compact modeling for circuit simulation, including low-power, high frequency, and power electronics applications
  • Process/device/circuit co-simulation in context with system design and verification
  • Equipment, topography, lithography modeling
  • Interconnect modeling, including noise and parasitic effects
  • Numerical methods and algorithms, including grid generation, user-interface, and visualization
  • Metrology for the modeling of semiconductor devices and processes
Plenary Speakers:
  • Augusto Benvenuti, Micron Technology,
    “Current status and future prospects of non-volatile memory modeling”
  • Massimo V. Fischetti, University of Texas at Dallas,
    “Physics of electronic transport in low-dimensionality materials for future FETs”
  • Kimimori Hamada, Toyota Motor Corporation,
    “TCAD challenge on development of power semiconductor devices for automotive applications”
Invited Speakers:
  • Mario Ancona, Naval Research Laboratory,
    “Nonlinear thermoelectroelastic simulation of III-N devices”
  • Asen Asenov, University of Glasgow,
    “Progress in the simulation of time dependent statistical variability in nano CMOS transistors”
  • Jean-Pierre Colinge, Taiwan Semiconductor Manufacturing Company,
    “Nanowire transistors: pushing Moore's law to the limit”
  • Tibor Grasser, Vienna University of Technology,
    “Advanced modeling of charge trapping: RTN, 1/f noise, SILC, and BTI”
  • Kohji Mitsubayashi, Tokyo Medical and Dental University,
    “Novel biosensing devices for medical applications”
  • Christian Sandow, Infineon Technologies,
    “Exploring the limits of the safe operation area of power semiconductor devices”
  • Mark Stettler, Intel Corporation,
    “Device and process modeling: 20 years at Intel's other fab”
Workshops:
Two companion workshops will run concurrently prior to the start of the conference on Monday September 8, 2014:
  • Compact Modeling "Enabling Better Insight of Device Features"
    Organizer: Mitiko Miura-Mattausch (Hiroshima University)
  • Carrier Transport in Nano-Transistors: Theory and Experiments
    Organizer: Hideaki Tsuchiya (Kobe University) and Yoshinari Kamakura (Osaka University)
Abstract Submission: 
Authors are invited to submit a two-page abstract (A4 or 22×28cm) including figures. Full submission information is available at the ing web page: <https://sites.google.com/site/sispad2014/>. Authors of accepted papers will be notified by May 15, 2014. Camera-ready copy of a four-page manuscript will be required from the authors for inclusion in the Conference Proceedings by June 30, 2014.

Deadline for submission of abstract: March 31, 2014

Mar 5, 2014

Chip in Aracaju 2014 - Call for Papers


27th SBCCI 2014 29th SBMICRO 2014 4th WCAS 2014
September 1st to 5th 2014, Aracaju (SE), Brazil
         

CHIP IN ARACAJU 2014 Conference to be held in the city of Aracaju, Brazil, from September 1st to 5th 2014. The conference co-locates two main symposia (SBCCI, SBMicro), one student forum (SFORUM), one workshop (WCAS) and the industrial exhibition.

27th SBCCI (Symposium on Integrated Circuits and Systems Design) is an international symposium with an estimated attendance of about 200 experts from academia and industry. Among those 25% are expected to come from outside Brazil. This symposium represents the main event in chip design and design automation in Brazil. It is co-sponsored by the Brazilian Computing Society (SBC), the Brazilian Microelectronics Society (SBMicro), ACM SigDA and, the IEEE Circuits and Systems Society (CASS), and IFIP W 10. The proceedings will be published by the IEEE and will remain available at the IEEE Xplore and ACM Digital Library. 
Abstract Submission: March 23th 2014          
Paper Submission Deadline: March 30th 2014
Call for papers: 

SBMicro 2014 (29th Symposium on Microelectronics Technology and Devices) is an international symposium that usually counts with about 100 attendees focusing on process technologies. It is co-sponsored by the Brazilian Microelectronics Society (SBMicro), the Brazilian Computing Society (SBC), the Electrochemical Society (ECS) and, the IEEE Electron Devices Society (EDS). The proceedings will be published by the IEEE and ECS Digital Library.
Submission Deadline: March 31th 2014        
Notification of Acceptance: May 18th, 2014
Call for papers: 

WCAS 2014 (4th Workshop on Circuits and System Design) is devoted to the presentation and discussion of design experiences with a high degree of relevance in industrial and educational contexts, as well as innovative design methodologies and applications of specific design technologies in an industrial context. The main idea of the workshop is to offer the chance (primarily to industry) of pointing out to the community real-life design and technology challenges that should be addressed in the short-to-medium term.
Submission deadline (2 to 4 pages): June 1st 2014        
Acceptance notification: July 13th
SFORUM 2014 (14th Microeletronics Students Forum) is an event promoted by the Brazilian Microelectronics Society (SBMicro) and the Brazilian Computer Society (SBC).
Paper Submission Deadline:June 2nd 2014         
Notification of Acceptance: July 16th, 2014
Call for papers: 

Companies and Industries: In addition to the technical sessions associated with the regular papers, each symposium normally invites 6 distinguished speakers to present tutorials and invited talks on state-of-the art topics. Furthermore, traditionally, the conference includes an exhibition with stands for microelectronics and
electronic vendors.

Mar 3, 2014

[mos-ak] [Final Program] Spring MOS-AK Workshop in London

Spring MOS-AK Workshop in London
Together with the workshop host, Prof. Bal Virdee, Londonmet, FIET MIEEE, and Prof. Mike Brinson, Londonmet, as well as Extended MOS-AK/GSA TPC Committee, we have pleasure to invite to the spring MOS-AK Workshop in London

Venue:
London Metropolitan University 
166-220 Holloway Road
London N7 8DB

with On-line Free Registration 
  • March 28, 2013
    • 9:00-9:30 Open On-site Registration 
    • 9:30-12:00 Morning Session
    • 13:00-16:00 Afternoon Session
    • 17:00-19:00 Welcome Reception and Networking
  • March 29, 2013
    • 9:00-12:00 Qucs and ngspice GPL circuit simulation session

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Feb 22, 2014

14 Free Resources To Learn About MOSFETs


Metal Oxide Field Effect Transistors (MOSFET) are commonly used for amplifying or switching electronic signals. They have a wide usage in the field and learning about these is crucial for any electronic engineer. So, with that in mind, here are 14 resources that will get you up and running!

[Tutorials, Videos, Free Reference Materials at efytimes.com]

Custom IC Design & Device Modeling - Tools and Technologies


Synopsys University Symposium

Friday, March 7; 9:00 a.m. to 5:30 p.m; The Lalit New Delhi Hotel

The Synopsys University Symposiums are for members of the academic community to get the latest information on design automation solutions, methodologies and standards. These FREE technical seminars are a resource to help accelerate innovation. Join us at this symposium to learn how you can achieve the highest value and productivity from your Synopsys tool investment.

Device Modeling
With growing device and design complexity, device-circuit co-design is becoming an increasingly important area of research. Today, devices and circuits are designed and optimized together for superior performance, yield and reliability. Synopsys TCAD tools are indispensable for device design and optimization.

[Agenda on-line]

Feb 20, 2014

postdoc position in Spain related to semiconductor device modeling

As Professor in the Universitat Rovira i Virgili (Tarragona, Catalonia, , Spain), I am going to apply for a postdoctoral position (funded by the Spanish Ministry) related to modeling (in particular compact modeling) and/or parameter extraction of emerging devices we are targeting, such as Multi-Gate MOSFETs, junctionless nanowires, III-V MOSFETs, GaN HEMTs, Tunnel FETs, and also organic and metal oxide TFTs.

The candidate should be a person who holds a PhD as awarded after September 1 2009, or who is committed to defend his Ph D thesis in the coming months (before the start of the contract).

Contracts are expected to start after September 2014.
The candidate should have enough research experience in the field of semiconductor devices, and must have a very good knowledge of the physics of electron devices. The research project to be carried out can be adapted to the candidate's profile.

The work may continue the work we did in the framework of some EU-funded projects, such as COMON (about Multi-Gate MOSFETs, GaN HEMTs, and High Voltage MOSFETs), SQWIRE (junctionless Si nanowires) and FlexNET (organic TFTs) . Our contribution in these projects was the physics and modeling (in particular compact modeling) of the novel devices addressed by these European projects.

The postdoc position, which will be a contract, will have a duration of up to 2 years. The net salary will be around 1900 Euro/months.

Interested applicants should send me their CV by e-mail.
DEADLINE TO RECEIVE APPLICATIONS: February 24 2014

MY E-MAIL ADDRESS IS: benjamin.iniguez@urv.cat

Address:
Benjamin Iñiguez
Nanoelectronics and Photonics Systrems Group (NEPHOS)
Department of Electronic Engineering
Universitat Rovira i Virgili (URV)
Avinguda dels Paisos Catalans 26
43007 Tarragona, Catalonia
SPAIN.

Feb 7, 2014

Standards For FinFETs

   http://electronicdesign.com/eda/synopsys-rich-goldman-explains-effects-standards-2014s-semiconductor-trends 

Rich Goldman, VP of corporate marketing and strategic alliances at Synopsys, recently predicted the top five trends that are likely to drive the global semiconductor industry in 2014. Standards will help, or hurt, each of these trends.

The ever-changing semiconductor industry has experienced and will continue to experience megatrends like no other industry. Recently, Rich Goldman, vice president of corporate marketing and strategic alliances at Synopsys, made his predictions about the top five trends that are likely to drive the global semiconductor industry in 2014. Each of these trends can be helped, or hurt, by the domain of standards.

Standards For FinFETs

Karen: You predict that FinFETs will be one of the top five trends in 2014. FinFETs promise lower power consumption and higher performance. Designing and manufacturing FinFETs involve a slew of challenges. How can standards help overcome some of them?

Rich: EDA tools and models are advancing to handle the unique properties and behaviors of FinFETs. For each step in the design cycle, data is transferred from one tool to another. Enabling interoperability and modeling are obvious roles for standards to play and there are already several standards in use today. For example, the Liberty library modeling standard is used to develop FinFET libraries that feed logic synthesis and other advanced tools. Standards for describing low-power design intent are also important. Because low power consumption is a key feature of FinFETs, designers can benefit from using these during the power planning stage. The Unified Power Format (UPF) (IEEE Std. 1801) is effective in capturing the low-power design intent and directing the EDA tools to implement it. The biggest advancements in standards for FinFETs are in the Interconnect Technology Format (ITF) standardized by the IEEE-ISTO and in the new BSIM-CMG (CMOS Multi-Gate) SPICE model.

Karen: Are these standards sufficient for FinFETs today?

Rich: Standards for advanced semiconductor design, including FinFETs, should always evolve. While the standards may suffice for a given technology or geometry node, design and EDA engineers are constantly inventing more effective ways of overcoming challenges. As these engineers learn new techniques, the standards for interoperability and modeling need to be enhanced. It’s a cyclical situation. The standards enable new designs that can render the standards obsolete unless the standards are updated to include new methods and technology. Thus, standards working groups, comprised of tech-savvy engineers and experts in standards development, are part of the overall success of new technologies such as FinFETs.

Feb 5, 2014

New i-MOS Release

http://i-mos.org/
A new release of the interactive Modeling and On-line Simulation Platform (i-MOS), version 201401 is available online. In this release, the i-MOS team launched several new services, as well as improved some modules in previous versions. A list of these new features follows:

  • Evaluative support for BSIM3 with newly designed interfaces;
  • A collection of model parameter cards for your applications;
  • A newly implemented double-gate/FinFET model SDDGM; 
  • Parameter searching function for all the device models;
  • Integrated text editor for composing netlists in circuit simulations;
  • Easier entry for your posting of news and events, etc.

For more details and an updated user manual, please see http://i-mos.org

Other related compact/SPICE modeling events and news are listed at:
http://i-mos.org/imos/resources

Feb 4, 2014

[Call for Papers] SISPAD2014

https://sites.google.com/site/sispad2014/

This is a call for papers for the 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD2014), to be held September 9-11, 2014, in Yokohama, Japan. This conference provides an opportunity for the presentation and discussion of the latest advances in modeling and simulation of semiconductor devices, processes, and equipment for integrated circuits.

Abstract submission deadline is March 31, 2014.

Workshops:
Two companion workshops will run concurrently prior to the start of the conference on Monday 8th September 2014:

  • Workshop 1: Compact Modeling -Enabling Better Insight of Device Features-
    Organizer: Mitiko Miura-Mattausch (Hiroshima University)
  • Workshop 2: Carrier Transport in Nano-MOS Transistors: Theory and Experiments(tentative)
    Organizer: Hideaki Tsuchiya (Kobe University) and Yoshinari Kamakura (Osaka University)

Plenary Speakers:

  • Augusto Benvenuti (Micron Technology)
    Current status and future prospects of non-volatile memory modeling
  • Massimo V. Fischetti (University of Texas at Dallas)
    Physics of electronic transport in low-dimensionality materials forfuture FETs
  • Kimimori Hamada (Toyota Motor Corporation)
    TCAD challenge on development of power semiconductor devices for automotive applications

Invited Speakers:

  • Mario Ancona (Naval Research Laboratory)
    Nonlinear thermoelectroelastic simulation of III-N devices
  • Asen Asenov (University of Glasgow)
    Progress in the simulation of time dependent statistical variability in nano CMOS transistors
  • Jean-Pierre Colinge (Taiwan Semiconductor Manufacturing Company)
    Nanowire transistors: pushing Moore's law to the limit
  • Tibor Grasser (Vienna University of Technology)
    Advanced modeling of charge trapping: RTN, 1/f noise, SILC, and BTI
  • Kohji Mitsubayashi (Tokyo Medical and Dental University)
    Novel biosensing devices for medical applications
  • Christian Sandow (Infineon Technologies)
    Exploring the limits of the safe operation area of power semiconductor devices
  • Mark Stettler (Intel Corporation)
    Device and process modeling: 20 years at Intel's other fab

Feb 3, 2014

Call for IJNM papers: Noise modeling of high-frequency semiconductor devices

INTERNATIONAL JOURNAL OF NUMERICAL MODELLING: ELECTRONIC NETWORKS, DEVICES AND FIELDS Int. J. Numer. Model. (2014)

Call for IJNM papers: Noise modeling of high-frequency semiconductor devices 

Noise processes in solid-state active devices often determine their fundamental operational limits. This is especially true in situations where a device operates under tight sensitivity and accuracy constraints, as is the case in satellite communication systems, aerospace instrumentation, and deep-space radio astronomy. Today’s ultra-high frequency transistors that meet these demanding low-noise performance characteristics often leverage progressive device downscaling techniques in conjunction with improved semiconductor alloys. 
To enable the design of next-generation low-noise devices, however, accurate and flexible models that characterize the connection between the physics of microscopic noise processes and measurable macroscopic performance are called for. The objective of this Special Issue is to collect and disseminate recent results addressing the topic of modeling and simulation of the macroscopic noise performance of high- frequency transistors including but not limited to GaAs-based and GaN-based field-effect transistors, Si metal–oxide–semiconductor FETs and FinFETs, InP-based high-electron-mobility transistors, and GaAs and SiGe heterojunction bipolar transistors. It is worth pointing out that because of frequency up-conversion phenomena caused by a device’s nonlinearities, low frequency noise processes may strongly impact microwave and millimeter wave behavior as well. Contributions focusing on low-frequency noise modeling therefore will be considered as well. 
This issue will include both invited and contributed manuscripts.
Manuscripts for this Special Issue should adhere to the requirements for regular papers of the IJNM as specified in the Author Guidelines at 
Potential contributors may contact the Guest Editors to determine the suitability of their contribution to the Special Issue. All manuscripts should be submitted via the IJNM’s manuscript website, with a statement that they are intended for this Special Issue. 

Guest Editors: 
Prof. Alina Caddemi University of Messina, Italy Email:
Prof. Ernesto Limiti University of Rome Tor Vergata, Italy Email:

Manuscript submission deadline: July 31, 2014

Jan 21, 2014

Compact DC Modeling of Organic Field-Effect Transistors: Review and Perspectives

In spite of impressive improvements achieved for organic field-effect transistors (OFETs), there is still a lack of theoretical understanding of their behaviors. Furthermore, it is challenging to develop a universal model that would cover a huge variety of materials and device structures available for state-of-the-art OFETs. Nonetheless, currently there is a strong need for specific OFET compact models when device-to-system integration is an important issue. We briefly describe the most fundamental characters of organic semiconductors and OFETs, which set the bottom line dictating the requirement of an original model different from that of conventional inorganic devices. Along with an introduction to the principles of compact modeling for circuit simulation, a comparative analysis of the reported models is presented with an emphasis on their primary assumptions and applicability aspects. Critical points for advancing OFET compact models are discussed in consideration of the recent understanding of device physics.

[1] Kim, C.-H.; Bonnassieux, Y.; Horowitz, G., "Compact DC Modeling of Organic Field-Effect Transistors: Review and Perspectives," Electron Devices, IEEE Transactions on , vol.61, no.2, pp.278,287, Feb. 2014
doi: 10.1109/TED.2013.2281054
URL

Jan 18, 2014

[Final Program] EUROSOI 2014, Tarragona, Catalonia, Spain; January 27-29, 2014

The 10th Workshop of the Thematic Network
on Silicon on Insulator Technology, Devices and Circuits 
(EUROSOI 2014
Tarragona, Catalonia, Spain 
January 27-29, 2014 

The EUROSOI Workshop is an international forum to promote interaction and exchangesbetween research groups and industrial partners involved in SOI activities all over the world. Following the lively experience of the previous meetings in Granada (2005), Grenoble (2006), Leuven (2007), Cork (2008), Gšteborg (2009), Grenoble (2010), Granada (2011), Montpellier (2012), Paris (2013), EUROSOI 2014 will be held in Tarragona, Catalonia, Spain, and will include a short course program, oral and poster sessions, outstanding key-note presentations, as well as ample rooms for informal discussions. EUROSOI covers recent progress in SOI technologies and will be of interest to materials and device scientists, as well as to process, circuits and applications oriented engineers.

Monday, January 27, 2014

8:30 REGISTRATION
9:05-9:20 SHORT COURSE OPENING
9:20-11:00 PART 1 - EDS MINI-COLLOQUIUM ON SOI TECHNOLOGY 
9:20-10:10 "Process Challenges for Advanced Ge CMOS Technologies" Cor Claeys (IMEC, Leuven, Belgium)
10:10-11.00 "From Floating-Body Memory to Unified Memory on SOI" Sorin Cristoloveanu (INPG, Grenoble, France)
11:00-11:30 COFFEE BREAK
11:30-12:20 "Fabrication Challenges for sub-10 nm Technology nodes" Michael Ostling (KTH, Stockholm, Sweden)
12:20-13:00 "ESD protection of FD and MuG SOI CMOS Chips" Dimitris Ioannou (George Mason University, Fairfax, VA, USA)
13:00-14:30 LUNCH
14:30-15:50 Part 2 -EUROSOI TUTORIAL 
14:30-15:20 "Advanced SOI MOSFET architectures" Jason Woo (UCLA, CA, USA)
15:20-16:00 "SOI CMOS sensors, transistors and circuits for ultra-low-power and harsh environment applications" Denis Flandre (UCL, Louvain-la-Neuve, Belgium)
16:00-16:30 COFFEE BREAK
16:30-18:00 SOI MOSFET CHARACTERIZATION 
16:30-17:20 "On the threshold voltage and interface coupling in advanced SOI MOSFETs" Tamara Rudenko (ISP, Kyiv, Ukraine)
17:20-18:00 "From SOI MOSFET to Spin MOSFET: a modeling approach" Viktor Sverdlov (Tu-Wien, Austria)
20:30 EUROSOI RECEPTION

Tuesday January 28, 2014 

8:15 REGISTRATION
8:45-9:00 OPENING
9:00-11:00 PLENARY SESSIONS 
9:00-9:40 "Taking the next step on advanced HKMG SOI technologies -from 32 nm PD SOIvolume production to 20/28 FD SOI and beyond" Manfred Horstmann (Globalfoundries, Dresden, Germany) invited talk
9:40-10:20 INVITED TALK 
Heike Riel (IBM Research, Zurich) -invited talk
10:20-11:00 "Beyond Si CMOS: Benefits and Challenges " Rafael Rios (Intel, Portland OR, USA) -invited talk
11:00-11:20 COFFEE BREAK
11:20-13:00 SOI MATERIALS TECHNOLOGY AND CHARACTERIZATION 
11:20-11:40 Process and performance of Copper TSVs Lado Filipovic et al.
11:40-12:00 Increasing mobility and spin lifetime with shear strain in thin silicon films Dmitri Osintsev et al.
12:00-12:20 A Comparative Study of Variability of RTN Power Spectral Densities in Bulk and SOIMOSFETs  Louis Gerrer et al.
12:20-12:40 Low temperature noise spectroscopy of p-channel SOI FinFETs Bogdan Cretu et al.
12:40-13:00 Channel Length Influence on the Low-Frequency Noise of Strained 45o Rotated Triple Gate SOI nFinFETs Marcio Alves Sodre de Souza et al.
13:20-14:10 LUNCH
14:10-15:50 SOI MOSFET TECHNOLOGY 
14:10-14:30 Impact of S/D doping profile into electrical properties in nanoscaled UTB2SOI  devices Carlos Sampdero et al.
14:30-14:50 TCAD investigation on a formal Neuron device in 28nm UTBB FDSOI technology Philippe Galy et al.
14:50-15-10 Dual ground plane for high-voltage MOSFET in UTBB FDSOI Technology Antoine Litty et al.
15:10-15:30 Trigate NanoWire MOSFETs Analog Figures of Merit Kilchytska, Valeriya et al.
15:30-15:50 Electrostatically-doped SL FET optimized to meet all the ITRS power targetsat V_DD=0.4 V Elena Gnani et al.
15:50-16:00 COFFEE BREAK
16:00-17:20 SOI MOSFET CHARACTERIZATION 
16:00-16:20 Enhanced Dynamic Threshold Voltage UTBB SOI nMOSFETs Katia Sasaki et al.
16:20-16:40 Parasitic bipolar effect in advanced FD SOI MOSFETs: experimental evidence andgain extraction Fanyu Liu et al.
16:40-17:00 Impact of Lateral Fin-Width Non-Uniformity of FinFETs Clarissa Prawoto et al.
17:00-17:20 Surface effects on split C-V measurements on SOI wafers Luca Pirro et al.
17:20-17:40 Impact of Self-Heating on UTB MOSFET ParametersS ergej Makovejev at al.
17:40-18:00 POSTER BRIEFING (3 MIN EACH) 
18:00-19:40 POSTER SESSION 
Subthreshold Behavior of the PD SOI NMOS Device Considering BJT and DIBL Effects James Kuo et al.
Investigation of Statistical Effects on Reliability of SOI FinFETs Including Sidewall Crystal Orientation Salvatore Amoroso et al.
Powering the More than Moore Electronics with i-MOSLining Zhang et al.
Analysis of Short-Channel Effect in SOTB-MOSFET for Ultra-Low Power Applications Hidenori Miyamoto et al.
2D Analytical Modeling of the Trap-Assisted-Tunneling Current in Double-GateTunnel-FETs Michael Graef et al.
Improved Compact Current Model for FinFETs Based in a New Geometric Approach Arianne Pereira et al.
Capability of the IDS Analytical Model on Predicting the Diamond Variability by Usingthe F-Test Statistic Evaluation Salvador Gimenez et al.
An appraise of the sources of electrical parameters variation in DGMOS Rodrigo Picos et al.
An analytical model for the inversion charge distribution in GAA MOSFETs with rounded corners Francisco Ruiz et al.
The Negative World-line Holding Bias Effect on the Retention Time in FBRAMs Sara Santos et al.
20:30 GALA DINNER

Wednesday January 29, 2014 

8:30-10:30 SOI MOSFET MODELLING 
8:30-8:50 Comprehensive Low-Field Mobility Modeling in Nano-Scaled SOI Channels Zlatan Stanojevic et al.
8:50-9:10 A comprehensive DC current model to describe FinFET self-heating effects Benito Gonz‡lez et al.
9:10-9:30 Channel-Length Impact on Supercoupling Effect in FD-MOSFETs Carlos Navarro et al.
9:30-9:50 Substrate Effect on Threshold Voltage of long and short channel UTBB SOI nMOSFETs Joao Martino et al.
9:50-10:10 In depth characterization of electron transport in 14nm FD-SOI nMOS devices Minju Shin et al.
10:10-10:30 Role of the gate in ballistic nanowire SOI MOSFET Anurag Mangla et al.
10:30-10:50 COFFEE BREAK
10:50-13:10 CIRCUITS, MEMORIES AND SENSORS 
10:50-11:30 "Future of Multi-gate CMOS Technology" Hiroshi Iwai (University of Tokyo, Japan)
11:30-11:50 Impact of SEU on Bulk and FDSOI CMOS SRAM Walter Enrique Calienes Bartra et al.
11:50-12:10 Mechanical Characterization and Modelling of Lorentz Force Based MEMS Magnetic Field Sensors Petros Gkotsis et al.
12:10-12:30 Performance of Source-Follower Buffers Implemented with Junctionless Nanowire nMOS Transistors Michelly Souza et al.
12:30-12.50 PMOSFET-based Pressure Sensors in FD SOI Technology Benoit Olbrechts et al.
12:50-13:10 Performance of Common-Source current mirrors with asymmetric self-cascode SOInMOSFETs  Rafael Assalti et al.
13:10-14:20 LUNCH
14:20-16:10 BEYOND CMOS: NANOWIRES AND JUNCTIONLESS TRANSISTORS 
14:20-15:00 "2D semiconductor channels for ultimate thickness scaling and other versatile applications" Athanasios Dimoulas (IMS, Demokritos, Athens, Greece)
15:00-15:20 A way to solve Poisson equation en cylindrical coordinates to obtain a compact model for Junctionless Gate All Around MOSFET Franois Lime et al.
15:20-15:40 Explicit analytical charge and capacitance models for Junctionless Surrounding GateTransistors  Oana Moldovan et al.
15:40-16:00 Performance Evaluation of Stacked Gate-All-Around MOSFETs Meng-Hsueh Chiang et al.
16:00-16:20 Modeling of Quantization Effects in Nanoscale DG Junctionless MOSFETs Thomas Holtij et al.
16:20-16:30 COFFEE BREAK
16:30-16:50 BEYOND CMOS (TFETs) 
16:30-16:50 Heterojunction TFET inverters providing better performance than multi-gate CMOS at sub 0.3V Vdd Elena Gnani et al.
16:50-17:10 Transport mechanism influence on Vertical Nanowire-TFET analog performance as a function of temperature Paula Agopian et al.
17:10-17:30 3D Modeling of Direct Band-to-Band Tunneling in Nanowire TFETs. Lidija Filipovic et al.
17:30-17:50 Influence of the gate oxide thickness on the Analog Performance of vertical Nanowire-Tunnel FETs with Ge Source Felipe Neves et al.
17:50-18:10 Influence of a precisely positioned channel dopant on the performance of gate-allaround Si nanowire transistor: a full 3D NEGF simulation study Vihar Georgiev et al.
18:10-18:20 CONCLUSIONS AND ANNOUNCEMENTS 



Jan 15, 2014

[Final Program] 11th International Workshop on Compact Modeling

11th International Workshop on Compact Modeling (IWCM 14)
January 23 (Thursday), 2014
Suntec Singapore Convention and Exhibition Centre (Room 309)

Workshop Program
9:00-9:10am Welcome address
Mansun Chan (workshop chair)

Session I: Modeling for Compact Semiconductor
Session Chair: Lining Zhang

9:10-9:35am Challenges and Prospects of Compact Modeling for Future Generation III-V/Si Co-integrated ULSI Circuit Design
Xing Zhou, Siau Ben Chiah, Binit Syamal, Hongtao Zhou, Arjun Ajaykumar, and Xu Liu; Nanyang Technological University, Singapore
9:35-10:00am A Large Signal Model for InP/InGaAs Double Heterojunction Bipolar Transistors
Yan Wang and Yuxia Shi; Tsinghua University, China
10:00-10:25am Analytical Modeling for AlGaN/GaN HEMTs
Aixi Zhang, Lining Zhang, Zhikai Tang, Xiaoxu Cheng*, Yan Wang*, Kevin J. Chen, and Mansun Chan; The Hong Kong University of Science and Technology, Hong Kong, China; *Tsinghua University, China

10:25-10:40am Break

Session II: Non-Classical Device Modeling and Platform
Session Chair: Xing Zhou

10:40-11:05am Developing i-MOS as a Compact Model Standardization Platform
Lining Zhang and Mansun Chan; The Hong Kong University of Science and Technology, Hong Kong, China
11:05-11:30am An Analytic Model for Nanowire Tunnel-FETs
Ying Liu, Jin He, Mansun Chan*, Caixia Du**, Yun Ye, Wei Zhao, Wen Wu and Wenping Wang; Peking University Shenzhen SOC Key Laboratory, China; *The Hong Kong University of Science and Technology, Hong Kong, China; **Shenzhen Huayue Teracale Chip Electronic Limited Co., China
11:30-11:55am A Channel Potential Based Model for SiO2- Core Si-Shell SRGMOSFET
Xiangyu Zhang, Jin He, Mansun Chan*, Caixia Du**, Yun Ye, Wei Zhao, Wen Wu and Wenping Wang; Peking University Shenzhen SOC Key Laboratory, China; *The Hong Kong University of Science and Technology, Hong Kong, China; **Shenzhen Huayue Teracale Chip Electronic Limited Co., China

11:55am-2:00pm Lunch

Session III: Power Device Modeling
Session Chair: Young June Park

2:00-2:25pm Compact Modeling of the Reverse Recovery Effect in LDMOS Body Diode (Invited)
M. Miyake; Hiroshima University, Japan
2:25-2:50pm Compact Modeling of the SiC IGBT Including the Switching at High Temperature
K. Matsuura, M. Miura-Mattausch, M. Miyake and H. J. Mattausch; Hiroshima University, Japan
2:50-3:15pm Experimental Verification of Power MOSFET Model under Switching Operations
A. Saito, M. Miura-Mattausch, M. Miyake, T. Umeda and H.J. Mattausch; Hiroshima University, Japan

3:15-3:30pm Break

Session IV: Reliability Modeling
Session Chair: Jin He

3:30-3:55pm 3D Monte Carlo Reaction-Diffusion Simulation Framework to model Time Dependent Dielectric Breakdown in BEOL Oxide
Seong Wook Choi and Young June Park; Seoul National University, Korea
3:55-4:20pm Development of NBTI and Channel Hot Carrier (CHC) Effect Models and their Application for Circuit Aging Simulation
Chenyue Ma, Hans Jürgen Mattausch, Kazuya Matsuzawa*, Seiichiro Yamaguchi*, Teruhiko Hoshida*, Masahiro Imade*, Risho Koh*, Takahiko Arakawa* and Mitiko Miura-Mattausch; Hiroshima University, Japan; * Semiconductor Technology Academic Research Center, Japan
4:20-4:45pm Modeling of the Surface Charges on Au Electrode Including Pseudocapacitance
Jooseong Kwon, Intae Jeong, Sungwook Choi and Young June Park; Seoul
National University, Korea

4:45-4:55pm Closing Remarks
Hans Juergen Mattausch (workshop co-chair)

Jan 13, 2014

The FD-SOI Papers at IEDM ’13

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The FD-SOI Papers at IEDM ’13

Posted by on December 16, 2013
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FD-SOI was a hot topic at this year’s IEEE International Electron Devices Meeting (IEDM) (www.ieee-iedm.org), the world’s showcase for the most important applied research breakthroughs in transistors and electronics technology.
The FD-SOI papers featured high performance, low leakage, ultra-low power (0.4V),  excellent variability, reliability and scalability down to the 10 nm node using thin SOI and thin BOX substrate. Performance boosters using high mobility materials such as thin strain Si, Ge, and III-V on-Insulator were also presented.
Brief summaries of the FD-SOI papers, culled from the Advance Program (and some of the actual papers) follow.
9.2 High Performance UTBB FDSOI Devices Featuring 20nm Gate Length for 14nm Node and Beyond (STMicroelectronics, Leti, IBM, Renesas, Soitec, GlobalFoundries)
This was the big paper reporting on ST’s flavor of high-performance FD-SOI (UTBB, which stands for ultra-thin-body-and-box) with 20nm gatelength, which target the 14nm node. In addition to excellent results, the paper demonstrated that  “…FD-SOI reliability is superior to Bulk devices.”
ST_IEDM13table1
[8] C. Auth, et al, VLSI, p.131, 2012 [9] C.-H. Jan, et al, IEDM, p.44, 2012

Specifically, the alliance reports, for the first time, on high performance UTBB FD-SOI devices with a gate length (LG) of 20nm and BOX thickness (TBOX) of 25nm, featuring dual channel FETs (Si channel NFET and compressively strained SiGe channel PFET). Competitive effective current (Ieff) reaches 630μA/μm and 670μA/μm for NFET and PFET, respectively, at off current (Ioff) of 100nA/μm and Vdd of 0.9V.
Excellent electrostatics are obtained, demonstrating the scalability of these devices to14nm and beyond. Very low AVt (1.3mV•μm) of channel SiGe (cSiGe) PFET devices is reported for the first time. BTI was improved >20% vs a comparable bulk device. The paper concludes with evidence of continued scalability to 10nm 
ST_IEDM13_Fig4
and below.
The effective current (Ieff), as a function of Ioff, is shown in Fig. 4. At Vdd=0.9V, NFET/PFET Ieff reach 630/670μA/μm at Ioff=100nA/μm, respectively. They are the best performing FDSOI CMOS devices reported so far, featuring non-strained Si channel NFET and strained SiGe channel PFET.”
7.3 Innovative ESD protections for UTBB FD-SOI Technology (STMicroelectronics, IMEP-LAHC)
ESD (electrostatic discharge) protection is often cited as a challenge in FD-SOI, and the ESD devices are typically put into a “hybrid” section of the chip, where the top silicon and insulator are etched away exposing the “bulk” silicon base wafer. In this paper, however, the ST-IMEP team presented FD-SOI ESD protection devices that achieve “remarkable performance in terms of leakage current and triggering control.” They demonstrate “ultra-low leakage current below 0.1 pA/μm and adjustable triggering (1.1V < Vt1 < 2.6V) capability. These devices rely on gate-controlled injection barriers and match the 28nm UTBB-FDSOI ESD design window by triggering before the nominal breakdown voltage of digital core MOS transistors.”

7.4 Comparison of Self-Heating Effect (SHE) in Short-Channel Bulk and Ultra-Thin BOX SOI MOSFETs: Impacts of Doped Well, Ambient Temperature, and SOI/BOX Thicknesses on SHE (Keio University, AIST)
This paper refutes those who say that the self-heating effect (SHE) is a bigger concern for SOI-based devices than bulk. The researchers investigated and compared bulk and SOI FETs including 6-nm ultra-thin (UT) BOX devices. They clarified, for the first time, that SHE is not negligible in bulk FETs, mainly due  to a decrease in the thermal conductivity of the more heavily doped well.  They found that the channel temperature of 6-nm UT BOX SOI FETs is close to that of bulk FETs at a chip temperature under operations. They then proposed a thermal-aware FD-SOI device design structure based on evaluated BOX/SOI thickness dependences of SHE. They concluded that SHEs in UTBB FETs with raised S/D and/or contact pitch scaling could be comparable to bulk FETs in deeply scaled nodes.

20.3 Gate-Last Integration on Planar FDSOI MOSFET: Impact of Mechanical Boosters and Channel Orientations  (Leti, ST)
This paper presents the industry’s first “gate last” (GL) results for FD-SOI, with ultra-thin silicon body (3-5nm) and BOX (25nm).  The team successfully fabricated transistors down to the 15nm gate length, with metal-last on high-k first (TiN/HfSiON). They thoroughly characterized the gate stack (reliability, work-function tuning on Equivalent Oxide Thickness EOT=0.85nm) and transport (hole mobility, Raccess) for different surface and channel orientations. They report excellent Ion, p=1020μA/μm at Ioff, p=100nA/μm at Vdd=0.9V supply voltage for <110> pMOS channel on (001) surface with in-situ boron doped SiGe Raised Source and Drain (RSD) and compressive CESL. They cite the high efficiency of the strain transfer into the ultra-thin channel (-1.5%), as evidenced by physical strain measurements by dark field holography.

12.4 UTSOI2: A Complete Physical Compact Model for UTBB and Independent Double Gate MOSFETs (ST, Leti)
Compact models of transistors and other elementary devices are used to predict the behavior of a design. As such, they are embedded in simulations like SPICE that designers run before actual manufacturing. In this paper, ST and Leti researchers presented a complete physical compact model called UTSOI2, which is dedicated to Ultra-Thin Body and Box FD-SOI technology, and is able to describe accurately independent double gate operation for sub-20nm nodes. It meets standard Quality and Robustness tests for circuit design applications.
12.5 Mobility in High-K Metal Gate UTBB-FDSOI Devices: From NEGF to TCAD Perspectives (Invited) (ST, Leti, U. Udine, Synopsys, Laboratoire Hubert Curien & Institut d’Optique, IBM)
This paper reviews important theoretical and experimental aspects of both electrostatics and channel mobility in High-K Metal Gate UTBB-FDSOI MOSFETs. With an eye toward optimization, the team presents a simulation chain, including advanced quantum solvers, and semi-empirical Technology Computer Assisted Design (TCAD) tools.

33.2 Suppression of Die-to-Die Delay Variability of Silicon on Thin Buried Oxide (SOTB) CMOS Circuits by Balanced P/N Drivability Control with Back-Bias for Ultralow-Voltage (0.4 V) Operation (LEAP, U. Tokyo)
SOTB is what Hitachi calls its flavor of FD-SOI.  The researchers point out that small-variability transistors like SOTB are effective for reducing the operation voltage (Vdd). This paper proposes the balanced n/p drivability for reducing the die-to-die delay variation by back bias for various circuits. Excellent delay variability reduction by this n/p balanced control is demonstrated at ultra-low Vdd of 0.4 V.

2.8: Co-Integration of InGaAs n- and SiGe p-MOSFETs into Digital CMOS Circuits Using Hybrid Dual-Channel ETXOI Substrate (IBM)
ETSOI is IBM’s flavor of FD-SOI, and this paper is about FD-SOI devices using high mobility material for boosting performance. The presenters “demonstrate for the first time on the same wafer and on the same device level a dense co-integration of co-planar nano-scaled SiGe p-FETs and InGaAs n-FETs UTBB FETs. This result is based on hybrid substrates containing extremely-thin SiGe and InGaAs layers on insulators (ETXOI) using double bonding.” They showed a) that it could be done; b) it’s viable hybrid high-mobility dual-channel CMOS; c) it still supports back-biasing for Vt tuning.

5.2 Surface Roughness Limited Mobility Modeling in Ultra-Thin SOI and Quantum Well III-V MOSFETs  (DIEGM – U. Udine)
As with the IBM paper (2.8) above, this paper is about FD-SOI devices using high mobility material for boosting performance. The abstract explains, “This paper presents a new model for surface roughness mobility accounting for the wave-function oxide penetration and can naturally deal with Hetero-Structure. Calibration with experiments in Si MOSFETs results in a r.m.s. value of the SR spectrum in close agreement with AFM and TEM measurements.” The simulated μSR in III-V UTB MOSFETs shows a weaker degradation at small channel thickness (Tw) than predicted by the T6w law observed in UTB Si MOSFETs.
Please stay tuned for a subsequent ASN post that will cover the meeting’s SOI-FinFET, RF-SOI and advanced device papers.  (The papers themselves are typically available through the IEEE Xplore Digital Libary within a few months of the conference.)

An Update on the OpenPDK for IC Design (by Daniel Payne)

IC designers use EDA tools to implement their logical and physical design, and these tools require foundry-specific information for:



  • Design Rule Checking (DRC)
  • Layout Versus Schematic (LVS)
  • Library Symbols
  • Parasitic EXtraction (PEX)


This foundry information is called a Process Design Kit or PDK for short. Now put yourself in the place of the foundry or IDM, and you want to support EDA tools from multiple vendors like: Cadence Design Systems, Mentor Graphics, Synopsys, Silvaco and Tanner EDA. That adds up to a lot of QA and PDK development effort to support so many EDA vendors and tools. There has to be an easier way to create PDKs instead of one vendor at a time.




Read more at the original source

Jan 10, 2014

[mos-ak] [2nd announcement] Spring MOS-AK Workshop in London

Spring MOS-AK Workshop in London
Together with the workshop host, Prof. Bal Virdee, Londonmet, FIET MIEEE, and Prof. Mike Brinson, Londonmet, as well as Extended MOS-AK/GSA TPC Committee, we have pleasure to invite to the spring MOS-AK Workshop in London

Venue:
London Metropolitan University 
166-220 Holloway Road
London N7 8DB

Important Dates:
  • Call for Papers - Dec 2013
  • 2nd Announcement - Jan. 2014
  • Final Workshop Program - Feb. 2014
  • MOS-AK Workshop - March 28-29 2014
R&D topics to be covered include the following:
  • Advances in semiconductor technologies and processing
  • Compact Modeling (CM) of the electron devices
  • Verilog-A language for CM standardization
  • New CM techniques and extraction software
  • CM of passive, active, sensors and actuators
  • Emerging Devices, CMOS and SOI-based memory cells
  • Microwave, RF device modeling, high voltage device modeling
  • Nanoscale CMOS devices and circuits
  • Technology R&D, DFY, DFT and IC Designs
  • Foundry/Fabless Interface Strategies
Abstract Submission:
Authors should submit an abstract using on-line MOS-AK submission form (any related enquiries can be sent to abstract@mos-ak.org)

Postworkshop publications:
selected best MOS-AK technical presentation will be recommended for further publication in a special issue of the International Journal of Numerical Modelling: Electronic Networks, Devices and Fields

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Jan 6, 2014

[mos-ak] [on-line publications] 6th International MOS-AK Workshop Washington DC Dec.11, 2013

Recent, 6th International MOS-AK/GSA Workshop on Dec.11, 2013 in Washington DC was organized to discuss SPICE/compact modeling and its standardization with a freewheeling session to review modeling activities of the CMC, IEEE EDS CMTC, NEEDS NanoHub and MOS-AK Groups. The workshop's presentations are available on-line at <http://www.mos-ak.org/washington_dc_2013/>

Please also distribute further information about next MOS-AK related events among all who are interested in the SPICE/compact modeling:

IWCM at DAC ASP Singapore (SG) Jan. 23, 2014 
http://www.ece.nus.edu.sg/stfpage/elehy/aspdac2014/
Q2 2014 MOS-AK London (UK) March'2014
http://www.mos-ak.org/london_2014/
MIXDES Lwow (UA) June 19-21, 2014
http://mixdes2014.lp.edu.ua/Mixdes3/tekst/view/special
Q3 MOS-AK at 44th ESSDERC / 40th ESSCIRC Venice (I) Sept. 26, 2014
http://www.mos-ak.org/venice_2014/

Already now, I am looking forward to meet you at one of our MOS-AK modeling events, soon.

-- with regards - wladek;
--
Arbeitskreis Modellierung von Systemen und Parameterextraktion 
Modeling of Systems and Parameter Extraction Working Group
--
Over two decades of Enabling Compact Modeling R&D Exchange
--
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