[C4P] MIXDES 2024

The MIXDES conference series started in Dębe near Warsaw in 1994 and has been organized yearly in the most interesting Polish cities. In 2024 we would like to continue the tradition of inviting you to the most attractive places in Poland and the conference will take place in Gdańsk between June 27-29, 2024

In short period of time the conference has become an important event in the Central Europe allowing to discuss the recent research progress in the field of design, modelling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices as well as their interdisciplinary applications.

The topics of the MIXDES 2024 Conference include:

• Design of Integrated Circuits and Microsystems
  Design methodologies. Digital and analog synthesis. Hardware-software co-design. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
• Thermal Issues in Microelectronics
  Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits. 
• Analysis and Modelling of ICs and Microsystems
  Simulation methods and algorithms. Behavioral modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.
• Microelectronics Technology and Packaging
  New microelectronic technologies. Packaging. Sensors and actuators.
• Testing and Reliability
  Design for testability and manufacturability. Measurement instruments and techniques. 
• Power Electronics
  Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
• Signal Processing
  Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
• Embedded Systems
  Design, verification and applications.
• Medical Applications
  Medical and biotechnology applications. Biometrics. Thermography in medicine

Call for Papers and Contributions

A call is made for papers, contributions and other conference activities on the topics mentioned above. Full papers should be submitted till March 1, 2024 - only in electronic form (MS Word, RTF, Open Office Writer, LaTeX, together with a generated PDF file).

The paper submission form and required format is available on our Web page. Authors are asked to indicate the topic into which their papers fall. The papers will be reviewed by at least two referees from the International Programme Committee. The papers will be published in the proceedings from the author's electronic submission.

Tutorials and Special Sessions - Call for Proposals

Several tutorials/special sessions will be held prior to the conference. Authors willing to propose a tutorial at MIXDES 2024 are invited to send a proposal to the Organizing Committee. The proposal should consist of a three-page summary including tutorial title, name and affiliation of the lecturer(s), tutorial objectives and audience, topical outline and provisional schedule of the tutorial.

[paper] MEMS pressure sensors

Xiangguang Han, Mimi Huang, Zutang Wu, Yi Gao, Yong Xia, Ping Yang, Shu Fan, Xuhao Lu, Xiaokai Yang, Lin Liang, Wenbi Su, Lu Wang, Zeyu Cui, Yihe Zhao, Zhikang Li, Libo Zhao

and Zhuangde Jiang

Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging.

Microsyst Nanoeng 9, 156 (2023) 

DOI:10.1038/s41378-023-00620-1

1 State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, China
2 International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi’an Jiaotong University, Xi’an 710049, China.
3 School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China.
4 Northwest Institute of Nuclear Technology, Xi’an 710024, China

Abstract: Pressure sensors play a vital role in aerospace, automotive, medical, and consumer electronics. Although microelectromechanical system (MEMS)-based pressure sensors have been widely used for decades, new trends in pressure sensors, including higher sensitivity, higher accuracy, better multifunctionality, smaller chip size, and smaller package size, have recently emerged. The demand for performance upgradation has led to breakthroughs in sensor materials, design, fabrication, and packaging methods, which have emerged frequently in recent decades. This paper reviews common new trends in MEMS pressure sensors, including minute differential pressure sensors (MDPSs), resonant pressure sensors (RPSs), integrated pressure sensors, miniaturized pressure chips, and leadless pressure sensors. To realize an extremely sensitive MDPS with broad application potential, including in medical ventilators and fire residual pressure monitors, the “beam-membrane-island” sensor design exhibits the best performance of 66 μV/V/kPa with a natural frequency of 11.3 kHz. In high-accuracy applications, silicon and quartz RPS are analyzed, and both materials show ±0.01%FS accuracy with respect to varying temperature coefficient of frequency (TCF) control methods. To improve MEMS sensor integration, different integrated “pressure + x” sensor designs and fabrication methods are compared. In this realm, the intercoupling effect still requires further investigation. Typical fabrication methods for microsized pressure sensor chips are also reviewed. To date, the chip thickness size can be controlled to be <0.1 mm, which is advantageous for implant sensors. Furthermore, a leadless pressure sensor was analyzed, offering an extremely small package size and harsh environmental compatibility. This review is structured as follows. The background of pressure sensors is first presented. Then, an in-depth introduction to MEMS pressure sensors based on different application scenarios is provided. Additionally, their respective characteristics and significant advancements are analyzed and summarized. Finally, development trends of MEMS pressure sensors in different fields are analyzed.

Fig: High-sensitivity MDPS, on-chip amplified MDPS, and resonant MDPS.

Acknowledgements: This study was supported in part by the National Key Research and Development Program of China (2021YFB3203200) and the Natural Scienc Foundation of Shaanxi (2022JQ-554).

[paper] Embedded CMOS SOI UV Sensors

Michael Yampolsky, Evgeny Pikhay and Yakov Roizin

Embedded UV Sensors in CMOS SOI Technology

Sensors 2022, 22(3), 712;

DOI: 10.3390/s22030712

   
Tower Semiconductor, Migdal Haemek 2310502, Israel

Abstract: We report on ultraviolet (UV) sensors employing high voltage PIN lateral photodiode strings integrated into the production RF SOI (silicon on isolator) CMOS platform. The sensors were optimized for applications that require measurements of short wavelength ultraviolet (UVC) radiation under strong visible and near-infrared lights, such as UV used for sterilization purposes, e.g., COVID-19 disinfection. Responsivity above 0.1 A/W in the UVC range was achieved, and improved blindness to visible and infrared (IR) light demonstrated by implementing back-end dielectric layers transparent to the UV, in combination with differential sensing circuits with polysilicon UV filters. Degradation of the developed sensors under short wavelength UV was investigated and design and operation regimes allowing decreased degradation were discussed. Compared with other embedded solutions, the current design is implemented in a mass-production CMOS SOI technology, without additional masks, and has high sensitivity in UVC.

Fig: (a) A string of PIN photodiodes connected in series by silicide N+, P+, and iSi regions. The diodes are connected by butted silicide. The schematic cross section shows only three connected in series PIN diodes. (b) Cross section of a lateral PIN diode with contacts.

[paper] A Review of Sharp-Switching Band-Modulation Devices

Sorin Cristoloveanu¹, Joris Lacord², Sébastien Martinie², Carlos Navarro³, Francisco Gamiz³, Jing Wan⁴, Hassan El Dirani¹, Kyunghwa Lee¹ and Alexander Zaslavsky⁵

A Review of Sharp-Switching Band-Modulation Devices

Micromachines 2021, 12, 1540.

DOI: 10.3390/mi12121540

   
1 IMEP-LAHC, Université Grenoble Alpes (F)
2 CEA, LETI, MINATEC Campus (F)
3 CITIC-UGR, University of Granada (SP)
4 Fudan University, Shanghai (CN)
5 Brown University, Providence (US)

Abstract: This paper reviews the recently-developed class of band-modulation devices, born from the recent progress in fully-depleted silicon-on-insulator (FD-SOI) and other ultrathin-body technologies, which have enabled the concept of gate-controlled electrostatic doping. In a lateral PIN diode, two additional gates can construct a reconfigurable PNPN structure with unrivalled sharp-switching capability. We describe the implementation, operation, and various applications of these band-modulation devices. Physical and compact models are presented to explain the output and transfer characteristics in both steady-state and transient modes. Not only can band-modulation devices be used for quasi-vertical current switching, but they also show promise for compact capacitorless memories, electrostatic discharge (ESD) protection, sensing, and reconfigurable circuits, while retaining full compatibility with modern silicon processing and standard room-temperature low-voltage operation.

Fig: Average subthreshold swing SS vs. normalized ION plot. 

Green points indicate CMOS-compatible materials.

Acknowledgements: The European authors are grateful for support from the EU project REMINDER (H2020-687931). Alexander Zaslavsky acknowledges the support of the U.S. National Science Foundation (award QII-TACS-1936221).

[C4P] FLEPS 2022

Call for Papers

The IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2022) will be held in Vienna, Austria.

IEEE FLEPS 2022 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

Topics of Interest

• Organic/Inorganic Electronic Sensors
• Emerging Materials for Flexible and Printable Systems
• Manufacturing Techniques
• High-throughput Printable Electronics
• Hybrid Flexible Sensors and Electronics
• Stretchable/Shrinkable Sensors and Electronics
• Soft/Smart Wearable and Implantable Sensing Systems
• Disposable/Reusable Sensors and Electronics
• Printed Large-Area Sensors and Systems
• Flexible or Printed Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
• Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
• Simulation and Modelling
• Flexible/Printable Electronics in context with Circular Economy and green electronics

Publication of Papers: Presented papers will be included in the Proceedings of IEEE FLEPS 2022 and in IEEE Xplore pending author requirements being met. Authors may submit an extended IEEE FLEPS 2022 papers to the Special IEEE FLEX Journal Issue.

Exhibition & Patron Opportunities: The Conference exhibit area will provide your company or organization with the opportunity to inform and display your latest products, services, equipment, books, journals, and publications to attendees from around the world.

For further information, contact Coral Miller at Conference Catalysts, LLC.

[paper] MEMS Sensors Reliability

M. Hommel^a, H. Knab^a, S. Galal Yousef^b

Reliability of automotive and consumer MEMS sensors - An overview

Microelectronics Reliability (114252) online Oct. 11, 2021

DOI: 10.1016/j.microrel.2021.114252

a Robert-Bosch-GmbH, Automotive Electronics, Tübinger Str. 123, 72762 Reutlingen, Germany
b Bosch Sensortec GmbH, Gerhard-Kindler-Str. 9, 72770 Reutlingen, Germany

Abstract: In our daily life, sensors play more and a more important role. They take over many functions in the automotive world as well as in consumer products with an increasing dissemination of the internet of things. In addition, they offer a broad variety of new applications. Sensors are typically build up in a package including a sensing element (e.g. micromechanical structures in acceleration sensors or membranes in gas sensors, etc.) and a microelectronic chip to evaluate the sensor data. This article will give an overview, how the reliability of such a system is validated. The challenges for reliability in terms of requirements and qualification for automotive and consumer applications will be discussed. The complex structure of a sensor module in combination with a broad variety of materials implies many possible failure mechanisms, which have to be considered. Some relevant sensor failure mechanisms caused by mechanical shock, thermo-mechanical stress and the influence of humidity on sensor reliability will be shown. The challenges for describing the influence of humidity on the sensor lifetime by an acceleration model will be discussed in detail. Finally, the paper will give an outlook for the reliability challenges of future sensor applications.

Fig: Loads on a MEMS sensor module.

[book] MEMS Fundamentals

MEMS Fundamentals

with ANSYS simulation of basic sensors and actuators

Michał Szermer, Andrzej Napieralski (Eds.)

ISBN eBook: 978-83-66287-64-8, 9788366287648

Wydawnictwo Politechniki Łódzkiej

Intro: The purpose of this book is to help universities and individuals extend their traditional microelectronics education into the MEMS area. It is organized in a set of tutorials primarily aimed at electronic engineering students and practicing engineers. Based on carefully selected examples of sensors and actuators, it introduces the reader to device operating principles, modeling approaches, simulation tools and design methodologies.

Book Contents

Preface
Chapter 1. INTRODUCTION
1.1. Program description
1.2. References
Chapter 2. SILICON MEMBRANE
2.1. Introduction
2.2. Modeling
2.2.1. Getting started
2.2.2. Setting system of units
2.2.3. Selecting finite element types
2.2.4. Setting material properties
2.2.5. Defining geometry
2.2.6. Meshing
2.2.7. Selecting analysis type
2.2.8. Applying boundary conditions
2.2.9. Running analysis
2.2.10. Viewing simulation results
2.3. Tasks for students
2.4. References
Chapter 3. THERMAL ACTUATOR
3.1. Introduction
3.2. Modeling
3.2.1. Getting started
3.2.2. Defining geometry
3.2.3. Setting material properties
3.2.4. Setting finite element types
3.2.5. Meshing
3.2.6. Selecting analysis type
3.2.7. Applying boundary conditions
3.2.8. Running analysis
3.2.9. Viewing simulation results
3.3. Automation of MEMS thermal actuator design
3.3.1. Simulation of thermal actuator with varying heater temperature
3.3.2. Viewing and saving simulation results using POST1 postprocessor
3.3.3. Plotting relationships
3.3.4. Tasks for students
3.4. References
Chapter 4. ELECTROTHERMAL ACTUATOR
4.1. Introduction
4.2. Modeling
4.2.1. Getting started
4.2.2. Defining geometry
4.2.3. Setting finite element types
4.2.4. Setting material properties
4.2.5. Meshing
4.2.6. Applying boundary conditions
4.2.6.1. Clamp
4.2.6.2. Temperature
4.2.6.3. Voltage
4.2.7. Selecting analysis type
4.2.8. Running analysis
4.2.9. Viewing simulation results
4.2.9.1. Displacement
4.2.9.2. Voltage
4.2.9.3. Temperature
4.3. Tasks for students
4.4. References
Chapter 5. ACCELEROMETER
5.1. Introduction
5.2. Modeling
5.2.1. Getting started
5.2.2. Defining geometry
5.2.3. Setting finite element types
5.2.4. Setting material properties
5.2.5. Meshing
5.2.6. Applying boundary conditions
5.2.7. Selecting analysis type
5.2.8. Running analysis
5.2.9. Viewing simulation results
5.3. Tasks for students
5.4. References
Chapter 6. SILICON MEMBRANE IN WORKBENCH
6.1. Membranes
6.2. Membrane modeling
6.3. Design and modeling of the membrane
6.3.1. Introduction to ANSYS
6.3.2. Getting started
6.3.3. Defining geometry
6.3.4. Setting up the simulation
6.3.5. Results processing
6.4. Exercises for Students
6.4.1. Laboratory tasks
6.4.2. Individual tasks
6.5. References
Chapter 7. MICROBOLOMETER IN WORKBENCH
7.1. Microbolometer principle
7.2. Microbolometer design with ANSYS Workbench
7.2.1. Getting started
7.2.2. Defining geometry
7.2.3. Adding materials’ data to the project
7.2.4. Electrical simulation
7.2.5. Thermal simulation
7.2.6. Exercises for students
7.2.7. Transient thermal simulation
7.2.8. Exercises for students
7.3. References

[CAS Seasonal School] How Technology is Impacting Agribusiness

How Technology is Impacting Agribusiness

A CAS seasonal school on technology and agribusiness will be held virtually from November 16th to November 20th. The program is quite interesting and we invite you to register through our web page www.asic-chile.cl. Registration is free.

The current world population of 7.6 billion is expected to reach 9.8 billion in 2050. According to the United Nations Food and Agriculture Organization (FAO) global agricultural productivity must increase by 50% – 70% to be able to feed the world population in 2050. Other researchers consider that reducing the waste of food would be enough.

Factors if not obstacles to be considered to meet global food demand by 2050 and beyond:

• Less arable land: As cities are growing, the space allowed to agriculture is shrinking.
• Climate change: Impacting dramatically agribusiness.
• Role of the agribusiness on the GHG emissions.
• Planet boundaries and the role of agribusiness.
• Availability of freshwater.
• Soil degradation.

The need has never been greater for innovative and sustainable solutions and technology should lead to significant improvement in our food and nutritional security.

In this seasonal school prestigious researchers and experts from all over the world will present the problems and challenges agribusiness is facing and how technologies such as IoT, AI, Machine Learning, sensors, electronic circuits, electronic systems, ICs, etc., can be applied to improve and solve the majority of those problems.

This is the first of a series of “Technology and Agribusiness” Seasonal Schools. It will be a meeting point for professionals working on Precision and Smart Agriculture, as well as professionals working on IoT, sensors, electronic circuits, electronic systems, ICs, etc.

We invite you to participate in this first version of the Technology and Agribusiness Seasonal School, which due to the pandemic will be 100% online and free of charge.

Join us!

[blog] Image Sensors World

blog shares news and discussions about image sensors

Read 5 Recent Comments:
I think the FOV of the ST Micro Lidar is too narro... - 3/27/2020 - Anonymous
Announced to the press but ST page lists them as &... - 3/26/2020 - Anonymous
Who is supplying this LIDAR Scanner? - 3/26/2020 - Anonymous
"from the financial sector than a biological ... - 3/26/2020 - Anonymous
Is this the STMicroelectronics MEMS lidar? Or what... - 3/25/2020 - Dharmaone