Showing posts with label AI. Show all posts
Showing posts with label AI. Show all posts

Mar 28, 2024

[paper] Chip Placement with Deep Learning

Azalia Mirhoseini, Anna Goldie, Mustafa Yazgan, Joe Jiang, Ebrahim Songhori, Shen Wang, Young-Joon Lee, Eric Johnson, Omkar Pathak, Sungmin Bae Azade, Nazi Jiwoo, Pak Andy, Tong Kavya Srinivasa, William Hang, Emre Tuncer, Anand Babu Quoc, Le James Laudon, Richard Ho, Roger Carpenter, Jeff Dean
Chip placement with deep reinforcement learning
arXiv preprint:2004.10746 (2020)

Abstract: In this work, we present a learning-based approach to chip placement, one of the most complex and time-consuming stages of the chip design process. Unlike prior methods, our approach has the ability to learn from past experience and improve over time. In particular, as we train over a greater number of chip blocks, our method becomes better at rapidly generating optimized placements for previously unseen chip blocks. To achieve these results, we pose placement as a Reinforcement Learning (RL) problem and train an agent to place the nodes of a chip netlist onto a chip canvas. To enable our RL policy to generalize to unseen blocks, we ground representation learning in the supervised task of predicting placement quality. By designing a neural architecture that can accurately predict reward across a wide variety of netlists and their placements, we are able to generate rich feature embeddings of the input netlists. We then use this architecture as the encoder of our policy and value networks to enable transfer learning. Our objective is to minimize PPA (power, performance, and area), and we show that, in under 6 hours, our method can generate placements that are superhuman or comparable on modern accelerator netlists, whereas existing baselines require human experts in the loop and take several weeks.

Fig: Visualization of placements. On the left, zero-shot placements from the pre-trained policy and on the right, placements from the finetuned policy are shown. The zero-shot policy placements are generated at inference time on a previously unseen chip. The pre-trained policy network (with no fine-tuning) places the standard cells in the center of the canvas surrounded by macros, which is already quite close to the optimal arrangement and in line with the intuitions of physical design experts.

Acknowledgments: This project was a collaboration between Google Research and the Google Chip Implementation and Infrastructure (CI2) Team. We would like to thank Cliff Young, Ed Chi, Chip Stratakos, Sudip Roy, Amir Yazdanbakhsh, Nathan Myung-Chul Kim, Sachin Agarwal, Bin Li, Martin Abadi, Amir Salek, Samy Bengio, and David Patterson for their help and support.


Feb 8, 2022

[App Note] Frenetic use A.I. technology to design optimal transformers

Frenetic is a power electronics company created with the goal of making magnetics simple. Frenetic is revolutionizing the world of magnetics with A.I. technology, which is replacing the need for outdated engineering methods. The A.I. technology allows designing optimal transformers and inductors, build and test samples in our laboratory and get the best manufacturing solutions for our clients in order to ensure that quality and timelines are respected.

App Note: Planar Transformer with Half Turns

New proposed solution for the transformer was based on a 4-column structure, where the flux cancellations reduce the core losses and allow keeping high power density. The solution was used in an LLC converter, obtaining a power density of 55 W/cm3.

References
[1] Y. -C. Liu et al., "Design and Implementation of a Planar Transformer With Fractional Turns for High Power Density LLC Resonant Converters," in IEEE Transactions on Power Electronics, vol. 36, no. 5, pp. 5191-5203, May 2021, doi: 10.1109/TPEL.2020.3029001.
[2] D. Huang, S. Ji and F. C. Lee, "LLC resonant converter with matrix transformer", IEEE Trans. Power Electron., vol. 29, no. 8, pp. 4339-4347, Aug. 2014.
[3] C. Fei, F. C. Lee and Q. Li, "High-efficiency high-power-density LLC converter with an integrated planar matrix transformer for high-output current applications", IEEE Trans. Ind. Electron., vol. 64, no. 11, pp. 9072-9082, Nov. 2017.

May 8, 2021

10th All-Russia MES-2021 Conference

10th All-Russia Science and Technology Conference
Problems of Advanced Micro- and Nanoelectronic Systems Development 
MES-2021
March - November 2021
Moscow | Zelenograd

MES-2021 is dedicated to urgent issues of design automation of microelectronic systems, SoC, IP-blocks and a new element base of micro-and nanoelectronics. These issues have been and remain actual to science and technology, as evidenced by the major topics of the Annual International Conference on CAD and the development of micro-and nanoelectronic devices. MES is the largest conference in the field of CAD microelectronics in Russia and CIS countries. Proceedings of the MES conference is included in HAC list (issue 23.03.2021, pos. 2017) of Russian scientific journals, where should be published the main results of the PhD and DSc theses.
The upcoming 10th MES-2021 conference will be held mainly in the correspondence format, starting on March 01, 2021, and it will be concluded with its plenary session in November 2021.

Key discussion topics
1. Theoretical aspects of micro-and nanoelectronic systems (MES).
2. Methods and tools of design automation for micro-and nanoelectronic circuits and systems (VLSI CAD).
3. Experience of development of digital, analog, digital to analog, radio functional blocks of VLSI.
4. Features of VLSI design for nanometer technologies.
5. SoCs for advanced radioelectronic equipment.
6. Exhibition and presentation of commercial products.

Fields of interest of the conference include (but is not limited to) the following topics of relevant studies of VLSI design and VLSI design automation techniques:

Design
1. Circuits and Systems based on nanometer technologies
2. Systems on Chip
3. Digital VLSI Design
4. Design of analog functional blocks and radio VLSI
5. Design of mixed-signal VLSI
6. Methods of structural synthesis of analog, digital and mixed VLSI and complex functional blocks
7. Specialized (resistant to special effects, photosensitivity, etc.) VLSI

Simulation
1. Methods of simulation of digital, analog and mixed circuits and systems
2. Methods for radio VLSI simulation
3. Structural, logical, circuit, mixed and layout simulation
4. Methods for generating models and macromodels for VLSI CAD
5. Device and Technology simulation
6. Behavioral simulation

Information processing methods
1. Information coding
2. Digital data processing
3. Use of artificial intelligence methods, neural networks, etc. in micro- and nanoelectronic system designs
4. Unconventional arithmetic
5. High-performance computers

The development of nanoelectronic systems on new principles
1. Nanomagnetic storage devices
2. Magnetosensor structures

Call for participation in the conference program
I stage - After registration at least one of the co-authors of the report one can send an article. To do this, using their registration data, please log in (see upper right corner of screen). Fill in all required fields. On the website you should send a file containing the main text of the article (in Russian or English) and an extended abstract in English (if the main text is in Russian) or a simple abstract in Russian (if the main text of the article in English). Requirements for the articles sent to MES.
II stage - sending additional documents only for the articles, which have been reviewed and accepted to the conference program.

Visit the 10th MES-2021 conference website at: http://www.mes-conference.ru/index.php





Oct 26, 2020

[CAS Seasonal School] How Technology is Impacting Agribusiness

How Technology is Impacting Agribusiness

A CAS seasonal school on technology and agribusiness will be held virtually from November 16th to November 20th. The program is quite interesting and we invite you to register through our web page www.asic-chile.cl. Registration is free.

The current world population of 7.6 billion is expected to reach 9.8 billion in 2050. According to the United Nations Food and Agriculture Organization (FAO) global agricultural productivity must increase by 50% – 70% to be able to feed the world population in 2050. Other researchers consider that reducing the waste of food would be enough.

Factors if not obstacles to be considered to meet global food demand by 2050 and beyond:
  • Less arable land: As cities are growing, the space allowed to agriculture is shrinking.
  • Climate change: Impacting dramatically agribusiness.
  • Role of the agribusiness on the GHG emissions.
  • Planet boundaries and the role of agribusiness.
  • Availability of freshwater.
  • Soil degradation.
The need has never been greater for innovative and sustainable solutions and technology should lead to significant improvement in our food and nutritional security.

In this seasonal school prestigious researchers and experts from all over the world will present the problems and challenges agribusiness is facing and how technologies such as IoT, AI, Machine Learning, sensors, electronic circuits, electronic systems, ICs, etc., can be applied to improve and solve the majority of those problems.

This is the first of a series of “Technology and Agribusiness” Seasonal Schools. It will be a meeting point for professionals working on Precision and Smart Agriculture, as well as professionals working on IoT, sensors, electronic circuits, electronic systems, ICs, etc.

We invite you to participate in this first version of the Technology and Agribusiness Seasonal School, which due to the pandemic will be 100% online and free of charge.

Join us!