Call for Papers
IEEE FLEPS 2022 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
Topics of Interest
- Organic/Inorganic Electronic Sensors
- Emerging Materials for Flexible and Printable Systems
- Manufacturing Techniques
- High-throughput Printable Electronics
- Hybrid Flexible Sensors and Electronics
- Stretchable/Shrinkable Sensors and Electronics
- Soft/Smart Wearable and Implantable Sensing Systems
- Disposable/Reusable Sensors and Electronics
- Printed Large-Area Sensors and Systems
- Flexible or Printed Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
- Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
- Simulation and Modelling
- Flexible/Printable Electronics in context with Circular Economy and green electronics
Publication of Papers: Presented papers will be included in the Proceedings of IEEE FLEPS 2022 and in IEEE Xplore pending author requirements being met. Authors may submit an extended IEEE FLEPS 2022 papers to the Special IEEE FLEX Journal Issue.
Exhibition & Patron Opportunities: The Conference exhibit area will provide your company or organization with the opportunity to inform and display your latest products, services, equipment, books, journals, and publications to attendees from around the world.
For further information, contact Coral Miller at Conference Catalysts, LLC.
