Nov 15, 2021

[book] Future Ultra Low Power Electronics

Semiconductor Devices and Technologies for Future Ultra Low Power Electronics (1st ed.)
Nirmal, D., Ajayan, J., & Fay, P.J. (Eds.)
CRC Press. (2021).
DOI: 10.1201/9781003200987

Abstract: This book covers the fundamentals and significance of 2-D materials and related semiconductor transistor technologies for the next-generation ultra low power applications. It provides comprehensive coverage on advanced low power transistors such as NCFETs, FinFETs, TFETs, and flexible transistors for future ultra low power applications owing to their better subthreshold swing and scalability. In addition, the text examines the use of field-effect transistors for biosensing applications and covers design considerations and compact modeling of advanced low power transistors such as NCFETs, FinFETs, and TFETs. TCAD simulation examples are also provided. 

Contents:
Preface vii
Editors ix
Contributors xi
Chapter 1: An Introduction to Nanoscale CMOS Technology Transistors: A Future Perspective; pp: 1
Kumar Prasannajit Pradhan
Chapter 2: High-Performance Tunnel Field-Effect Transistors (TFETs) for Future Low Power Applications; pp: 29
Ribu Mathew, Ankur Beohar, and Abhishek Kumar Upadhyay
Chapter 3: Ultra Low Power III-V Tunnel Field-Effect Transistors; pp: 59
J. Ajayan and D. Nirmal
Chapter 4: Performance Analysis of Carbon Nanotube and Graphene Tunnel Field-Effect Transistors; pp: 87
K. Ramkumar, Singh Rohitkumar Shailendra, and V. N. Ramakrishnan
Chapter 5: Characterization of Silicon FinFETs under Nanoscale Dimensions; pp: 115
Rock-Hyun Baek and Jun-Sik Yoon
Chapter 6: Germanium or SiGe FinFETs for Enhanced Performance in Low Power Applications; pp: 129
Nilesh Kumar Jaiswal and V. N. Ramakrishnan
Chapter 7: Switching Performance Analysis of III-V FinFETs .; pp: 155
Arighna Basak, Arpan Deyasi, Kalyan Biswas, and Angsuman Sarkar
Chapter 8: Negative Capacitance Field-Effect Transistors to Address the Fundamental Limitations in Technology Scaling; pp: 187
Harsupreet Kaur
Chapter 9: Recent Trends in Compact Modeling of Negative Capacitance Field-Effect Transistors; pp: 203
Shubham Tayal, Shiromani Balmukund Rahi, Jay Prakash Srivastava, and Sandip Bhattacharya
Chapter 10 Fundamentals of 2-D Materials; pp: 227
Ganesan Anushya, Rasu Ramachandran, Raj Sarika, and Michael Benjamin
Chapter 11 Two-Dimensional Transition Metal Dichalcogenide (TMD) Materials in Field-Effect Transistor (FET) Devices for Low Power Applications; pp 253
R. Sridevi and J. Charles Pravin
Index pp: 289

[paper] Verilog-A Compact MTJ Model

Etienne Becle, Philippe Talatchian, Guillaume Prenat, Lorena Anghel, Ioan-Lucian Prejbeanu 
51st European Solid-State Device Research Conference; Grenoble 2021
  
CEA-Spintec (F)

Abstract: Spin-Transfer Torque Magnetic Tunnel Junctions (STT-MTJ) are devices featuring stochastic properties. They are promising candidates for non-volatile memory or true random number generators. To design reliable hybrid CMOS circuits including STT-MTJs, one needs to use a compact model accounting for its stochasticity in the circuit simulations. This paper proposes a compact model that accurately mimics the MTJ stochastic switching behavior and meets the needs of fast execution time. The relevance of such a model together with its fast execution velocity are illustrated with a bitstream generator. 
Fig: Schematic representation of the implemented algorithm

Acknowledgement: This work is supported by the French National Research Agency in the framework of the "Investissements d’avenir” program (ANR-15-IDEX-02). 

Nov 13, 2021

Advances in RF and THz emerging electronic devices webinar at IPN-UAB

The webinar joitly co-organize together with Instituto Politécnico Nacional, Mexico 
is intended to present and discuss recent advances in RF and THz emerging electronic devices.

Feel free to share the information with your colleagues and/or students. The registration is free, and you can do it here (it is in Spanish but the only required fields are Name, Surname, Email, and Email confirmation). Alternatively, you can follow the live stream in this youtube channel.

The time appearing in the flyers are referred to Mexico City's time. The schedule is starting each day Nov.16-18, 2021 at 16 hrs CET.

If you have further questions you can contact 

   

Nov 11, 2021

Career opportunities at VTT

Career opportunities at 
VTT Microelectronics and Quantum Technologies 
Apply by 14.11.2021

VTT is one of the leading research organizations in Europe and we are operating the largest R&D cleanroom in the Nordic countries, located in Micronova premises, Espoo. We develop innovative micro, nano and quantum systems and algorithms and software driven by different sensing, communication and computing applications. A timely example being the building of Finland's first quantum computer. We work closely with global industrial and academic players of different fields of technology. What unites us at VTT are the curiosity, passion of learning and devotion to finding solutions to global challenges and answers to our customers' needs. You can familiarize with us further by exploring VTT's research infra through VTT World.

Due to our continual growth, we are currently seeking for more than 15 new talents in microelectronics and quantum technologies to join our team. If you are interested in joining VTT, read more about job opportunities using links below:  

 

Best regards

 

Matteo Cherchi, PhD

Senior Scientist

Silicon photonics

Tel. +358 40 6849040

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VTT
Micronova

Tietotie 3, Espoo, Finland

vttresearch.com

 

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[paper] InP HEMTs for future THz applications

J.Ajayana, D.Nirmalb, Ribu Mathewc, Dheena Kuriand, P.Mohankumare, L.Arivazhaganb, D.Ajithaf
A critical review of design and fabrication challenges in InP HEMTs 
for future terahertz frequency applications
Materials Science in Semiconductor Processing
Volume 128, 15 June 2021, 105753
  
a SR University, Warangal, Telangana, India
b Karunya Institute of Technology and Sciences, Coimbatore, Tamilnadu, India
c VIT Bhopal University, Bhopal, Madhya Pradesh, India
d Kerala Technological University, Trivandrum, Kerala, India
e Sona College of Technology, Salem, Tamilnadu, India
f Sreenidhi Institute of Science and Technology, Hyderabad, Telangana, India

Abstract: This article critically reviews the materials, processing and reliability of InP high electron mobility transistors (InP HEMTs) for future terahertz wave applications. The factors such as drain current (ID) over 1200 mA/mm, transconductance (gm) over 3000 mS/mm, cut off frequency (fT) over 700 GHz and maximum oscillation frequency (fmax) over 1300 GHz makes InP HEMTs suitable for Terahertz wave applications. Furthermore, low DC power consumption and outstanding low noise performance makes InP HEMT most appropriate transistor technology for the development of space based receivers. This review article critically assesses the challenges in miniaturization of InP HEMTs, doping strategies in InP HEMTs, buried platinum technology, impact of annealing process and temperature, influence of electron and proton irradiation, thermal and bias stress on the reliability of InP HEMTs, cavity and gating effects and influence of trapping effects. InP HEMTs are very much preferable in applications like radio astronomy, terahertz optical and wireless communication systems, atmospheric imaging and sensing, automotive radar, ground based receivers in deep space networks, terahertz imaging and sensing, biomedical applications, security screening, video conferencing & real time multimedia file transfer, high speed and ultra low power digital integrated circuits.

Fig: 3D representation of InP high electron mobility transistor (InP HEMT)