[paper] Extraction and Automated FEMM Creation of a Transformer SPICE Model

Denys I. Zaikin

Extraction of Transformer Parameters from FEMM Simulations 

and Automated Creation of a Transformer SPICE Model Using a Scripting Language

TechRxiv. Preprint. DOI 10.36227/techrxiv.22263358.v1

*Advent Technologies A/S Lyngvej 8, Aalborg, 9000, Denmark e-mail: denys.zaikin@advent.energy

Abstract: This study presents a method for extracting transformer parameters using simulations in the Finite Element Method Magnetics (FEMM) electromagnetic solver. The extracted parameters represent a full model of a linear transformer and can be used in Simulation Program with Integrated Circuit Emphasis (SPICE) simulations. A model of the transformer is presented in three variants, for which different approaches were used in the transformer simulation in the SPICE program, all yielding the same simulation results. A method for extracting transformer parameters from FEMM is proposed, along with an automated tool based on a scripting language built into the FEMM software [Online open souce https://www.femm.info]

FIG: An example of the simulation setup in FEMM 

and transformer equivalent circuits SPICE Pi-model

[Deadline Extended] IEEE LAEDC 2023

Paper Submission Deadline Extended: 15 April 2023 On behalf of the Organizing Committee of IEEE 2023 Latin American Electron Devices Conference (LAEDC) we want to invite you to the next edition of our conference. It will take place in Puebla, Mexico from July 3-5, 2023, https://attend.ieee.org/laedc-2023/.  The conference is growing rapidly with worldwide participation and will cover key topics in the field of electronic devices. The main objective of LAEDC is to bring together specialists from all fields related to electronic devices, it will also be aimed at students and young researchers. This event is financially sponsored by IEEE Electron Devices Society (EDS). We are sure that thanks to your significant achievements and contributions, your attendance will significantly increase the value of our conference and motivate research groups and young generations in the field of electronic devices. Please note that discounted registration will be available until June 17, 2023. Please consider submitting a full paper to our conference proceedings no later than March 31th and engage with our audience and participants while visiting one of the most lively and historic cities in Mexico. For more information, please visit our website and do not hesitate to contact us at laedc-program@ieee.org Sincerely,

Thirteen regions of #EU have come together to form a #semi #alliance https://t.co/T655QCutbq https://t.co/l37dp4pHqI

Thirteen regions of #EU have come together to form a #semi #alliance https://t.co/T655QCutbq https://t.co/l37dp4pHqI

— Wladek Grabinski (@wladek60) Mar 24, 2023

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from Twitter https://twitter.com/wladek60

March 24, 2023 at 01:18PM
via IFTTT

[analog-wg] Video of March 21 AWG Meeting

The Analog Workgroup (AWG) was formed by the CHIPS Alliance TSC to explore collaborations in open source Analog/Mixed-Signal design and verification. It focuses on sharing best practices, ideas, tooling (analog automation), and other challenge areas in the design space. The workgroup is composed of both industry and university members.

The AWG Video Meeting on March 21, 2023 included two presentations:

• Ken Kundert "Why Fund OpenVAF"
• Pascal Kuthe "OpenVAF: An innovative open-source Verilog-A Compiler"

Please note the following line of topics for the Analog Workgroup

• 4th April: Update from Tim Edwards: Magic and PEX extraction
• 18th April: Update from Sadayuki Yoshitomi: Ecosystem of compact model development 
• 2nd May (tentative): Update from C. Enz,EPFL:  test structures measurements

Commemorative and Networking Event: 75th anniversary of the transistor

IEEE Switzerland Solid State Circuits Chapter

invites you to join the networking event to celebrate

the 75th anniversary of the transistor

Three IEEE Distinguished Lecturers will talk about the transistor history and its properties. It will be followed by short presentations about semiconductor industry activities in Switzerland, with the following networking apéro.

Attendance is free and open to all: mention it and forward to your friends and colleagues.

Please register for logistics reasons. 

Date and Time	Location
Date: 30 Mar 2023 Time: 01:00 PM to 07:30 PM All times are (UTC+01:00) Bern Add Event to Calendar iCal Google Calendar	EPFL Microcity Rue de la Maladière 71C CH-2020 Neuchâtel Room Number: MC A1 272 Click here for Map

Agenda

13:00 – 13:30 Welcome Coffee 

13:30 – 14:15 Tom Lee: From Rocks to Chips: Stories of the Transistor

14:15 – 15:15 Chris Mangelsdorf: Don't try this with CMOS

15:15 – 15:45 Coffee break 

15:45 – 16:30 Christian Enz: The Design of Low-power Analog CMOS Circuits Using the Inversion Coefficient

16:30 – 17:30 Semiconductor industry in Switzerland, sharing experiences 
                        (W.Grabinski, Panel Moderator):

• Bipolar transistor manufacturing in Switzerland – Hugo Wyss
• Integrated Circuits – Eric Vittoz
• Semiconductor design in the 21st century – Alain-Serge Poret
• Micro-electronics for Swiss made products – Evert Dijkstra
• Semiconductor manufacturing equipment – André Gerde

17:30 – 19:00 Apéro riche

Hosts

Switzerland Section Chapter, SSC37 : https://sscs.ieee.ch
Switzerland Section : https://ieee.ch/