[paper] Compact Electro-Mechanical-Fluidic Model for Actuated Fluid Flow System

Compact Electro-Mechanical-Fluidic Model for Actuated Fluid Flow System

T. K. Maiti, Member, IEEE, L. Chen, H. Zenitani, H. Miyamoto, Member, IEEE,

M. Miura-Mattausch, Fellow, IEEE, and H. J. Mattausch, Senior Member, IEEE

in IEEE Journal on Multiscale and Multiphysics Computational Techniques, 

vol. 2, no. , pp. 124-133, 2017.

doi: 10.1109/JMMCT.2017.2731878

Abstract: This paper presents a compact electro-mechanical-fluidic system-modeling method for multidomain system simulation based on multidomain physics that considers the total energy conservation condition, in terms of respective potential and flow quantities. Models for electrical, mechanical, and fluidic domains are developed to design the example of a blood pumping system, where the blood flow is driven by electrically controlled organic actuators. The electrical domain includes an organic mosfet-based control circuit, the mechanical domain includes organic actuators, and the fluidic domain includes a flexible fluid-flow channel. Control circuit, actuators, and fluid models are coupled through equivalent circuits, where interconnection relationships between two neighboring domains are expressed using the energy conservation concept. The model accuracy is verified with finite element method (FEM) based numerical simulation. Significantly faster simulation speed than with FEM and good accuracy were achieved [read more...]

TABLE: CORRESPONDING FORCE AND FLOW EQUATIONS FOR ELECTRICAL AND
MECHANICAL DOMAINS ARE SUMMARIZED [21]-[23]

[21] S. D. Senturia, Microsystems Design. Norwell, MA: Kluwer Academic Publisher, 2001.

[22] T. K. Maiti, L. Chen, H. Miyamoto, M. Miura-Mattausch, and H. J. Mattausch, “Modeling of electrostatically actuated fluid flow system for mixed-domain simulation,” in 20th Int. Conf. on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 190-193, Sept. 2015, USA.

[23] T. K. Maiti, L. Chen, H. Miyamoto, M. Miura-Mattausch, and H. J. Mattausch, “Mixed domain compact modeling framework for fluid flow driven by electrostatic organic actuators,” in 45th European Solid-State Device Research Conference (ESSDERC), pp. 52-55, Sept. 2015, Austria. 

TED Call for Papers on Compact Modeling of Emerging Devices

Compact Models (CMs) for circuit simulation have been at the heart of CAD tools for circuit design for almost five decades. As the mainstream CMOS technology is scaled into the nanometer regime, development of a truly physical and predictive CM for circuit simulation that covers geometry, bias, temperature, DC, AC, RF, and noise characteristics becomes a major challenge. The last call for a special issue on “advanced compact models and 45-nm modeling challenges” was in 2005. Seven years have passed, new technology nodes have been implemented, compact models have evolved and new compact models as well as compact models for new devices are being developed. Therefore, there is a need for another special issue dedicated to the advancement and challenges in core field-effect transistor (FET) models for 32-nm technologies and beyond as well as emerging technologies. For the core FET models, the associated noise/mismatch and reliability/variability models as well as proximity effects have become an essential part of the modeling effort. High-frequency, high-voltage, high-power, high-temperature devices have been extensively investigated, and their CMs are being reported in the literature. Device/circuit interaction and layout-dependent proximity effects are also hot topics today that are essential in nanometer chip designs. It is timely to report advances in these CMs in the 32-nm/22-nm technology era.

Concurrently, nonclassical MOSFETs as well as their CMs, such as multigate FinFETs and nanowire FETs, partially/fully-depleted ultrathin body (UTB) SOT, and thin-film transistors (TFTs), have emerged over the past decades. With the announcement of FinFETs being used in 22-nm and sub-22nm technology nodes, the need for such core models for fabless designers becomes an urgent reality. In these nonclassical devices, transistors are essentially short-channel, narrow-width, and thin-body. Tt is also an interesting topic to discuss and debate on the two different formalisms “top-down” drift-diffusion formulation adding ballistic effects versus “bottom-up” quasi-ballistic formulation adding scattering effects for modeling the real devices that are somewhere in between. Heterogeneous integration of various devices into the CMOS platform also becomes an important trend.

In addition, it is also timely to report advances in CMs of emerging devices beyond traditional silicon CMOS, such as different materials (III-V/Ge channel, organic) and different source/drain injection mechanisms (Schottky-barrier, tunneling, and junctionless FETs). These emerging device options for future VLSI building blocks have been studied extensively, while good physical CMs are still lacking. The special issue in these topics will stimulate research and development to promote modeling efforts such that theory would lead and guide technology realization and selection for future generations.

The special issue for the TRANSACTIONS ON ELECTRON DEVICES on compact modeling of emerging devices is devoted to the review and report of advancements in CMs for 32-nm technologies and beyond, including bulk and nonclassical CMOS and their associated noise/mismatch and reliability/variability models, as well as various emerging devices as future generation device options. It is timely as the industry is in the transition from traditional planar bulk-CMOS towards vertical FinFET technologies, and exploration of heterogeneous integration with various materials and structural choices.

Please submit manuscripts by using the following URL: http://mc.manuscriptcentral.com/ted

MAKE SURE TO MENTION THE SPECIAL ISSUE IN THE COVER LETTER

Paper submission Deadline: June 30, 2013

Scheduled Publication Date: February 2014

Guest Editors:

Xing Zhou, Nanyang Technological University, 

Jamal Deen, McMaster University, 

Benjamin Iniguez, Universitat Rovira i Virgili, 

Christian Enz, Swiss Federal Institute of Technology, 

Rafael Rios, Intel Corp.

If you have any questions about submitting a manuscript, please contact:

Jo Ann Marsh 

IEEE EDS Publications Office

445 Hoes Lane Piscataway JN 08854

Phone: +1 732 562 6855

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Digital Object Identifier 10.1109/TED.2013.2253418

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ICOE'09

I post the official email I've got:
Just 7 weeks to go. The icoe shop is now live and open so that you can now register and the provisional programme has been organised (attached). The icoe registration fee is £270 while Ph.D. students are free. The oral/poster provisional programme is on the website as well as accommodation details. There is a Liverpool football club Tour and museum taking place on Wednesday afternoon (17^th June) at a cost of £10 per person while an organic roadmap talk/discussion is taking place at the same time. Further details and information can be found on the web site http://www.icoe09.com

International Conference on Organic Electronics'09

I copy the e-mail from Bill Eccleston, announcing the ICOE'09:

ICOE09 STOP PRESS

The Final Call for abstracts for ICOE(09) runs from 2^nd March to 27^th March 09 at Liverpool University. PhD postgrads come free. The conference runs from 15^th to 18^th June. There are special offers on Easyjet for flights to Liverpool: do your booking soon. The award winning website is at http://www.icoe09.com/ and includes hotel details. It includes the world famous Adelphi Hotel of Titanic fame at the conference rate where the Conference Dinner will be held. The estimated number of abstracts is estimated to be 17% higher than last year so overall acceptance rate is likely to be lower. The cut-off point is likely to be before the final deadline. Some oral presentations are reserved for the second call. There will be up to 50 poster places.

Among the invited talks are

Richard Friend (Cambridge): PV

Stephen Choe (Princeton) : nanoimprint

Jan Genoe (IMEC): Circuits and rfid

Jiro Kasahara ( just out of Sony)

Plus 6 others which will appear on the website with abstracts soon.