[C4P] EDTM Conference 2024, Bangalore

8th IEEE Electron Devices Technology and Manufacturing

EDTM Conference 2024

Theme: Strengthening Globalization in Semiconductors

Hilton Bangalore, India, March 3rd- 6th, 2024

https://ewh.ieee.org/conf/edtm/2024/

Call for Paper: We cordially invite you to submit ORIGINAL 3-page Camera-Ready papers to the 2024 IEEE Electron Devices Technology and Manufacturing (IEEE EDTM 2024) Conference for possible presentations. Original papers are sought on any topic within the scope of IEEE EDTM 2024. There are 14 R&D Tracks for IEEE EDTM 2024, among them:

TRACK 9. Modeling and Simulation (MS)

Advances in modeling/simulation of devices, packages and processes; Technology CAD and benchmarking; Atomistic process and device simulation; Compact models for DTCO and STCO; AI/ML-augmented modelling; Material and interconnect modeling; Models for photonic devices.

Important Dates for Authors

• Three-page camera-ready paper submission starts: August 1,2023
• Paper submission deadline: October 15, 2023 October 30, 2023 
• Notification for Acceptance: December 15, 2023

Accepted IEEE EDTM 2024 papers will be considered for competition for the Best Paper Award, Best Student Paper Awards and Best Poster Awards.

More details on paper submission can be found at the Paper Submission webpage.

[call for papers] 1st EDTM 2017

EDTM Call for Papers 

Submission deadline: November 4th, 2016

Camera ready, one page text and one page figures

1st EDTM 2017

At Toyama International Conference Center, Toyama, Japan

February 28th to March 2nd, 2017

Why EDTM has been started: System performance continues to grow, even though device scaling is saturated. Based on strong manufacturing technologies, Asia has strong potential to take an initiative for system integration. Deep-dive discussions among technical communities on materials, processes, and devices are aimed to accelerate manufacturing innovations through this forum.

1. Technical sessions

EDTM 2017 and beyond will have a strong specific technical focus, and this year’s focus being on devices and process technologies for advanced applications, IoE (Internet of Everything) and related low-power devices, advanced memories, sensors, actuators, MEMS, bio.-chips, passive devices, and all types of (exploratory) devices related to advance applications and IoE. Papers/Posters on materials and processes for enabling above-menHoned devices building in heterogeneous integration such as 2.1, 2.5 and 3D structures using wafer-level packaging process (e.g.) are of great focus. EDTM aims for highest quality, and all papers accepted would be subject to IEEE-EDS standard review processes and conference publishing guidelines. Accepted and presented papers will be published in EDTM proceedings. A selected number of high impact EDTM papers would be invited for the consideration of publication in the IEEE Journal of Electron Devices Society (J- EDS) as extended version of EDTM conference papers following the IEEE publication policy and J-EDS author-guidelines.

2. Education

• Tutorials: We will provide both the basic and advanced programs. Basic program will be presented in local language.
• Poster sessions: Primarily intended for young engineers and students. The best poster will be awarded in the conference.
• Short courses: Will bring high level programs.

3. Exhibition

Given the strong semiconductor manufacturing base in Asia, we intend to offer exhibits that will demonstrate products and technology. All of the exhibitors will have an opportunity to offer technical insight and share their knowhow. Moreover, we hope to offer Forum Making Session to engage and allow deeper discussions between device, material, and equipment engineers and technologists.

Papers in the following areas are requested by Subcommittee on:

• Devices and Manufacturing for “Cloud and Edge”
• Packaging and Manufacturing for “Cloud and Edge”
• Process, Tools, and Manufacturing
• Semiconductor Materials
• Reliability & Modeling (including compact/SPICE)

[read more...]