Submission deadline: November 4th, 2016
Camera ready, one page text and one page figures
At Toyama International Conference Center, Toyama, Japan
February 28th to March 2nd, 2017
Why EDTM has been started: System performance continues to grow, even though device scaling is saturated. Based on strong manufacturing technologies, Asia has strong potential to take an initiative for system integration. Deep-dive discussions among technical communities on materials, processes, and devices are aimed to accelerate manufacturing innovations through this forum.
1. Technical sessions
EDTM 2017 and beyond will have a strong specific technical focus, and this year’s focus being on devices and process technologies for advanced applications, IoE (Internet of Everything) and related low-power devices, advanced memories, sensors, actuators, MEMS, bio.-chips, passive devices, and all types of (exploratory) devices related to advance applications and IoE. Papers/Posters on materials and processes for enabling above-menHoned devices building in heterogeneous integration such as 2.1, 2.5 and 3D structures using wafer-level packaging process (e.g.) are of great focus. EDTM aims for highest quality, and all papers accepted would be subject to IEEE-EDS standard review processes and conference publishing guidelines. Accepted and presented papers will be published in EDTM proceedings. A selected number of high impact EDTM papers would be invited for the consideration of publication in the IEEE Journal of Electron Devices Society (J- EDS) as extended version of EDTM conference papers following the IEEE publication policy and J-EDS author-guidelines.
- Tutorials: We will provide both the basic and advanced programs. Basic program will be presented in local language.
- Poster sessions: Primarily intended for young engineers and students. The best poster will be awarded in the conference.
- Short courses: Will bring high level programs.
Given the strong semiconductor manufacturing base in Asia, we intend to offer exhibits that will demonstrate products and technology. All of the exhibitors will have an opportunity to offer technical insight and share their knowhow. Moreover, we hope to offer Forum Making Session to engage and allow deeper discussions between device, material, and equipment engineers and technologists.
Papers in the following areas are requested by Subcommittee on:
- Devices and Manufacturing for “Cloud and Edge”
- Packaging and Manufacturing for “Cloud and Edge”
- Process, Tools, and Manufacturing
- Semiconductor Materials
- Reliability & Modeling (including compact/SPICE)