by Boris Murmann
DOI:10.1109/MSSC.2021.3135176
Date of current version: 24 January 2022
Last summer 2021, the IEEE Solid-State Circuits Society (SSCS) launched its first open source chip design contest under the umbrella of its Platform for Integrated Circuit Design Outreach program (PICO). Beginning with 61 submissions, a volunteer jury selected 18 teams from nine countries to embark on a journey toward tapeout. Anyone interested in supporting future activities is encouraged to sign up at
the Society’s volunteer web portal. Stay tuned for the 2022 edition of the SSCS PICO contest!
FIG: Layout views of the chips submitted for tape out
TABLE: A Summary Oof Designs Submitted for TapeOut
| Function | Team | Chip URL |
| 1 | 5G bidirectional amplifier | Pakistan 3 (National University of Computer and Emerging Sciences) | https://efabless.com/projects/560 |
| 2 | Wireless power transfer unit | Pakistan 2 (National University of Computer and Emerging Sciences) | |
| 3 | Variable precision fused multiply–add unit | Pakistan 1 (National University of Computer and Emerging Sciences) | |
| 4 | Oscillator-based LVDT readout | India 2 (Anna University) | https://efabless.com/projects/474 |
| 5 | Temperature sensor | India 1 (Anna University) | |
| 6 | GPS baseband engine | India 3 (Anna University) | |
| 7 | Ultralow-power analog front end for bio signals | Brazil 2 (Universidade Federal de Santa Catarina) | https://efabless.com/projects/476 |
| 8 | TIA for quantum photonics interface | USA 4 (University of Virginia) | https://efabless.com/projects/470 |
| 9 | Bandgap reference | Egypt (Cairo University) | https://efabless.com/projects/473 |
| 10 | Neural network for sleep apnea detection | USA 2 (University of Missouri) | |
| 11 | Sonar processing unit | Chile (University of the Bío-Bío) | https://efabless.com/projects/54 |
