Sunday, April 23, 2017

[mos-ak] [press note] Spring MOS-AK Workshop at DATE Conference in Lausanne, March 31, 2017

 Arbeitskreis Modellierung von Systemen und Parameterextraktion
 Modeling of Systems and Parameter Extraction Working Group
 Spring MOS-AK Workshop at DATE
 Lausanne, March 31, 2017

 The MOS-AK Compact Modeling Association, a global compact/SPICE modeling and Verilog-A standardization forum, held its annual spring workshop as an integral engineering event at the DATE Conference on March 30, 2017 in Lausanne (CH). The event was coorganized by Jean-Michel Sallese, EPFL and its technical program was coordinated by Larry Nagel, OEC (USA) and Andrei Vladimirescu, UCB (USA); ISEP (FR) representing the International MOS-AK Board of R&D Advisers. The workshop was co-sponsored by MPI Corporation (lead sponsor) and Swiss IEEE Section, with technical program promotion provided by the IEEE WiE Group (CH), Eurotraining and NEEDS of as well as FOSSEE


A group of the international academic researchers and modeling engineers attended 12 technical compact modeling presentations covering full development chain form the nanoscaled technologies thru semiconductor devices modeling to advanced IC design support. The MOS-AK speakers have shared their latest perspectives on compact/SPICE modeling and Verilog-A standardization in the dynamically evolving semiconductor industry and academic R&D. 

The event featured advanced technical presentations covering compact model development, implementation, deployment and standardization covering full engineering R&D chain: TCAD/processing, device modeling, transistor level IC design support. These contributions were delivered by leading academic and industrial experts, including: Nicolas Cordero, Tyndall (IE) ASCENT (Nanoelectronics Network) - Open Access to 14nm PDKs; Vadim Kuznetsov, Bauman Moscow TU (RU) The first stable release of Qucs-S and advances in XSPICE model synthesis; Anurag Mangla, ams AG (A) Interactive tool for quick calculation of design oriented MOSFET parameters; Maria-Alexandra Paun, EPFL (CH) Optimal geometry selection for Hall sensors integrated in CMOS technological process; Heinz-Olaf Müller, Plastic Logic (D) Verilog-A model for ferroelectrics in organic electronics; Andrej Rumiantsev, MPI Corp. (TW) New Approach to Reduce Time-to-data when Characterizing Advanced Semiconductor Devices; Mathieu Luisier, ETH Zurich (CH), Physics-based Modeling of Nano-Devices: Requirements and Examples; Felix Salfelder, University of Leeds (UK) Semiconductor Device Compact Modelling with Ageing Effects; Theodor Hillebrand, University of Bremen (D) Unified charge-based Transistor Model including Degradation Mechanisms; Catherine Dehollain, EPFL (CH) Design trade-off between remote power and data communication for remotely powered sensor networks; Sandro Carrara, EPFL (CH) Bio/Nano/CMOS interfaces for Ultrasensitive Memristive Biosensors; Matthias Bucher; TUC (GR), giving an EKV3 model update. The presentations are available online for download at <>. Selected best presentation will be recommended for further publication in the IJHSES.


The MOS-AK Modeling Working Group has various deliverables and initiatives including a book entitled "Open Source CAD Tools for Compact Modeling" and an open Verilog-A directory with models and supporting CAD software. The MOS-AK Association plans to continue its standardization efforts by organizing additional compact modeling meetings, workshops and courses in Europe, USA, India and China throughout 2017/2018 including:

* 2nd Sino MOS-AK Workshop in Hangzhou (June 29-30, 2017)

* 15th MOS-AK ESSDERC/ESSCIRC Workshop in Leuven (Sept.11, 2017)

* 10th International MOS-AK Workshop in Silicon Valley; Dec. 2017

* Spring MOS-AK Workshop Strasbourg (F) March 2018


About MOS-AK Association:

MOS-AK, an international compact modeling association primarily focused in Europe, to enable international compact modeling R&D exchange in the North/Latin Americas, EMEA and Asia/Pacific Regions. The MOS-AK Modeling Working Group plays a central role in developing a common language among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact/SPICE modeling and its Verilog-A standardization and related CAD/EDA tools for the compact models development, validation/implementation and distribution. For more information please visit:

About MPI Corporation:

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI's four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test &amp; Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of product technologies allows each new innovation to provide differentiation in areas that are meaningful to our precious customer base. For more information please visit:

You received this message because you are subscribed to the Google Groups "mos-ak" group.
To unsubscribe from this group and stop receiving emails from it, send an email to
To post to this group, send email to
Visit this group at
For more options, visit

No comments: