Showing posts with label workshop. Show all posts
Showing posts with label workshop. Show all posts

Dec 12, 2020

[2nd Day Photos] 13th International MOS-AK Workshop

13th International MOS-AK Workshop was organized jointly with THM Giessen who has provided ZOOM meeting platform for the online event. 50+ registered participants have attended 2nd day with two further MOS-AK sessions and followed 7 technical talks

MOS-AK session III - 11:00 - 14:00 (PST) on Dec.11, 2020
Chair: Anurag Mangla; Semtech Neuchatel (CH)

[8] Statistical Analysis of MOSFET extracted parameters for n-MOS mismatch modeling.
Juan Pablo Martinez Brito
CEITEC SA/UFRGS (BR)

[9] Rapid multiscale simulation of nanoscale MOSFETs: Is an interplay between compact models and NEGF possible?
Alexander Kloes
NanoP, THM University of Applied Sciences (D)


[10] The Effect of Non Rectangular MOS Channels in Modelling High Voltage Lateral MOS
Marco Sambi, Lorenzo Labate, Simona Cozzi, Nicola Holzer
STMicroelectronics (I)

MOS-AK session IV
Chair: Daniel Tomaszewski, Lukasiewicz - IMiF, Warsaw (PL)

[11] Nonlinear Embedding Model for the Accelerated Design of PAs with the ASM-HEMT model
Patrick Roblin*, Miles Lindquist*, Nicholas Miller+ and Marek Mierzwinski^
*The Ohio State University, AFRL+, Keysight Corp.^ (USA)

[12] New analytical model for AOSTFTs
Antonio Cerdeira, Yoanlys Hernandez-Barrios, Magali Estrada, Benjamin Iniguez
CINVESTAV (MX) and URV (SP)

[13] Unifying the Modeling of Charge Trapping in RTN, 1/f Noise and BTI
Gilson Wirth
UFRGS (BR)

[14] SPICE Modeling for Display Technologies
Bogdan Tudor
Silvaco (USA)

MOS-AK attendees group photo of 2nd MOS-AK workshop day:

MOS-AK attendees group photo (1)

MOS-AK attendees group photo (2)









Jun 23, 2020

Webinar Series by Distinguished Experts

 
 The National Academy of Sciences, India (NASI)
- Delhi Chapter-
and
 
 MHRD-Institution Innovation Council (IIC)
Deen Dayal Upadhyaya College Chapter
(University of Delhi)
Under the aegis of DBT Star College Program
 
Jointly Organizes
Webinar Series by Distinguished Experts
 June 25, 2020 @ 10 am Indian Standard Time
Printed and Flexible Electronics and Devices
Dr. Jin-Woo Han
Research Scientist, Center for Nanotechnology,
NASA Ames Research Center, Moffett Field, California, USA
 
July 03, 2020 @ 04:30 pm Indian Standard Time
New chemistry and physics in magnetic oxides
Prof. J. Paul Attfield, FRS FRSE FRSC, Foreign Fellow INSA
Professor of Materials Science at Extreme Conditions
School of Chemistry, Centre for Science at Extreme Conditions,
The University of Edinburgh, Edinburgh
 July 09, 2020 @ 06:30 pm Indian Standard Time
Prof. Katepalli Sreenivasan, Foreign Fellow INSA
Dean Emeritus of NYU Tandon School of Engineering;
The Eugene Kleiner Professor for Innovation in Mechanical Engineering;
Professor of Physics (Faculty of Arts and Science);
Mathematics (Courant Institute of Mathematical Sciences)
 

July 10, 2020 @ 01:30 India Standard Time
Can Future Energy Needs be met Sustainably?
Prof. Sir Chris Llewellyn Smith, FRS, FAPS (USA), Honorary Fellow, IOP (UK), Foreign Fellow INSA(India)
Rudolf Peierls Centre for Theoretical Physics
Parks Road, Oxford OX1 3PU
 July 11, 2020 @ 03:30 pm Indian Standard Time
Are we there yet? How do cells find their way?
Prof. Philip K. Maini, FRS, FIMA, FRSB, FMedSci, Foreign Fellow INSA (India)
Wolfson Centre for Mathematical Biology
Mathematical Institute, Andrew Wiles Building, Radcliffe Observatory Quarter
Woodstock Road, Oxford
 July 14, 2020 @ 04:30 pm Indian Standard Time
The influence of infection on Society before Covid19
Prof. Sir Peter Julius Lachmann, FRS, FRCP, FRCPath, FMedSci, Foreign Fellow INSA(India)
Fellow, Emeritus Sheila Joan Smith Professor of Immunology
Christ College, University of Cambridge
No registration fee to attend the Lecture. However, all interested should register via Google form on or before June 22, 2020 to attend the lectures via CISCO Webex/Google Meet. Link for Google form:

Organizer: Prof. Ajoy Ghatak, Chairperson - NASI Delhi Chapter & Prof. Anurag Sharma, Secretary - NASI Delhi Chapter
Coordinator:
Dr. Manoj Saxena, MNASc and Executive Committee Member-NASI Delhi Chapter
Associate Professor, Deptt. of Electronics, Deen Dayal Upadhyaya College, University of Delhi, New Delhi
Dr. Geetika Jain Saxena, Associate Professor, Department of Electronics, Maharaja Agrasen College, University of Delhi, New Delhi

Jun 9, 2020

Virtual Education Events at ESSDERC/ESSCIRC 2020


Given this uncertain situation, the organizing committee of ESSDERC/ESSCIRC 2020 in Grenoble and its Steering Committee, have decided to propose a new format for coming conference, which will include a NEW and Virtual Education Event series being developed for September 14th 2020 consisting of 13 educational sessions (workshops and tutorial) comprising invited presentations by leading academic and industrial experts and technologists. All related technical program details are also available online: https://www.esscirc-essderc2020.org/educationals

1. TUTORIAL | Quantum Computing: Myth or Reality?
Chairs: M. Vinet (CEA) and Farhana Sheikh (Intel)
Full content duration ~6h
2. WORKSHOP | Emerging Solutions for Imaging Devices, Circuits and Systems
Chairs: Matteo Perenzoni (FBK) and Albert Theuwissen (Harvest Imaging)
Full content duration ~6h
3. WORKSHOP | Non-Volatile Memories: Opportunities and Challenges from Devices to Systems
Chairs: Gabriel Molas (CEA) and Mahmut Sinangil (TSMC)
Full content duration ~6h
4. WORKSHOP | New 5G integration solutions, and related technologies (from materials to system)
Chairs: Nadine Collaert (imec) and Stefan G. Andersson (Ericsson)
Full content duration ~6h
5. WORKSHOP | Advances in device technologies for automotive industry (power devices, SiC, GaN)
Chairs: Ionut Radu (Soitec) and Stefaan Decoutere (IMEC)
Full content duration ~6h
6. WORKSHOP | Embedded monitoring and compensation design for energy or safety constrained applications
Chairs: Sylvain Clerc (ST) and Keith Bowman (Qualcomm)
Full content duration ~4h
7. WORKSHOP | Edge AI and In-Memory-Computing for energy efficient AIoT solutions​
Chairs:  Andreas Burg (EPFL) and Marian Verhelst (KUL)
Full content duration ~6h
8. WORKSHOP | Ab-initio simulations supporting new materials & process developments
Chairs: Denis Rideau (ST) and Philippe Blaise (Silvaco)
Full content duration ~3h
9. WORKSHOP | RISC-V cooking session
Chairs: Bora Nikolic (BWRC)
Full content duration ~3h
10. DISSEMINATION WORKSHOP |  Toward sustainable IOT from rare materials to big data
Chairs:  Thierry Baron (CEA, LTM/UGA) and Audrey Dieudonné (UGA)
Full content duration ~3h
11. DISSEMINATION WORKSHOP | High Density 3D CMOS Mixed-Signal Opportunities
Chair: Philipp Häfliger (UiO)
Full content duration ~3h
12. MOS-AK WORKSHOP | Compact/SPICE Modeling and its Verilog-A Standardization
Chair: Wladek Grabinski (MOS-AK) and Daniel Tomaszewski (ITE Warsaw)
Full content duration ~6h
13. IPCEI on Microelectronics: Innovative Technologies for Shaping the Future
Chairs: Dominique Thomas (ST), Klaus Pressel (Infineon), Rainer Pforr (Zeiss)
Full content duration ~6h

Nov 11, 2019

8th International NRNU MEPhI Workshop

VIII Международный научно-методический семинар по средствам автоматизированного проектирования интегральных микросхем для физического эксперимента совместно с компанией Cadence

it is our pleasure to announce the 8th International Workshop and school on computer aided design of integrated circuits for physical experiments to be held at NRNU MEPhI on November 25-27, 2019. The Workshop and school are organized by NRNU MEPhI jointly with Cadence Design Systems. The program and further information are available via site cad.mephi.ru.

Participation in the event is free of charge but registration is necessary.

E. Atkin, NRNU MEPhI event secretary,

Mar 14, 2019

[mos-ak] [press note] 2nd MOS-AK India Conference at IIT Hyderabad Feb. 25-27, 2019

2019 IEEE International Conference on Modeling of Systems Circuits and Devices
Organised by Joint Chapter of CAS /ED Societies, IEEE Hyderabad Section
2nd MOS-AK India Conference (IEEE Conference #45395)
Venue: IIT Hyderabad February 25-27, 2019

The MOS-AK Compact Modeling Association, a global standardization forum for semiconductor device models, held its consecutive 2nd International IEEE MOS-AK India Conference 2019 between February 25-27, 2019 at the IIT Hyderabad. The 2nd International IEEE MOS-AK India Conference 2019 is the results of join, collaborative effort. The conference organization would not be possible without direct involvements and financial support provided directly by Collage and IIT Hyderabad as well as the MOS-AK distinguished industrial sponsors including: ams semiconductors, Rhode and Schwarz, Keysight, Synergy, Synopsys, Xilinx and SCL. The MOS-AK India Conference has  also drawn attention of the Joint Chapter of the CAS and EDS Societies of the IEEE Hyderabad Section which provided direct technical program cosponsorship. The Indian Electronic Semiconductor Association (IESA) as well as Swissnex India have provide pronounced dissemination support.

Inauguration session of 2nd International IEEE MOS-AK India Conference 2019 has been chaired by Prof. Mohammed Arifuddin Sohel, MJ College Hyderabad, who welcomed all MOS-AK participants and invited prominent guests Surinder Singh, Director, SCL;  Sebasties Hug, CEO and Consul General of Swissnex;  Sumohan Chenapayya, Dean R&D, IIT Hyderabad;  V. Hanuma Sai, Director, ams semiconductors India Pvt. Ltd.;  N. Venkatesh, Chair, IEEE Hyderabad Section;  Wladek Grabinski, MOS AK (EU);  P.A. Govindacharyulu, General Co Chair, MOS AK India 2019  to open  the 2nd MOS-AK/India Conference.

The MOS-AK India Conference program has been organized as three days scientific R&D event covering recent advances into the technology TCAD simulations, compact/SPICE modeling as well as the device level analog/RF and digital IC designs. The internationally renowned academic and industrial speakers and presenters have delivered 4 tutorial lectures [1-4], 7 keynote talks [5-11], 2 plenary talks [12-13] as well as 22 regular research papers. The MOS-AK Association is an open research forum adequately supporting all R&D activities. An open panel discussion was organized to review challenges and opportunities for women in engineering (WIE) [14]. The MOS-AK speakers shared their latest perspectives on compact/SPICE modeling and Verilog-A standardization in response to the dynamically evolving semiconductor industry and academic R&D efforts. The event featured advanced technical presentations covering compact model development, implementation, and deployment. Presented original unpublished works in all the topics related to the compact/SPICE modeling and its Verilog-A standardization will be submitted for further publication. The conference proceedings will be submitted to IEEE Explore. Best MOS-AK/India papers has been selected and awarded: Gold leaf [15], Silver leaf [16] and Bronze leaf [17] certificates, accordingly. Highest ranked paper authors from regular submission will be invited to extend their R&D contribution in the form of a book chapters in a book titled "Compact Modeling: Technology, Devices, IC Design" by River Publishers, the technical program promoter of MOS-AK/India 2019 Conference. These R&D topics have also received attention of local media and press [18-21]. For more information about each of the R&D contributions, go online to 2nd MOS-AK/India Conference
Photo: All the MOS-AK/India Conference participants at IIT Hyderabad
The MOS-AK Association plans to continue its standardization efforts by organizing future compact modeling meetings, workshops and courses arround the globe thru 2019 year, including:
About MOS-AK Association:
MOS-AK, an international compact modeling association primarily focused in Europe, to enable international compact modeling R&D exchange in the North/Latin Americas, EMEA and Asia/Pacific Regions. The MOS-AK Modeling Working Group plays a central role in developing a common information exchange system among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact/SPICE modeling and its Verilog-A standardization and related CAD/EDA tools including FOSS for the compact/SPICE models development, validation/implementation and distribution. For more information please visit: mos-ak.org

Tutorials:
[1] Dr. Charvaka Duvvury iT2 Technologies (USA) ESD on-chip protection design 
[2] Dr. Wladek Grabinski MOS-AK (EU) Verilog-A Standardization
[3] Weronika Zubrzycka, AGH, (PL) Radiation effect and Radiation hardening in devices 
[4] Prof. Roberto Murphy, INOE (MX) Characterization of Semiconductor Devices in the High Frequency Regime
Keynote Talks: 
[5] Prof. Yogesh Singh Chauhan, IIT Kanpur (IN) Negative Capacitance Transistors - Modeling, Simulation and Processor Performance
[6] Dr. Surinder Singh, Semiconductor Labs, Chandigarh  (IN), Chandigarh Research at SCL
[7] Weronika Zubrazycka, AGH, (PL) Radiation Effects on Circuits for Space and High-Energy Physics Applications - A case study 
[8] Madabusi Govindrajan, GLOBALFOUNDRIES, Bangalore (IN)  Challenges for RF modeling in the connected era 
[9] Dr. Usha Gogineni, Maxim Semiconductors (IN)  Compact Models for Analog and Mixed Signal Design 
[10] Prof. Santanu Mahapatra, IISc, Bangalore (IN)  Atom-to-Circuit modeling technique for emerging nanomaterial based MOSFETs 
[11] Prof. Gilson Wirth, UFRGS (BR) (Webinar) Charge Trapping Phenomena in MOSFETS: From Noise to Bias Temperature Instability 
Plenary Talks: 
[12] Prof. Jaijeet Roychowdhury, UC, Berkeley, USA Well-Posed Compact Modeling 
[13] Dr. Ehrenfried Seebacher, ams (A) Compact Modeling for Industrial Applications 
Panel Discussion: 
[14] Dr. G. Uma Devi, Director, NRSC, (IN): Challenges and opportunities for Women in Engineering (WIE). 
Best papers awards:
[15] Chithra and Nagendra Krishnapura, "Modeling Techniques for Faster Verification of a Time to Digital Converter System-on-Chip Design"
[16] Mohit Ganeriwala, Enrique Marin, Francisco Ruiz and Nihar Mohapatra," A Compact Charge and Surface Potential Model for III-V Quadruple-Gate FETs With Square Geometry"
[17] Suprava Dey, Tara Prasanna Dash, Chinmay Kumar Maiti, Jhansirani Jena, Eleena Mohapatra and Sanghamitra Das," Performance Evaluation of Gate-All-Around Si Nanowire Transistors with SiGe Strain engineering"
Headlines: 
[18] "Swiss interest in India's energy and tech fields" Date: Feb. 27,2019 Publication: The Hindu Edition: Hyderabad
[19] "IIT Hyderabad hosts MOS-AK India 2019 International Conference on Modeling of Systems Circuits and Devices" India Education diary  Edition: Online: Prof. Sushmee Badhulika 
[19] Indo-Swiss collaboration needed in education" Date: Feb. 27,2019 Publication: The New Indian express, Edition: Hyderabad
[20] "Switzerland looking forward to stronger ties with Telangana" Feb. 27,2019   Publication: Telangana Today, Edition:  Hyderabad
[21] "IIT Hyderabad hosts MOS-AK India 2019 International Conference on Modeling of Systems Circuits and Devices " Date: Feb. 27,2019 Publication: Andhra Jyothi Edition: Hyderabad pp:3

WG14032019

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Dec 21, 2018

[mos-ak] [press note] 11th International MOS-AK Workshop, Silicon Valley, December 5, 2018

Modeling of Systems and Parameter Extraction Working Group
11th International MOS-AK Workshop
Silvaco Inc. Headquarters, Silicon Valley, December 5, 2018
Summary

The MOS-AK Compact Modeling Association, a global standardization forum for semiconductor device models, held its 11th MOS-AK Workshop at the Silvaco Inc. headquarters in Santa Clara, Calif. on December 5, 2018. The event was co-located with the 2018 IEEE International Electron Devices (IEDM) and the Q4 Compact Modeling Coalition (CMC) meetings. The workshop receives technical program co-sponsorship from the IEEE Santa Clara Valley-San Francisco Chapter of the Electron Devices Society, Europractice, IJHSES as well as NEEDS of nanoHUB.org.

Bogdan Tudor, Silvaco Inc. and Wladek Grabinski, MOS-AK, welcomed more than 30 international academic researchers and modeling engineers. The nine technical compact modeling presentations covered nanoscale technologies, semiconductor devices modeling and advanced IC design.

The MOS-AK speakers shared their latest perspectives on compact/SPICE modeling and Verilog-A standardization in response to the dynamically evolving semiconductor industry and academic R&D efforts. The event featured advanced technical presentations covering compact model development, implementation, and deployment. For more information about each of the presentations, including full abstracts, go online to MOS-AK Workshop Silicon Valley 2018.

The nine topics presented were the following:
  1. Silvaco GaN HEMT Compact Modeling Perspective, Bogdan Tudor, Colin Shaw and Sungwon Kong, Silvaco, Inc.
  2. GaN HEMT Devices and Modeling for Operational Electronics at Harsh Environments, Saleh Kargarrazi, XLab, Stanford University
  3. Impact of Basal Plane Dislocations and Ruggedness of 10 kV 4H-SiC Transistors, Victor Veliadis, PowerAmerica, North Carolina State University
  4. Direct measurement of white noise in MOSFETs, Kenji Ohmori, Device Lab Inc.
  5. NEREID Technology Roadmap, Enrico Sangiorgi, NEREID, University of Bologna
  6. A Physics-Based Compact Model of RRAM for Emerging Applications, Paolo Pavan, University of Modena and Reggio Emilia
  7. From Physics to Power, Performance, and Parasitics, Oskar Baumgartner, Global TCAD Solutions GmbH
  8. MOS-AK FOSS Compact Modeling Perspective, Wladek Grabinski, IEEE EDS DL, MOS-AK
  9. Compact Model of Single TeraFET Spectrometer, Michael Shur, Rensselaer Polytechnic Institute
There were also presentations of Late News with the following topics:
  1. CMC Developer Model Software Licenses, Peter Lee, Micron
  2. Xyce Parallel Electronic Simulator (Ver. 6.10), Jason Verley, Sandia National Laboratories
  3. Call for Papers for ESSDERC/ESSCIRC 2019 in Krakow, Wladek Grabinski, MOS-AK
Photo: Some of the participants of the 11th MOS-AK Workshop at Silvaco Inc. Headquarters in Silicon Valley.

The MOS-AK Association plans to continue its standardization efforts by organizing future compact modeling meetings, workshops and courses in India, China, Europe, USA and, for the very first time, in Latin America, throughout the coming year, including:
About Silvaco:
Silvaco, Inc. is a leading EDA tools and semiconductor IP provider used for process and device development for advanced semiconductors, power IC, display and memory design. For over 30 years, Silvaco has enabled its customers to develop next generation semiconductor products in the shortest time with reduced cost. We are a technology company outpacing the EDA industry by delivering innovative smart silicon solutions to meet the world's ever-growing demand for mobile intelligent computing. The company is headquartered in Santa Clara, California and has a global presence with offices located in North America, Europe, Japan and Asia.

About Europractice IC Service:
The EUROPRACTICE IC Service brings ASIC design and manufacturing capability within the technical and financial reach of any company that wishes to use ASICs. The EUROPRACTICE IC Service, offered by IMEC and Fraunhofer, offers low-cost ASIC prototyping and ASIC small volume production ramp-up to high volume production through Multi Project Wafer - MPW - and dedicated wafer runs.

About MOS-AK Association:
MOS-AK is an international compact modeling association primarily focused in Europe, to enable international compact modeling R&D exchange in the North/Latin Americas, EMEA and Asia/Pacific Regions. The MOS-AK Modeling Working Group plays a central role in developing a common information exchange system among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact/SPICE modeling and its Verilog-A standardization and related CAD/EDA tools including FOSS for compact/SPICE model development, validation/implementation and distribution. For more information please visit mos-ak.org

Feb 10, 2017

Workshop on biomedical applications at EPFL Lausanne

Data communication and remote powering for biomedical applications 
Workshop organized by Prof. Catherine Dehollain and Dr. Maria-Alexandra Paun
on February 24, 2017 at 09:00-17:00 in Room BC 01, EPFL Lausanne

Workshop Program
Time
Invited Speaker
Presentation Title
09:00-09:35
Professor Catherine DEHOLLAIN,
EPFL, Lausanne, RF IC group
“Remotely powered sensor networks for medical applications”
09:35-10:10
Dr. Maria-Alexandra PAUN, EPFL, Lausanne, RF IC group
“Modeling and analysis of antennas in cochlear implants”
10:10-10:45
Dr. Gürkan YILMAZ, EPFL, Lausanne, RF IC group
“Wireless Power Transfer and Data Communication for Intracranial Neural Implants. Case Study: Epilepsy Monitoring”
Coffee Break (30 minutes)
11:15-11:50
Dr. Mehrdad GHANAD,
EPFL, Lausanne, RF IC group
“Remotely-Powered Batteryless Implantable Local Temperature Monitoring System for Freely Moving Mice”
11:50-12:25
Francesca STRADOLINI,
EPFL, Lausanne, LSI laboratory
“On-line monitoring of aesthetics during surgery: opportunities and challenges”
12:25-13:00
Professor Adrian M. IONESCU, EPFL, Lausanne, Nanolab laboratory
“Wearable biosensors and their applications in future digital health”
LUNCH (90 minutes)
14:30-15:05
Dr. Wladek GRABINSKI,
MOS-AK Association (EU)
“FOSS TCAD/EDA simulation tools with molecular/bio/med modeling examples”
15:05-15:40
Dr. Albrecht LEPPLE-WIENHUES,
Valtronic Technologies SA
“Ear infection, drug injectors and blood donation: innovative medical device development”
15:40-16:15
Dr. Qing WANG,
CHUV, Lausanne
“Development of a flow-through telemetry implant for monitoring cardiovascular blood pressure in small rodents and human”
16:15-16:50
Professor Philippe RYVLIN, CHUV, Lausanne
“Wearable devices for neurological diseases: Towards more rigorous clinical evaluation”
Concluding remarks (10 minutes)



Feb 1, 2017

IEEE Workshop on Compact Modeling

IEEE Workshop on Compact Modeling
March 3, 2017
Technical Sponsorship by: IEEE Electron Devices Society UP Chapter
Organized by: Department of Electrical Engineering, IIT Kanpur
Coordinator: Prof. Yogesh Singh Chauhan
Venue: Outreach Auditorium, IIT Kanpur

IEEE Workshop on Compact Modeling Agenda:
Time Topic Speaker
8:00 - 8:15 Workshop inauguration by Director IIT Kanpur and IEEE-UP Chairman
8:15 - 9:00 Industry Standard Compact Modelling Dr. Yogesh Singh Chauhan
IIT Kanpur
9:00 - 9:30 Modelling of mismatch and process variations Dr. Abhisek Dixit
IIT-Delhi
9:30 - 10:00 TBA Dr. Nihar Ranjan Mohapatra
IIT-Gandhinagar
10:00 - 10:30 Modelling of normally-off GaN based MOSHEMT Dr. Trupti Ranjan Lenka
NIT Silchar
10:30 - 10:45 ASM-HEMT: Industry standard compact model for GaN HEMTs Dr. Sudip Ghosh
IIT-Kanpur
10:45 - 11:00 Modelling of quasi ballistic transport in nano-wire transistors Mr. Avirup Dasgupta
IIT Kanpur
11:00 - 11:15 TBA Mr. Priyank Rastogi
IIT Kanpur
11:15 - 11:30 Compact modelling of TMD based thin body transistors Mr. Chandan Yadav
IIT Kanpur
11:30 - 11:45 Tea Break
11:45 - 12:15 Qualification techniques for sim models for EEsof products Mr. Mohit Khanna
Keysight Technologies
12:15 - 12:45 High frequency device characterization and modeling for THz applications Prof. Thomas Zimmer
IMS-BORDEAUX
12:45 - 2:00 Lunch
2:00 - 2:30 Device design consideration: IoT perspective Dr. Santosh Kumar Vishvakarma
IIT-Indore
2:30 - 3:00 TBA Dr. Aditya Sankar Medury
IISER-Bhopal
3:00 - 3:30 Simulations, analysis and applications of doping- and junction- free transistors Dr. Jawar Singh
IIIT-Jabalpur
3:30 - 4:00 Design of radiation hardened 24-bit ADC for generic applications Mr. H.S.Jattana
SCL
4:00 - 4:15 Tea Break
4:15 - 4:45 Role of Feynman diagrams in energy band structure of materials - A post density functional theory approach Dr. Sitangshu Bhattacharya
IIIT-Allahabad
4:45 - 5:15 TBA Dr. Swaroop Ganguly
IIT-Bombay
5:15 - 5:45 TBA Dr. Saurabh Lodha
IIT-Bombay
5:45 - 6:15 TBA Dr. Udayan Ganguly
IIT-Bombay
6:15 - 6:45 TBA Dr. Manoj Saxena
Delhi University
6:45 - 7:00 Closing Keynote

Nov 4, 2014

IEEE Swiss CAS/ED Workshop 2014 on Memristive Devices and Neuromorphic Applications

 IEEE Swiss CAS/ED Workshop 2014 on Memristive Devices and Neuromorphic Applications 
 (http://www.ieee.ch/chapters/cas-ed/cas-ed-news/2014-11-27/) 

Date: Friday 28 Nov, 2014
Time: 10:00-19:00
Place: UZH, Irchel Campus, Room Y35 F51 (morning session) Y10 03/04 (afternoon session), Building 55 Foyer (apero). Closest tram stop is Tram 9/10 at Irchel. See here for University of Zurich map.

At this one day workshop, experts in Memristive Devices and Neuromorphic Applications will present their recent advances in Circuits and Systems and Electron Devices. The workshop includes a demo and poster session, and a concluding apero.

Resistive memory devices also known as "memristors" are being actively researched to address the widening gap in performance between storage and the rest of the computing system. There is also a potential for such devices to serve simultaneously as both memory and logic, or even as components of a neuromorphic computing hardware based on brain architecture. The investigation of the use of these devices in a host of applications in science and technology are currently being explored. Swiss developers are very active in these fields and the area of neuromorphic computing. This one-day IEEE workshop brings them together with potential research and development partners and end users in industry and academia.

The presentations will cover a range of topics focus on memristive technology and possible computing applications. A poster session including demonstrations of relevant technologies will also be offered.

All presentations will be in English.

Registration: Registration is open to the public but is mandatory. There will be a registration fee which includes lunch and apero. Please register at www.iniforum.ch/casedws14/registration.php.

Registration will be closed by 14.11.2014 or when the maximum number of places is reached. Registration must be cancelled by 21.11.2014 for refund.

Posters and Demos registration: We invite demos and posters. Poster or demo presentations must also register for the workshop (see above). Posters or demos must be registered so that we can plan space for them. Please use this demo and registration form to register.

Jul 16, 2014

[SISPAD] Compact Modeling Worksops - Enabling Better Insight of Device Features - Monday, September 8, 2014


 SISPAD Compact Modeling Workshop
 Enabling Better Insight of Device Features 
 Monday, September 8, 2014

 Workshop Program

09:15 - 09:20: Opening 

09:20 - 10:00: J. Takeya (University of Tokyo, Japan): invited Physics of Charge Transport in Organic Field-Effect Transistors
10:00 - 10:40: C. Jungemann (RWTH Aachen University, Germany): invited Validity of Macroscopic Noise Models in the Case of High-Frequency Bipolar Transistors
10:40 - 11:00: break
11:00 - 11:40: N. Goldsman (University of Maryland, USA): invited Key Issues in the Modeling of SiC Electronic Devices
11:40 - 12:10: C. Ma (Hiroshima University, Japan): invited Universal Model of the Negative Bias Temperature Instability (NBTI) Effect for Circuit Aging Simulation

12:10 - 12:30: poster presentations
  • P. X. Tran (International University, Vietnam) A Comprehensive Model for the Changing I-V Characteristics of raphene Transistors 
  • M. Ghittorelli, F. Torricelli, Z. M. Kovacs-Vajna, and L. Calalongo (University of Brescia, Italy) Accurate Modeling of Amorphous Indium-Gallium-Zinc-Oxide TFTs Deposited on Plastic Foil 
  • S. Sato, Y. Omura, and A. Mallik (Kansai University, Japan) Proposal of Simple Channel-Length-Dependent Current Model for Subthreshold Region of Nano-Wire Tunnel FET 
  • H. Miyamoto, H. Zenitani, H. Kikuchihara, H. J. Mattausch, M. Miura-Mattausch, and T. Nakagawa (HU & AIST, Japan) Consistent Compact Modeling of MOSFETs from Bulk to Double-Gate Structures
12:30 - 13:50: lunch

13:50 - 14:30: D. Warning (Creative Chips GmbH, Germany): invited NGSPICE – an Open Platform for Modeling and Simulation
14:30 - 15:00: A. Schaldenbrand (Cadence Design Systems, Japan): invited Benefits of Verilog-A for Behavioral Modeling and Compact Modeling
15:00 - 15:30: P. Lee (Micron Memory Japan, Inc.): invited Compact Model Coalition: World-Wide Model Standardization for an Expanding Industry

15:30 - 15:40: break

15:40 - 16:00: F. Torricelli, M. Ghittorelli, M. Rapisarda, L. Mariucci, S. Jacob, R. Coppard, E. Cantatore, Z. M. Kovacs-Vajna, and L. Colalongo (Unviersity of Brescia, Italy) Analytical Drain Current Model of Both p- and n-Channel OTFTs for Circuit Simulation
16:00 - 16:20: T. Nakagawa, T. Sekigawa, M. Hioki, Y. Ogasahara, H. Koike, H. Zenitani, H. Miyamoto, H. Kikuchihara, H. J. Mattausch, M. Miura-Mattausch, H. Oda, and N. Sugii (AIST, HU, LEAP, Japan) Parameter-Extraction Strategy of Ultra-Thin Silicon and BOX Layer MOSFETs for Low Voltage Applications
16:20 - 16:40: T. Mizoguchi, T. Naito, Y. Kawaguchi, and W. Hatano (Toshiba, Japan) Compact Modeling of GaN-MISFET for Power Applications
16:40 - 17:00: T. Yamamoto and H. Kato (Denso, Japan) Analysis and Modeling of Injection Enhanced Insulated Gate Bipolar Transistor

17:00: Closing

Jun 11, 2014

ESSDERC/ESSCIRC 2014 - Full conference program is now available

The technical programtutorial program, and workshop program of ESSDERC/ESSCIRC 2014
are now available at  ESSDERC/ESSCIRC 2014  website: http://www.esscirc-essderc2014.org 

Please remember to register to the conference and book a hotel room at before June 20, after 
which we cannot guarantee that you will find a hotel room at our rebated prices.
The event is technically co-sponsored by the
    IEEE Electron Device Society,
    IEEE Solid-State Circuit Society
    IEEE Circuits and Systems Society


We hope to see you in Venice

Best Regards
  Gaudenzio Meneghesso
ESSDERC/ESSCIRC 2014  General Chair

Roberto Bez and Paolo Pavan
ESSDERC 2014 TPC Chairs

Pietro Andreani and Andrea Bevilacqua 
ESSCIRC
 
2014 TPC Chairs


JOINT PLENARY TALKS 
Scott DeBoer
, Micron, ID, USA, A Semiconductor Memory Manufacturing and Development Perspective
Thomas H. Lee
, Stanford University, CA, USA Terahertz Electronics: The Last Frontier 
Fabio Marchiò
, STMicroelectronics, Italy, Automotive Electronics: Application & Technology Megatrends
Walter Snoeys
, CERN, Switzerland, How Chips Helped Discover the Higgs Boson at CERN
An Steegen
, IMEC, Belgium, Logic Scaling Beyond 10nm, a Power-Performance-Area-Cost Trade-off 
Sehat Sutardja
, Marvell Semiconductor, CA, USA Tremendous Benefits of Moore’s Law Have Yet to Come
ESSCIRC PLENARY TALKS
Hooman Darabi
, Broadcom Corporation, CA, USA Blocker Tolerant Software Defined Receivers
Un-Ku Moon, Oregon State University, OR, USA Emerging ADCs
Kathleen Philips
, IMEC-Holst Centre, The Netherlands Ultra-Low Power Short Range Radios
ESSDERC PLENARY TALKS
Umesh Mishra
, UCSB and TRanphorm, CA, USA,  GaN-based solutions from KHz to THz 
Eric Pop, Stanford University, CA, USA, Energy Efficiency and Conversion in 1D and 2D Electronics
Takao Someya
, University of Tokyo, Japan Bionic Skins Using Flexible Organic Devices

ESSCIRC TUTORIALS
Power Management for SoCs (Full Day), Organizer: Christoph Sandner, Infineon, Austria
High Performance Amplifiers 
(Half Day), Organizer: Angelo Nagari, STMicroelectronics, France
Phase Noise: from Fundamentals to Circuit Aspects (Half Day) Organizer: Christian Enz, EPFL, Switzerland
ESSDERC TUTORIALS
CMOS Technology at the nm Scale Era 
(Full Day) Organizer: Maud Vinet, CEA LETI, France
RRAM: from Technology to Applications (Half Day) Organizer: Bogdan Govoreanu, IMEC, Belgium 
3D: from Technology to Applications 
(Half Day) Organizer: Pascal Vivet, CEA LETI, France

ESSDERC/ESSCIRC Workshops
Beyond-CMOS for advanced More Moore and More than Moore applications
 
Organizers: Francis Balestra and Enrico Sangiorgi, Sinano Institute - Grenoble INP/CNRS, France
MOS-AK: Over Two Decades of Enabling Compact Modeling R&D Exchange   
Organizer: Wladek Grabinski, MOS-AK Group (EU),
Status of the GaN and SiC based device development
   
Organizer: Enrico Zanoni, University of Padova, DEI, Italy
THz-Workshop: Millimeter- and Sub-Millimeter-Wave circuit design and characterization
   
Organizer: Thomas Zimmer, University Bordeaux, France
Marie Curie ATWC
   
Organizer: Rinaldo Castello, University of Pavia and Marvell, Italy

Apr 21, 2014

[Abstracts Due Extended] 2014 NanoTech Workshop on Compact Modeling


 NanoTech Workshop on Compact Modeling Important Dates:
  • Late Poster Abstracts Due: Rolling Submissions - May 15
  • Notification: Rolling Notification Date
Authors of research submissions, upon acceptance, must register for the conference. [read more...]

Mar 7, 2014

SISPAD2014: 2nd Call for Papers

Second Call for Papers
SISPAD2014
September 9 – 11, 2014
Workshop, September 8, 2014
Mielparque Yokohama, Yokohama, JAPAN
Co-sponsored by Japan Society of Applied Physics Technical 
Co-sponsored by IEEE Electron Devices Society

This conference provides an opportunity for the presentation and discussion of the latest advances in modeling and simulation of semiconductor devices, processes, and equipment for integrated circuits.

Topics:
  • Modeling and simulation of all sorts of semiconductor devices, including FinFETs, ultra-thin SOI devices, emerging memory devices, optoelectronic devices, TFTs, sensors, power electronic device, widegap semiconductor devices, spintronic devices, tunnel FETs, SETs, carbon-based nanodevices, organic electronic devices, and bioelectronic devices
  • Modeling and simulation of all sorts of semiconductor processes, including first-principles material design and growth simulation of nano-scale fabrication
  • Fundamental aspects of device modeling and simulation, including quantum transport, thermal transport, fluctuation, noise, and reliability
  • Compact modeling for circuit simulation, including low-power, high frequency, and power electronics applications
  • Process/device/circuit co-simulation in context with system design and verification
  • Equipment, topography, lithography modeling
  • Interconnect modeling, including noise and parasitic effects
  • Numerical methods and algorithms, including grid generation, user-interface, and visualization
  • Metrology for the modeling of semiconductor devices and processes
Plenary Speakers:
  • Augusto Benvenuti, Micron Technology,
    “Current status and future prospects of non-volatile memory modeling”
  • Massimo V. Fischetti, University of Texas at Dallas,
    “Physics of electronic transport in low-dimensionality materials for future FETs”
  • Kimimori Hamada, Toyota Motor Corporation,
    “TCAD challenge on development of power semiconductor devices for automotive applications”
Invited Speakers:
  • Mario Ancona, Naval Research Laboratory,
    “Nonlinear thermoelectroelastic simulation of III-N devices”
  • Asen Asenov, University of Glasgow,
    “Progress in the simulation of time dependent statistical variability in nano CMOS transistors”
  • Jean-Pierre Colinge, Taiwan Semiconductor Manufacturing Company,
    “Nanowire transistors: pushing Moore's law to the limit”
  • Tibor Grasser, Vienna University of Technology,
    “Advanced modeling of charge trapping: RTN, 1/f noise, SILC, and BTI”
  • Kohji Mitsubayashi, Tokyo Medical and Dental University,
    “Novel biosensing devices for medical applications”
  • Christian Sandow, Infineon Technologies,
    “Exploring the limits of the safe operation area of power semiconductor devices”
  • Mark Stettler, Intel Corporation,
    “Device and process modeling: 20 years at Intel's other fab”
Workshops:
Two companion workshops will run concurrently prior to the start of the conference on Monday September 8, 2014:
  • Compact Modeling "Enabling Better Insight of Device Features"
    Organizer: Mitiko Miura-Mattausch (Hiroshima University)
  • Carrier Transport in Nano-Transistors: Theory and Experiments
    Organizer: Hideaki Tsuchiya (Kobe University) and Yoshinari Kamakura (Osaka University)
Abstract Submission: 
Authors are invited to submit a two-page abstract (A4 or 22×28cm) including figures. Full submission information is available at the ing web page: <https://sites.google.com/site/sispad2014/>. Authors of accepted papers will be notified by May 15, 2014. Camera-ready copy of a four-page manuscript will be required from the authors for inclusion in the Conference Proceedings by June 30, 2014.

Deadline for submission of abstract: March 31, 2014

Feb 22, 2014

Custom IC Design & Device Modeling - Tools and Technologies


Synopsys University Symposium

Friday, March 7; 9:00 a.m. to 5:30 p.m; The Lalit New Delhi Hotel

The Synopsys University Symposiums are for members of the academic community to get the latest information on design automation solutions, methodologies and standards. These FREE technical seminars are a resource to help accelerate innovation. Join us at this symposium to learn how you can achieve the highest value and productivity from your Synopsys tool investment.

Device Modeling
With growing device and design complexity, device-circuit co-design is becoming an increasingly important area of research. Today, devices and circuits are designed and optimized together for superior performance, yield and reliability. Synopsys TCAD tools are indispensable for device design and optimization.

[Agenda on-line]

Jan 18, 2014

[Final Program] EUROSOI 2014, Tarragona, Catalonia, Spain; January 27-29, 2014

The 10th Workshop of the Thematic Network
on Silicon on Insulator Technology, Devices and Circuits 
(EUROSOI 2014
Tarragona, Catalonia, Spain 
January 27-29, 2014 

The EUROSOI Workshop is an international forum to promote interaction and exchangesbetween research groups and industrial partners involved in SOI activities all over the world. Following the lively experience of the previous meetings in Granada (2005), Grenoble (2006), Leuven (2007), Cork (2008), Gšteborg (2009), Grenoble (2010), Granada (2011), Montpellier (2012), Paris (2013), EUROSOI 2014 will be held in Tarragona, Catalonia, Spain, and will include a short course program, oral and poster sessions, outstanding key-note presentations, as well as ample rooms for informal discussions. EUROSOI covers recent progress in SOI technologies and will be of interest to materials and device scientists, as well as to process, circuits and applications oriented engineers.

Monday, January 27, 2014

8:30 REGISTRATION
9:05-9:20 SHORT COURSE OPENING
9:20-11:00 PART 1 - EDS MINI-COLLOQUIUM ON SOI TECHNOLOGY 
9:20-10:10 "Process Challenges for Advanced Ge CMOS Technologies" Cor Claeys (IMEC, Leuven, Belgium)
10:10-11.00 "From Floating-Body Memory to Unified Memory on SOI" Sorin Cristoloveanu (INPG, Grenoble, France)
11:00-11:30 COFFEE BREAK
11:30-12:20 "Fabrication Challenges for sub-10 nm Technology nodes" Michael Ostling (KTH, Stockholm, Sweden)
12:20-13:00 "ESD protection of FD and MuG SOI CMOS Chips" Dimitris Ioannou (George Mason University, Fairfax, VA, USA)
13:00-14:30 LUNCH
14:30-15:50 Part 2 -EUROSOI TUTORIAL 
14:30-15:20 "Advanced SOI MOSFET architectures" Jason Woo (UCLA, CA, USA)
15:20-16:00 "SOI CMOS sensors, transistors and circuits for ultra-low-power and harsh environment applications" Denis Flandre (UCL, Louvain-la-Neuve, Belgium)
16:00-16:30 COFFEE BREAK
16:30-18:00 SOI MOSFET CHARACTERIZATION 
16:30-17:20 "On the threshold voltage and interface coupling in advanced SOI MOSFETs" Tamara Rudenko (ISP, Kyiv, Ukraine)
17:20-18:00 "From SOI MOSFET to Spin MOSFET: a modeling approach" Viktor Sverdlov (Tu-Wien, Austria)
20:30 EUROSOI RECEPTION

Tuesday January 28, 2014 

8:15 REGISTRATION
8:45-9:00 OPENING
9:00-11:00 PLENARY SESSIONS 
9:00-9:40 "Taking the next step on advanced HKMG SOI technologies -from 32 nm PD SOIvolume production to 20/28 FD SOI and beyond" Manfred Horstmann (Globalfoundries, Dresden, Germany) invited talk
9:40-10:20 INVITED TALK 
Heike Riel (IBM Research, Zurich) -invited talk
10:20-11:00 "Beyond Si CMOS: Benefits and Challenges " Rafael Rios (Intel, Portland OR, USA) -invited talk
11:00-11:20 COFFEE BREAK
11:20-13:00 SOI MATERIALS TECHNOLOGY AND CHARACTERIZATION 
11:20-11:40 Process and performance of Copper TSVs Lado Filipovic et al.
11:40-12:00 Increasing mobility and spin lifetime with shear strain in thin silicon films Dmitri Osintsev et al.
12:00-12:20 A Comparative Study of Variability of RTN Power Spectral Densities in Bulk and SOIMOSFETs  Louis Gerrer et al.
12:20-12:40 Low temperature noise spectroscopy of p-channel SOI FinFETs Bogdan Cretu et al.
12:40-13:00 Channel Length Influence on the Low-Frequency Noise of Strained 45o Rotated Triple Gate SOI nFinFETs Marcio Alves Sodre de Souza et al.
13:20-14:10 LUNCH
14:10-15:50 SOI MOSFET TECHNOLOGY 
14:10-14:30 Impact of S/D doping profile into electrical properties in nanoscaled UTB2SOI  devices Carlos Sampdero et al.
14:30-14:50 TCAD investigation on a formal Neuron device in 28nm UTBB FDSOI technology Philippe Galy et al.
14:50-15-10 Dual ground plane for high-voltage MOSFET in UTBB FDSOI Technology Antoine Litty et al.
15:10-15:30 Trigate NanoWire MOSFETs Analog Figures of Merit Kilchytska, Valeriya et al.
15:30-15:50 Electrostatically-doped SL FET optimized to meet all the ITRS power targetsat V_DD=0.4 V Elena Gnani et al.
15:50-16:00 COFFEE BREAK
16:00-17:20 SOI MOSFET CHARACTERIZATION 
16:00-16:20 Enhanced Dynamic Threshold Voltage UTBB SOI nMOSFETs Katia Sasaki et al.
16:20-16:40 Parasitic bipolar effect in advanced FD SOI MOSFETs: experimental evidence andgain extraction Fanyu Liu et al.
16:40-17:00 Impact of Lateral Fin-Width Non-Uniformity of FinFETs Clarissa Prawoto et al.
17:00-17:20 Surface effects on split C-V measurements on SOI wafers Luca Pirro et al.
17:20-17:40 Impact of Self-Heating on UTB MOSFET ParametersS ergej Makovejev at al.
17:40-18:00 POSTER BRIEFING (3 MIN EACH) 
18:00-19:40 POSTER SESSION 
Subthreshold Behavior of the PD SOI NMOS Device Considering BJT and DIBL Effects James Kuo et al.
Investigation of Statistical Effects on Reliability of SOI FinFETs Including Sidewall Crystal Orientation Salvatore Amoroso et al.
Powering the More than Moore Electronics with i-MOSLining Zhang et al.
Analysis of Short-Channel Effect in SOTB-MOSFET for Ultra-Low Power Applications Hidenori Miyamoto et al.
2D Analytical Modeling of the Trap-Assisted-Tunneling Current in Double-GateTunnel-FETs Michael Graef et al.
Improved Compact Current Model for FinFETs Based in a New Geometric Approach Arianne Pereira et al.
Capability of the IDS Analytical Model on Predicting the Diamond Variability by Usingthe F-Test Statistic Evaluation Salvador Gimenez et al.
An appraise of the sources of electrical parameters variation in DGMOS Rodrigo Picos et al.
An analytical model for the inversion charge distribution in GAA MOSFETs with rounded corners Francisco Ruiz et al.
The Negative World-line Holding Bias Effect on the Retention Time in FBRAMs Sara Santos et al.
20:30 GALA DINNER

Wednesday January 29, 2014 

8:30-10:30 SOI MOSFET MODELLING 
8:30-8:50 Comprehensive Low-Field Mobility Modeling in Nano-Scaled SOI Channels Zlatan Stanojevic et al.
8:50-9:10 A comprehensive DC current model to describe FinFET self-heating effects Benito Gonz‡lez et al.
9:10-9:30 Channel-Length Impact on Supercoupling Effect in FD-MOSFETs Carlos Navarro et al.
9:30-9:50 Substrate Effect on Threshold Voltage of long and short channel UTBB SOI nMOSFETs Joao Martino et al.
9:50-10:10 In depth characterization of electron transport in 14nm FD-SOI nMOS devices Minju Shin et al.
10:10-10:30 Role of the gate in ballistic nanowire SOI MOSFET Anurag Mangla et al.
10:30-10:50 COFFEE BREAK
10:50-13:10 CIRCUITS, MEMORIES AND SENSORS 
10:50-11:30 "Future of Multi-gate CMOS Technology" Hiroshi Iwai (University of Tokyo, Japan)
11:30-11:50 Impact of SEU on Bulk and FDSOI CMOS SRAM Walter Enrique Calienes Bartra et al.
11:50-12:10 Mechanical Characterization and Modelling of Lorentz Force Based MEMS Magnetic Field Sensors Petros Gkotsis et al.
12:10-12:30 Performance of Source-Follower Buffers Implemented with Junctionless Nanowire nMOS Transistors Michelly Souza et al.
12:30-12.50 PMOSFET-based Pressure Sensors in FD SOI Technology Benoit Olbrechts et al.
12:50-13:10 Performance of Common-Source current mirrors with asymmetric self-cascode SOInMOSFETs  Rafael Assalti et al.
13:10-14:20 LUNCH
14:20-16:10 BEYOND CMOS: NANOWIRES AND JUNCTIONLESS TRANSISTORS 
14:20-15:00 "2D semiconductor channels for ultimate thickness scaling and other versatile applications" Athanasios Dimoulas (IMS, Demokritos, Athens, Greece)
15:00-15:20 A way to solve Poisson equation en cylindrical coordinates to obtain a compact model for Junctionless Gate All Around MOSFET Franois Lime et al.
15:20-15:40 Explicit analytical charge and capacitance models for Junctionless Surrounding GateTransistors  Oana Moldovan et al.
15:40-16:00 Performance Evaluation of Stacked Gate-All-Around MOSFETs Meng-Hsueh Chiang et al.
16:00-16:20 Modeling of Quantization Effects in Nanoscale DG Junctionless MOSFETs Thomas Holtij et al.
16:20-16:30 COFFEE BREAK
16:30-16:50 BEYOND CMOS (TFETs) 
16:30-16:50 Heterojunction TFET inverters providing better performance than multi-gate CMOS at sub 0.3V Vdd Elena Gnani et al.
16:50-17:10 Transport mechanism influence on Vertical Nanowire-TFET analog performance as a function of temperature Paula Agopian et al.
17:10-17:30 3D Modeling of Direct Band-to-Band Tunneling in Nanowire TFETs. Lidija Filipovic et al.
17:30-17:50 Influence of the gate oxide thickness on the Analog Performance of vertical Nanowire-Tunnel FETs with Ge Source Felipe Neves et al.
17:50-18:10 Influence of a precisely positioned channel dopant on the performance of gate-allaround Si nanowire transistor: a full 3D NEGF simulation study Vihar Georgiev et al.
18:10-18:20 CONCLUSIONS AND ANNOUNCEMENTS