[Final Program] 18th MOS-AK ESSDERC/ESSCIRC Workshop Grenoble; Sept. 6, 2021

Arbeitskreis Modellierung von Systemen und Parameterextraktion

Modeling of Systems and Parameter Extraction Working Group

18th MOS-AK ESSDERC/ESSCIRC Workshop

Grenoble, Sept. 6, 2021

Together with local Host and MOS-AK Organizers as well as all the Extended MOS-AK TPC Committee, we invite you to the consecutive 18th MOS-AK ESSDERC/ESSCIRC Workshop. Scheduled Virtual/Online MOS-AK event aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and TCAD/EDA tool developers and vendors.

The MOS-AK Workshop Program is available online: 

https://www.mos-ak.org/grenoble_2021/

Venue: Online MOS-AK Webinar;

use the online form/link below to register.

Online Registration is open

any related enquiries can be sent to registration@mos-ak.org

Post-workshop publications, selected, the best papers will be recommended for further publication in the special compact/SPICE modeling issue of the Solid State Electronics.

-- W.Grabinski; MOS-AK (EU)

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Enabling Compact Modeling R&D Exchange

www.mos-ak.org

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WG210721

EU Goal: Reach 20% World-Share in Chip Manufacturing by 2020

EU to spend € 10 billion to trigger € 100 billion investments — SEMI provides the platforms for our members to share critical implementation issues and actions to support the goals set by the EU [H. Kundert, president, SEMI Europe] 

The new European industrial strategy for micro- and nano-electronics, published on 23 May 2013, sets the framework for targeted investment across the electronics value and innovation chain. An Industrial Strategy Roadmap for Investment, to be developed by end 2013, will cover three complementary lines:

• Transition to 450mm, expected to primarily benefit equipment and material manufacturers in Europe
• “More than Moore” on 200mm and 300 mm
• “More Moore” for ultimate miniaturization on 300mm wafers

Investment will be concentrated, focusing on Europe’s clusters of excellence in manufacturing and design (Grenoble, Dresden and Eindhoven-Leuven), but will also support partnerships and alliances across the value chain in Europe.

[read more...] also don't miss the SEMICON Europa 2013 Call for Papers (open until June 27). The conferences are a great opportunity to present your technology and latest achievements to a large audience of industry professionals. For more information about SEMICON Europe programs, the Call for Papers and opportunities to exhibit and present your products please go online and visit semiconeuropa.org.