Sub-Minimum-Area MPW Sharing

Is Your Multi-Project Wafer Project Smaller Than the Fab Minimum Area?

Share the minimum area with other MPW customers to save mask costs

With the cost of mask sets going up with every node, even a multi-project wafer (MPW) can break your NRE budget, particularly if you plan to run multiple test spins. At 28nm, a 6mm2 area tile can cost over $100,000.

One solution is to share the minimum tile area with someone else who is using the same technology and metal stack that you are targeting. We periodically get these kinds of requests from customers. Please contact directly star@esilicon.com if you would like eSilicon to list your own MPW shuttle sharing opportunity, or if you would like eSilicon to contact you when future MPW tile sharing opportunities are available.

Following are upcoming opportunities to share a multi-project wafer (MPW) tapeout with another eSilicon customer. If you are interested, just email eSilicon.

Multi-Project Wafer Minimum Tile Sharing Opportunities for TSMC Technologies

Tapeout Month	Technology	Metal Stack	I/O	Price/mm2	Minimum Area	Final GDSII Due	Tapeout Date	Estimated Ship Date
October	65nm MS RF GP	1P9M_6x1z1u	2.5V	$4,700	1mm2	October 10	October 12	November 23
	65nm MS RF LP	1P9M_6x1z1u	2.5V	$4,700	1mm2	October 10	October 12	November 23
	180nm MS RF G	1P6M_4x1u	3.3V	$1,000	5mm2	October 24	October 26	December 7
November	40nm MS RF LP	1P10M	1.8V	$7,500	1mm2	October 31	November 2	January 17

[read more...]

#Compact #Modeling of Surface Potential, Charge, and Current in Nanoscale Transistors Under Quasi-Ballistic Regime https://t.co/BsnCEEdo8a

#Compact #Modeling of Surface Potential, Charge, and Current in Nanoscale Transistors Under Quasi-Ballistic Regime https://t.co/BsnCEEdo8a

— Wladek Grabinski (@wladek60) October 21, 2016

from Twitter https://twitter.com/wladek60

October 21, 2016 at 04:54PM
via IFTTT

Free Semiconductor Books on SemiWiki

Download free PDF versions of three pivotal semiconductor books available on SemiWiki.com:

1. Mobile Unleashed: The History of ARM
2. Fabless: The Transformation of the Semiconductor Industry
3. EDAGraffiti: 25 years of experience in EDA

Only registered SemiWiki members can access these wiki pages so if you are not already a member please join as a guest: https://www.semiwiki.com/forum/register.php

[mos-ak] [2nd Announcement and Call for Papers] 9th International MOS-AK Workshop Berkeley DEC.7, 2016

 9th International MOS-AK Workshop  

  Berkeley December 7, 2016 
    2nd Announcement and Call for Papers   

Together with the MOS-AK workshop host, Prof. Jaijeet Roychowdhury, UCB and International MOS-AK Board of R&D Advisers: Larry Nagel, Omega Enterprises Consulting (USA), Andrei Vladimirescu, UCB (USA); ISEP (FR) as well as all the Extended MOS-AK TPC Committee, we have pleasure to invite to the 9th International MOS-AK Workshop which will be held at EECS Department, University of California, Berkeley on December, 7, 2016. Planned MOS-AK workshop is organized with aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors.

Important Dates:

• Preannouncement - Sept 2016
• Call for Papers - Oct. 2016
• Final Workshop Program - Nov. 2016
• MOS-AK Workshop - Dec. 7 2016

Venue:

EECS Department
University of California, Berkeley

Topics to be covered include the following among other related to the compact/SPICE modeling :

• Compact Modeling (CM) of the electron devices
• Advances in semiconductor technologies and processing
• Verilog-A language for CM standardization
• New CM techniques and extraction software
• Open Source TCAD/EDA modeling and simulation
• CM of passive, active, sensors and actuators
• Emerging Devices, TFT, CMOS and SOI-based memory cells
• Microwave, RF device modeling, high voltage device modeling
• Nanoscale CMOS devices and circuits
• Technology R&D, DFY, DFT and reliability/ageing IC Designs
• Foundry/Fabless Interface Strategies

Online MOS-AK Abstract Submission:
Prospective authors should submit online 

http://www.mos-ak.org/berkeley_2016/abstracts.php

(any related inquiries can be sent to abstracts@mos-ak.org)

Online Workshop Registration:

http://www.mos-ak.org/berkeley_2016/registration.php
(any related inquiries can be sent to register@mos-ak.org)

Postworkshop Publications:
Selected best MOS-AK technical presentation will be recommended for further publication in a special issue of the International Journal of High Speed Electronics and Systems

Extended MOS-AK Committee

WG19102016

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Reliable Gate Stack And Substrate Parameter Extraction Based On CV Measurements For 14nm FDSOI Technology https://t.co/enF2K7D6tT #papers

Reliable Gate Stack And Substrate Parameter Extraction Based On CV Measurements For 14nm FDSOI Technology https://t.co/enF2K7D6tT #papers

— Wladek Grabinski (@wladek60) October 17, 2016

from Twitter https://twitter.com/wladek60

October 17, 2016 at 02:19PM
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Theoretical analysis and modeling for nanoelectronics https://t.co/PsFJzoJgC8 #papers #feedly

Theoretical analysis and modeling for nanoelectronics https://t.co/PsFJzoJgC8 #papers #feedly

— Wladek Grabinski (@wladek60) October 15, 2016

from Twitter https://twitter.com/wladek60

October 15, 2016 at 10:00PM
via IFTTT

FOSDEM 2017 EDA Devroom Call for Participation

FOSDEM 2017 Electronic Design Automation Devroom
Call for Participation

This is the call for participation in the FOSDEM 2017 devroom on Free/Open Source Software (FOSS) Electronic Design Automation (EDA) tools, to be held on Sunday 5 February 2017 in Brussels, Belgium. We are looking for contributions under the form of talks and tutorials covering the following main topics:

• Printed Circuit Board (PCB) design tools (e.g. KiCad and gEDA)
• Analogue and digital simulators (e.g. ngspice, Qucs, Gnucap, Xyce, GHDL, Icarus and Verilator)
• Any other EDA tools such as high-level tools for digital hardware design (e.g. Migen) and HDL synthesis tools (e.g.Yosys)
• Inter-project opportunities for collaboration

We hope to provide an opportunity for attendees to bring themselves up to date on the latest FOSS EDA developments, share knowledge and identify opportunities to collaborate on development tasks. Have a look at last year's event for a taste of what the EDA devroom is about.

The submission process
Please submit your proposals at 

https://penta.fosdem.org/submission/FOSDEM17 

before 1 December 2016.

If you already have a Pentabarf account (for example as a result of having submitted a proposal in the past), make sure you use it to log in and submit your proposal. Do not create a new account if you already have one. Please provide a bit of information about yourself under Person -> Description -> Abstract. When you submit your proposal (creating an "Event" in Pentabarf), make sure you choose the "Electronic Design Automation (EDA) devroom" in the track drop-down menu. Otherwise your proposal might go unnoticed. Fill in at least a title and abstract for the proposed talk and a suggested duration. Bear in mind that a lot of the value in these meetings comes from the discussions, so please be reasonable regarding the duration of the talk.

Important dates

• 1 December 2016: deadline for submission of proposals
• 11 December 2016: announcement of final schedule
• 5 February 2017: devroom day

Recordings
The FOSDEM organisers hope to be able to live-stream and record all the talks. The recordings will be published under the same licence as all FOSDEM content (CC-BY). Only presentations will be recorded, not informal discussions and whatever happens during the lunch break. By agreeing to present at FOSDEM, you automatically give permission to be recorded. The organisers will agree to make exceptions but only for exceptional and well-reasoned cases.
Mailing list

Feel free to subscribe to the mailing list of the EDA devroom to submit ideas, ask questions and generally discuss about the event.

Spread the word!
This is the third EDA devroom at FOSDEM. The first two were very well received. Let's make sure as many projects and developers as possible are present. Thanks!