Special Issue on Compact Modeling for Circuit Design
Benjamin Iñiguez, Wladek Grabinski, Slobodan Mijalković, Kejun Xia, Andries J. Scholten, Yogesh Singh Chauhan, Ananda S. Roy, Sadayuki Yoshitomi, Kaikai Xu
in IEEE Transactions on Electron Devices, vol. 66, no. 1, Jan. 2019.
doi: 10.1109/TED.2018.2884284
This Special Issue is dedicated to recent research in the field of compact modeling for circuit design. The topics included all device structures, provided it was demonstrated that the presented compact modeling solutions were implementable in circuit design tools. The last Special Issue addressing compact modeling of all types of semiconductor devices was published in 2006. Since then, new device structures, and with different materials, have emerged, and significant and successful research in compact advance device modeling has been done, as well in the application of compact models to circuit design. Therefore, a new Special Issue was needed that could include high-quality papers in these topics.
A total of 60 regular papers were submitted to this Special Issue, of which 21 were accepted. Besides, the Special Issue includes four invited papers. All papers, including the invited ones, were subjected to thorough peer review. A high number of reviewers have participated in this process. This has resulted in a Special Issue containing very high-quality papers.
The published papers target compact modeling aspects for a wide number of devices: several MOSFET structures, tunnel FETs, HEMTs, nanowire FETs, TMD FETs, TFTs, OLEDs, solar cells, photodiodes, and so on.Besides, different operation regimes and analyses are addressed: dc, RF, HV, ballistic regime, variability, reliability, aging, and so on.
The four invited papers also target different topics. The paper by C. C. McAndrew is focused on the successes and challenges of MOS compact models. S. Dongaonkar et al. address the opportunities and challenges of circuit design methodologies ranging from process corners to statistical circuit design. P. Zampardi et al. discuss the industrial view of III–V device compact modeling for circuit design. Finally, Madec et al. target a quite different and challenging environment for the modeling of biosensors, biosystems, and lab-on-chips.
I would like to thank the work done by the rest of the Editors of this Special Issue and also by all the reviewers who participated in this process. And of course, I want to thank all the authors for their interest in submitting papers to this Special Issue. Thanks to authors, reviewers, and editors, this high-quality Special Issue has been possible.
