Why #NASA #opensource the #Rover https://t.co/BtUmzR7hzr

Why #NASA #opensource the #Rover https://t.co/BtUmzR7hzr

— Wladek Grabinski (@wladek60) December 19, 2018

from Twitter https://twitter.com/wladek60

December 19, 2018 at 07:41AM
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ESSDERC/ESSCIRC 2019 Conference Kraków, POLAND - 1st Call for Papers

September 23-26, 2019 Kraków, POLAND ESSDERC/ESSCIRC annual Conference is the most important European forum for the presentation and discussion of recent advances in solid-state devices and circuits. CALL for PAPERS - click below! CALL FOR PAPERS ESSCIRC tracks: Analog Data Converters RF and mm-Wave Frequency Generation Wireless and Wireline Systems Sensors, Imager and Biomedical Digital, Security and Memory Power Management ESSDERC tracks: CMOS Devices and Technology Opto-, Power and Microwave Devices Physical Modeling of Materials and Devices Compact Modeling of Devices and Circuits Memory Devices and Technology Emerging non-CMOS Devices and Technologies Sensor Devices and Technology Post-conference publications All accepted ESSDERC and ESSCIRC papers will be included in the conference proceedings and posted on IEEE Xplore after the conference. Co-publication of qualified papers in SSC-L Upon acceptance, outstanding ESSCIRC papers will be invited to submit to a Special Issue of IEEE Solid-State Circuit Letters (SSC-L, 4 pages format) on the ESSCIRC, subject to additional editorial and quality reviews. Publication on IEEE Xplore of the SSC-L Special Issue is timed to be September 1, 2019 Special JSSC issue Authors of outstanding papers will be invited to submit their work to a Special Issue of IEEE Journal of Solid-State Circuits (JSSC, up to 10-12 pages format) on the ESSCIRC to appear in July 2020, with an opportunity to provide additional material, such as mathematical analysis, in-depth circuit description, more experimental results and benchmarking data. Special J-EDS issue Authors of selected outstanding ESSDERC papers will be invited to submit their work to the special issue of IEEE Journal of the Electron Devices Society. The authors will be asked to revise the conference version of the paper by adding at least 30% new material. All manuscripts will undergo additional editorial and quality review process. Technical Co-Sponsorship ESSDERC Financial Sponsor ESSCIRC Financial Sponsor ORGANIZERS DIAMOND SPONSOR RIGAKU CALL FOR PAPERS All submissions must be received by 8th April 2019 PAPER SUBMISSION Manuscript guidelines as well as instructions on how to submit electronically will be soon available on the Conference website. Papers must not exceed four A4 pages with all illustrations and references included. Papers submitted for review must clearly state:     - the purpose of the work     - how and to what extent it advances the state-of-the art     - specific results and their impact After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by 31th May 2019. At the same time, the complete program will be published on the Conference website. An oral presentation will be given at the Conference for each accepted paper. No-shows will result in the exclusion of the papers from any conference related publication. The submitted final PDF files should be IEEE Xplore compliant. For each paper independently, at least one co-author is required to register for the Conference (one registration-one paper policy). ESSDERC 49th European Solid-State Device Research Conference ESSCIRC 45th European Solid-State Circuits Conference September 23-26, 2019 Kraków, POLAND https://esscirc-essderc2019.org LOCAL SCIENTIFIC SECRETARIAT Krzysztof Kasinski (AGH UST, PL) krzysztof.kasinski@agh.edu.pl Robert Szczygiel (AGH UST, PL) robert.szczygiel@agh.edu.pl ESSDERC/ESSCIRC 2019 ORGANIZING SECRETARIAT Foundation for AGH University of Science and Technology www.fundacja.agh.edu.pl e-mail: kf@agh.edu.pl Anna Inglot – Conference Manager phone: +48 504 004 517 Regarding the GDPR policy we need to inform you about the registration and mailing receiving procedure during the ESSDERC/ESSCIRC Conference 2019. Data protection Act. We are confident you will appreciate our effort to share the principles which inspire our data management policy and allow Foundation for AGH UST in Cracow: AUTHORIZATION OF DATA MANAGEMENT FOR COMMUNICATION PURPOSES to include you in mailing lists finalized to communicate future events, in the same field of the event you are registering for. I read and accept If you do not accept the policy please unsubscribe. Select the option below to stop receiving all emails from ESSDERC/ESSCIRC 2019 Organizing Committee Click here to unsubscribe from our mailing list

#Bipolar #Transistor Water #Model - Blender Animation https://t.co/R04thFHvYJ https://t.co/2YAXRXnbXx

#Bipolar #Transistor Water #Model - Blender Animation https://t.co/R04thFHvYJ pic.twitter.com/2YAXRXnbXx

— Wladek Grabinski (@wladek60) December 16, 2018

from Twitter https://twitter.com/wladek60

December 16, 2018 at 11:26PM
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#FOSDEM 2019 - CAD and Open Hardware devroom with #GnuCap and #ngspice presentations https://t.co/SKNe2toLrP #opensource https://t.co/3jAKTwYk2S

#FOSDEM 2019 - CAD and Open Hardware devroom with #GnuCap and #ngspice presentations https://t.co/SKNe2toLrP #opensource pic.twitter.com/3jAKTwYk2S

— Wladek Grabinski (@wladek60) December 14, 2018

from Twitter https://twitter.com/wladek60

December 14, 2018 at 03:36PM
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IEEE Cledo Brunetti Award 2018 presented to Prof.Dr. Siegfried Selberherr

One of the founders of modern Technology Computer Aided Design (TCAD), Siegfried Selberherr has provided modeling and software development tools invaluable to the continued miniaturization of semiconductor devices. TCAD involves the use of computer simulation to develop and optimize semiconductor processing technologies. Selberherr developed MINIMOS for two-dimensional predictive simulation of the electrical characteristics of miniaturized devices to understand and control the short-channel effects and doping profiles encountered as device sizes shrink. MINIMOS was later enhanced for three-dimensional simulation to address energy transport and interface physics. He also created the ZOMBIE and PROMIS simulators, which incorporated mesh generation and programming interfaces. Selberherr then developed the Vienna Integrated System for TCAD Applications (VISTA) to combine both process and device simulation tools in a common framework. An IEEE Fellow, Selberherr is a professor with the Institute for Microelectronics at the Technische Universität Wien, Vienna, Austria.