Handbook of Semiconductor Devices

Massimo Rudan, Rossella Brunetti, Susanna Reggiani (Eds.)

Springer Handbook of Semiconductor Devices

Series: Springer Handbooks

1st ed., 2022, ca. 1700 p., 1300 illus.

Order online at link.springer.com or customerservice@springernature.com

• Covers physical backgrounds, fabrication, application and modeling
• Describes in detail both conventional and innovative devices
• An indispensable resource for practitioners, professionals and researchers

This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications.

Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers.

Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances.

Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in. specific subject can easily identify personal reading path through the vast contents of the handbook.

Technological aspects

CMOS Manufacturing processes. Semiconductor memory technologies. BCD process technologies. Measuring techniques for the semiconductor's parameters. Interconnect Processing: Integration, Dielectrics, Metals. Wet Chemical Processes for BEOL Technology. From FinFET to nanosheets and beyond. Advanced Lithography. Advanced technologies for future materials and devices

Basic devices and applications

MOS Capacitors, MOS Transistors and Charge-Transfer Devices. Electrostatic doping and devices. Planar MOSFETs and their application to IC design. Silicon power devices. Silicon Carbide Power Devices. GaN- based lateral and vertical devices. Bipolar transistors and silicon diodes. Memory Challenges. Silicon sensors. Solar Cells. X-ray detectors. Photodetectors based on Emerging Materials. Terahertz Electronic Devices. Semiconductor Lasers

New-generation devices and architectures

Heterojunction tunnel field-effect transistors. Carbon based field-effect transistors. Negative capacitors and applications. Flexible Electronics and Biomedical Sensors. Bio-Degradable Electronics. Resistive Switch- ing Memories. Phase-Change Memories. Spin-Based Devices for Digital Applications. Memristive/CMOS devices for neuromorphic applications. Nanoelectronic Systems for quantum computing

Modeling

Compact/SPICE Modeling. Process simulation. A digital twin for MEMS and NEMS. Macroscopic Transport Models for Classical Device Simulation. Grid generation and Algebraic solvers. Spherical Harmonics Expansion and Multi-Scale Modeling. Charge Transport Models for Amorphous Chalcogenides. Application of the k.p method to device simulation. Ab initio methods for electronic transport in semiconductors and nanostructures. Quantum Transport in the Phase Space, the Wigner Equation. The Non-Equilibrium Green Function (NEGF) Method. Tight-Binding Models, their Applications to Device Modeling and Deployment to. Global Community

Analog IC Designer's Handbook

Top-Down method at work in analog IC design

by Jean-Francois Debroux

 

Abstract: Analog IC design is one of the particular design activities where designers get feedback on their choices only months after they finish their design and where the cost of even the smallest design change is huge.

This has historically brought the need for new tools such as SPICE, the ancestor of almost all the electric simulators, so as to give feedback on the design choices before actually getting the prototypes. This should also have deeply impacted the design methods, and it has, but the availability of simulators has finally allowed the old “try and fix” method not only to survive but also to stay very popular.

If tools such as electric simulators have gained popularity in most electronic design fields, even out of the IC design world, methods such as the TOP-DOWN approach are not as popular as they should be, especially in the analog design community, even in the analog IC design microcosm. This is probably because this method is felt as difficult to use practically even though most designers agree that it is the right approach.

The goal of this book is to show that the TOP-DOWN approach for analog design is not only valid but that it is one of the most powerful available methods to create good analog design without sacrificing the time to market. This method creates faster and better designs but requires a good understanding of the method itself, of course, but also of the underlying techniques and of the basic design elements.

After a general introduction of the TOP-DOWN method goals and principles in the first part, the second part presents and details analog IC design elements from components to basic building blocks with a strong emphasis on practical aspects. Various additional design techniques are then detailed in the third part. The reader is then ready for the main course, a series of design examples based on the TOP-DOWN method that are grouped in the fourth part. These examples are processed the way they are in real life, from specification to implementation, from general considerations down to implementation details. Analysis of existing circuits is useful for learning but real life design is synthesis, not analysis.

Finally, the fifth part introduces or reminds useful basic concepts and presents the notation in use through the book.

The methods and techniques described in this book have been used by the author through 25 years of analog and mixed signal ICs design experience in various application fields including RF and sensor signal conditioning for various markets such as industrial, automotive and aerospace. The author feels that the method he presents in this book can help many analog electronic designers in their day to day work and hopes it will bring both a deeper understanding of design and a broader view over design activities. [read more...]

Contact / Feedback: jean-francois.debroux@orange.fr

Experience: See  Jean-Francois Debroux profile on LinkedIn