Showing posts with label DARPA. Show all posts
Showing posts with label DARPA. Show all posts

Nov 3, 2020

ASCENT project

Applications and Systems-driven Center for Energy-Efficient integrated Nano Technologies

The Mission of the ASCENT Center is to transcend the current limitations of high-performance transistors confined to a single planar layer of integrated circuit by pioneering vertical monolithic integration of multiple interleaved layers of logic and memory, by demonstrating beyond-CMOS device concepts that combine processing and memory functions, heterogeneously integrating functionally diverse nano-components into integrated microsystems and by demonstrating in-memory compute kernels to accelerate future data-intensive at-scale cognitive workloads.

Researchers at ASCENT pursue four areas of technology including three-dimensional integration of device technologies beyond a single planar layer (vertical CMOS); spin-based device concepts that combine processing and memory functions (beyond CMOS); heterogeneous integration of functionally diverse nano-components into integrated microsystems (heterogeneous integration fabric); and hardware accelerators for data intensive cognitive workloads (merged logic-memory fabric).

ASCENT is one of six research centers funded by the SRC’s Joint University Microelectronics Program (JUMP), which represents a consortium of industrial participants and the Defense Advanced Research Projects Agency (DARPA). Information about the SRC can be found at https://www.src.org/.

Src Jump Logo

ASCENT is a collaboration of the following Universities:

Logo Cornell

Logo Georgia Tech
Logo ND

Logo Purdue

Logo Stanford

Logo Colorado
Logo Minnesota

Logo Berkeley

Logo UC San Diego

Logo UC Santa Barbara

Logo UCLA Logo UT Dallas

Logo Wayne Logo Illinois Institute