Article reached 2,000 reads: Open-source circuit simulation tools for RF compact semiconductor device modelling
Apr 12, 2018
Apr 10, 2018
Detailed characterisation of #Si Gate-All-Around #Nanowire MOSFETs at #cryogenic temperatures https://t.co/Zk7A4wLWM2 #paper https://t.co/n08yBDhilP https://t.co/7WRK6MnPkB
Detailed characterisation of #Si Gate-All-Around #Nanowire MOSFETs at #cryogenic temperatures https://t.co/Zk7A4wLWM2 #paper pic.twitter.com/n08yBDhilP https://t.co/7WRK6MnPkB
— Wladek Grabinski (@wladek60) April 10, 2018
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April 10, 2018 at 05:06PM
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Apr 9, 2018
Analysis and modeling of #wafer-level process #variability in #28nm #FDSOI using split C-V measurements https://t.co/M8lmHyZUgN #paper https://t.co/EGJ0xYgMml https://t.co/xHtRIxYSpG
Analysis and modeling of #wafer-level process #variability in #28nm #FDSOI using split C-V measurements https://t.co/M8lmHyZUgN #paper pic.twitter.com/EGJ0xYgMml https://t.co/xHtRIxYSpG
— Wladek Grabinski (@wladek60) April 9, 2018
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April 09, 2018 at 05:40PM
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Low voltage operation of #GaN vertical #nanowire #MOSFET https://t.co/jAwjUJ6I7j #paper https://t.co/3zRydkWQWy
Low voltage operation of #GaN vertical #nanowire #MOSFET https://t.co/jAwjUJ6I7j #paper pic.twitter.com/3zRydkWQWy
— Wladek Grabinski (@wladek60) April 9, 2018
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April 09, 2018 at 05:36PM
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Apr 3, 2018
[mos-ak] [2nd Announcement and Call for Papers] 3rd Sino MOS-AK Workshop Peking, June 14-16 2018
Arbeitskreis Modellierung von Systemen und Parameterextraktion
Modeling of Systems and Parameter Extraction Working Group
3rd Sino MOS-AK Workshop
Peking, June 14-16 2018
Together with the Honorary Committee Chair, Yan Wang, Tsinghua University, local organization team and International MOS-AK Board of R&D Advisers as well as all the Extended MOS-AK TPC Committee, we have pleasure to invite to the 3rd Sino MOS-AK Compact/SPICE Modeling Workshop which will be organized at Tsinghua University between June 14-16, 2018.
Planned 3rd Sino MOS-AK Workshop aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring academic and industrial experts in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors.
Venue:
会议场所:清华大学FIT-楼,在紫光国际国际交流中心旁
Tsinghua University FIT building, close to Tsinghua Unisplendour International Center
Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:
- Compact Modeling (CM) of the electron devices
- Advances in semiconductor technologies and processing
- Verilog-A language for CM standardization
- New CM techniques and extraction software
- Open Source TCAD/EDA modeling and simulation
- CM of passive, active, sensors and actuators
- Emerging Devices, TFT, CMOS and SOI-based memory cells
- Microwave, RF device modeling, high voltage device modeling
- Nanoscale CMOS devices and circuits
- Technology R&D, DFY, DFT and reliability/ageing IC Designs
- Foundry/Fabless Interface Strategies
Speakers: Invited talks tentative listing (alphabetic order)
- Prof. Mansun Chan; Compact Models for Giga-Scale Memory System
- Dr. Axel Huelsmann; mHEMT based MMICs, Modules, and Systems for mmWave Applications
- Dr.-Ing. Franz Sischka; Successful and Verified RF Measurements for Device Modeling
- Dr. Lifeng Wu; A Full Design Flow Solution for OLED Flat Panel Display
- Dr. Pete Zampardi; Understanding Gaps in III-V HBT Modeling and Simulation
Important Dates:
Online Abstract Submission is open - Call for Papers - March 2018
- 2nd Announcement - April 2018
- Final Workshop Program - May 2018
- MOS-AK Workshop - June 14-16 2018
- Day 1: MOS-AK Tutorial Day
- Day 2: MOS-AK SPICE/Verilog-A Modeling Workshop
- Day 3: MOS-AK SPICE/Verilog-A Modeling Workshop
Manuscript submission deadline: 28th May 2018 (Monday)Notification of Acceptance: 4th June 2018 (Monday)Submission of final manuscript: 11th June 2018 (Monday)
Postworkshop IJHSES Publications:
Selected best MOS-AK technical presentation will be recommended for further publication in a special issue of the International Journal of High Speed Electronics and Systems
International MOS-AK Committee:
- Honorary Committee Chair
- Yan Wang, Tsinghua University
- Advisory Committee
- George Ponchak, T-MTT Editor
- Yuhua Cheng, PKU
- Organizing Committee General Co-Chairs:
- Min Zhang, XMOD Technologies
- Wladek Grabinski, MOS-AK (EU)
- Finance Chair:
- Li Zhang, Tsinghua University
- Publication Chair:
- Wladek Grabinski, MOS-AK (EU)
- Awards Committee Chair:
- Zhiping Yu, Stanford University
- Sponsorship Chair:
- Li Zhang, Tsinghua University
- Min Zhang, XMOD Technologies
- Exhibition Chair:
- Jin Chen, SIMIT
- Kai Lv, NUS
- Local Arrangements Chair:
- Wenfei Hu, Tsinghua University
- Publicity:
- Sen Yin, Tsinghua University
- Workshop Secretary:
- Li Zhang
- Office: +86 010 62771733;
- Mobile: +86 138 01302877
- Email: zhangli95@tsinghua.edu.cn
WG03043018
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(NEW DEADLINE: 10 APRIL) ESSDERC Call for Papers
Call for Papers
(NEW DEADLINE: 10 APRIL)
PAPER SUBMISSION: Manuscript guidelines as well as instructions on how to submit electronically ARE AVAILABLE HERE. Papers must not exceed four A4 pages with all illustrations and references included. All submissions must be received by (NEW DEADLINE): 10 APRIL
Papers submitted for review must clearly state:
- The purpose of the work
- How and to what extent it advances the state-of-the-art
- Specific results and their impact
Only work that has not been previously published or submitted elsewhere will be considered. Submission of a paper for review and subsequent acceptance is considered as a commitment that the work will not be publicly available prior to the conference [read more...]
Mar 28, 2018
FOSSA: Open-sourcing #opensource #license #management | ZDNet https://t.co/XzdifJOIJR https://t.co/uVoBDgJ6Q5
FOSSA: Open-sourcing #opensource #license #management | ZDNet https://t.co/XzdifJOIJR pic.twitter.com/uVoBDgJ6Q5
— Wladek Grabinski (@wladek60) March 28, 2018
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March 28, 2018 at 05:19PM
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