Aug 13, 2026
[paper] Model for Scaled Cryo FETs
Aug 12, 2026
EDKCON 2026 at SMIT on Nov. 12-13
- Emerging Devices and Technology
- Analog/Digital/ Mixed Mode Circuits and Systems
- Memory Devices and Technology
- Device Modeling and Simulations
- Nano-electronic Devices and Technology
- Advance Processing and Characterizations
- Device and System Reliability
- Optoelectronic Devices and Circuits, Displays and Imagers
- Sensor and MEMS
- Intelligent Electronic Device, Circuit, and System
- VLSI System Design and Security
- Computer-Aided Design for VLSI and Verification
Prof. Dr. K. Ramnarayan, Pro Chancellor, Sikkim Manipal University (SMU)Dr. Gopalakrishna Prabhu, Vice Chancellor, Sikkim Manipal University (SMU)
Prof. Dr. Muralidhar V. Pai, Pro Vice Chancellor, Sikkim Manipal University (SMU)Prof. Dr. Karma Sonam Sherpa, Registrar, Sikkim Manipal University (SMU)Prof. Dr. Savitha G. Kini, Director, Sikkim Manipal Institute of Technology (SMIT)
Dr. Kalpana Sharma, Director, Directorate of Research, SMUDr. Sangeeta Jha, Associate Director (Academics), SMITDr. Chandrashekhar Bhuiyan, Associate Director (Research), SMITDr. Pankaj Chettri, Associate Director (SA), SMIT
Dr. Bikash Sharma, Head of the Department & Associate Professor, Dept. of Electronics & Communication Engg., SMITDr. Arpan Deyasi, Associate Professor Department of ECE RCC Institute of Information Technology KolkataDr. Angsuman Sarkar, Professor & Head, ECE Dept., Kalyani Govt. Engg. College, Kalyani, West BengalDr. Manash Chanda, Principal, Meghnad Saha Inst. of Technology, Kolkata
Aug 7, 2026
[mos-ak] [Final Program] 10th China MOS-AK International Conference on Device Modeling
The upcoming MOS-AK event is organized as the 10th China MOS-AK International Conference on Device Modeling and will be held at SEU (Wuxi), China, on August 27-28, 2026. The meeting continues MOS-AK's long-running mission of enabling R&D exchange in advanced electronic and photonic device modeling. The invited participants will cover two groups. The first follows the traditional MOS-AK focus on serving enterprise manufacturers and upstream/downstream model users by discussing practical model-related problems. The second initiative is to train students and professionals in open‑source (FOSS) CAD/EDA tools for integrated circuit (IC) design support.
With aggressive CMOS scaling and diverse emerging device technologies, accurate analytical and compact models have become essential for RF-THz, power, optical, FDSOI/SiGe HBT, 3D heterogeneous integration including OpenPDKs. This workshop offers a focused forum to present and discuss advances in device characterization, compact modeling, simulation, and validation across Si, GaN, IIIV, power, nanoscale, and emerging devices, reinforcing MOS‑AK’s role as a bridge between process technology manufacturing towards advanced circuit and system level designs.
Companies are welcome to showcase their latest tools, equipment, and modeling-related technologies, supporting practical exchange across the compact-modeling industry supply chain.
- Latest Workshop Program Published: August 2026
- China MOS-AK International Conference on Device Modeling: August 27-28, 2026
Featured MOS-AK Experts Guests
Wei HongSoutheast University, China | Yue HaoXidian University, China | Hanming WuZhejiang University, China |
MOS-AK Sponsors and Supporting Organizations
We gratefully acknowledge the following sponsors and supporting organizations:
Sponsors
Technical Co-Sponsors
Supporting Organization
Workshop Registration
Registration Fees | WeChat Registration Entry | |
Registration deadline
| Registration QR code: scan with WeChat | Mini Program code: scan with WeChat |
MOS-AK/Wuxi Organization Committee
Advisory CommitteeFujiang Lin (USTC) | Technical Program CommitteeYuehang Xu (UESTC) | General ChairsWeifeng Sun (SEU) |
International R&D AdviserMin Zhang (XMOD) | Finance ChairChao Zhu (SEU) | Workshop SecretarySonny Lou (APSTA) |
Aug 5, 2026
Fwd: New on chipIgnite: 37 Commercial Analog & Mixed-Signal IP Blocks
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Aug 3, 2026
[C4P] EDTM 2027 Fukuoka, Japan
General InformationImportant DatesConference OverviewThe 11th EDTM conference is a four-day meeting fully sponsored by the IEEE Electron Devices Society (EDS). It serves as a forum for the electron devices community to collaborate on devices, materials, tools, and innovative technologies across the semiconductor ecosystem. Technical Areas
Oral and Poster SessionsEDTM 2027 will feature parallel oral and poster technical sessions. Best Paper, Best Student Paper, and Best Poster Awards will be selected. PublicationsAccepted and presented papers will be published in the EDTM 2027 Proceedings (IEEE Xplore). Selected high-impact papers may be invited to submit extended versions to J-EDS. Short Courses & TutorialsHeld on March 8, 2027. Tutorials cover fundamentals to state of‑the‑art; short courses focus on advanced topics aligned with the conference theme. ExhibitionVendors will showcase new products and technologies, enabling attendees to learn about tools and techniques supporting their work. Secretariat
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EDTM 2027 CommitteesGeneral Chair
TPC Chair
Steering Committee
Executive Committee
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