Feb 21, 2023

[Book] More-than-Moore Devices and Integration for Semiconductors

More-than-Moore Devices and Integration
for Semiconductors
Editors: Francesca Iacopi and Francis Balestra
Publisher: Springer Cham
DOI: 10.1007/978-3-031-21610-7

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems.
  • Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems;
  • Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources;
  • Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
Table of contents (7 chapters)
  • Front Matter Pages i-xiv
  • Energy Harvesters and Power Management Pages 1-45
    Michail E. Kiziroglou, Eric M. Yeatman
  • SiC and GaN Power Devices Pages 47-104
    Konstantinos Zekentes, Victor Veliadis, Sei-Hyung Ryu, Konstantin Vasilevskiy, Spyridon Pavlidis, Arash Salemi et al.
  • Flexible and Printed Electronics Pages 105-125
    Benjamin IƱiguez
  • Terahertz Metasurfaces, Metawaveguides, and Applications Pages 127-156
    Wendy S. L. Lee, Shaghik Atakaramians, Withawat Withayachumnankul
  • Mechanical Robustness of Patterned Structures and Failure Mechanisms
    Ehrenfried Zschech, Maria Reyes Elizalde Pages 157-189
  • Neuromorphic Computing for Compact LiDAR Systems Pages 191-240
    Dennis Delic, Saeed Afshar
  • Integrated Sensing Devices for Brain-Computer Interfaces Pages 241-258
    Tien-Thong Nguyen Do, Ngoc My Hanh Duong, Chin-Teng Lin
Acknowledgements: We would like to thank the following colleagues for their help in peer-reviewing this book’s material: Dr. Yang Yang and Dr. Diep Nguyen (University of Technology Sydney, Australia); Prof. Xuan-Tu Tran (Vietnam National University Hanoi), Prof. Gustavo Ardila and Prof. Pascal Xavier (University Grenoble Alpes, France); and Prof. Edwige Bano (Grenoble INP, France). FI would also like to acknowledge support from the Australian Research Council Centre of Excellence in Transformative MetaOptical Systems (TMOS, CE200100010).

Francesca Iacopi, Ultimo, NSW, Australia 
Francis Balestra, Grenoble, France 


2022 SSCS Outstanding Chapter Award


Our SSCS Switzerland Chapter, with Prof. Taekwang Jang as its Chair, was recognized as the outstanding chapter of the year 2022. Dear my fellow Swiss colleagues, the chapter offering the best lectures, seminars, and social events is right at your next door, and you can enjoy them by joining the IEEE SSCS members here.

Feb 20, 2023

[C4P] T-ED Special Issue



Call for Papers - Special Issue on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications."

The Special Issue of the IEEE Transactions on Electron Devices (T-ED) will report the most advanced and recent results in the field of wide and ultrawide bandgap semiconductor materials and devices, including papers focused on material fabrication, device processing, reliability investigation, device modeling, thermal aspects, and system-related results.

Submission deadline: 31 August 2023
Publication date: February 2024

Submit papers today: https://bit.ly/3fESTgZ

Guest Editors: 
Prof. Matteo Meneghini, University of Padova, Italy 
Prof. Patrick Fay, University of Notre Dame, USA 
Prof. Digbijoy Nath, IISC Bangalore 
Prof. Geok Ing Ng, Nanyang Technical University, Singapore 
Prof. Junxia Shi, University of Illinois, Chicago 
Prof. Shyh-Chiang Shen, Georgia Tech. 



Feb 13, 2023

FOSS Verilog-A Models Repository


Dietmar Warning, ngspice team, has announced his new github project VA-Models repository 
<https://github.com/dwarning/VA-Models>

These Verilog-A model code repository is a compilation of the most important models in the state of public FOSS availability. The intention is to have one place for model access and a platform for discussion and integration into simulators.

At the moment, the models will be compiled by script with openVAF and checked with ngspice version 39. Code changes are introduced only for convergence support or to fulfill Verilog-A language standard requirements. Model equations are untouched. But I am open to integrate code modifications for other compiler/simulator companions as far they are inline with actual LRM 2.4. Simple test case are provided, mainly to show general functionality of the compiled models. 

Don't hesitate to contact Dietmar Warning, ngspice team, if there is something wrong, especially in kind of legal aspects. All the contributions are welcome.

Feb 12, 2023

How many semiconductor talents are there?



from Twitter https://twitter.com/wladek60

February 12, 2023 at 07:36PM
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