Showing posts with label material fabrication. Show all posts
Showing posts with label material fabrication. Show all posts

Feb 20, 2023

[C4P] T-ED Special Issue



Call for Papers - Special Issue on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications."

The Special Issue of the IEEE Transactions on Electron Devices (T-ED) will report the most advanced and recent results in the field of wide and ultrawide bandgap semiconductor materials and devices, including papers focused on material fabrication, device processing, reliability investigation, device modeling, thermal aspects, and system-related results.

Submission deadline: 31 August 2023
Publication date: February 2024

Submit papers today: https://bit.ly/3fESTgZ

Guest Editors: 
Prof. Matteo Meneghini, University of Padova, Italy 
Prof. Patrick Fay, University of Notre Dame, USA 
Prof. Digbijoy Nath, IISC Bangalore 
Prof. Geok Ing Ng, Nanyang Technical University, Singapore 
Prof. Junxia Shi, University of Illinois, Chicago 
Prof. Shyh-Chiang Shen, Georgia Tech.