Jan 31, 2022

Hdev: Open-Source SiGe and III-V HBT TCAD Simulator

Hdev: https://gitlab.com/metroid120/hdev_simulator

Hdev has been started as a TCAD simulator by Martin Claus at TU Dresden (initially named COOS). Hdev (heterostructure device) is a TCAD simulator focused on 1D and 2D simulations of HBTs. The purpose of Hdev is to allow easy technology analysis and optimization of heterostructure semiconductor devices. Later it has been adopted by Sven Mothes who also used it for CNTFET simulations. Then, it has been applied to organic semiconductors by Markus Müller in his bachelor and diploma theses, where the initial 2D drift-diffusion solver has been implemented. For his dissertation on InP HBTs, Markus Müller later created a fork of COOS aimed at HBT simulation. The fork has been renamed Hdev (heterostructure device) for highlighting the new focus of the software. Hdev is now applied to SiGe and III-V HBTs by Markus Müller in the scope of his PhD thesis.

Hdev Features:
  • true 1D simulations => time efficient
  • box discretization => easy to use
  • semiconductor alloys => SiGe and III-V HBTs
  • DC, AC and transient analysis
  • augmented DD equation
  • degenerate semiconductor statistics
  • read and write hdf5 files
  • GPL license
Figure 1: (left) vertical profile of the node three HBT and (right) transfer characteristics of the HBT from 1D energy-transport simulations at VBC = −0.7 V at 300 K.

The world needs more skilled semiconductor workers



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January 31, 2022 at 10:10AM
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Jan 28, 2022

[paper] Embedded CMOS SOI UV Sensors

Michael Yampolsky, Evgeny Pikhay and Yakov Roizin
Embedded UV Sensors in CMOS SOI Technology
Sensors 2022, 22(3), 712;
DOI: 10.3390/s22030712
   
Tower Semiconductor, Migdal Haemek 2310502, Israel

Abstract: We report on ultraviolet (UV) sensors employing high voltage PIN lateral photodiode strings integrated into the production RF SOI (silicon on isolator) CMOS platform. The sensors were optimized for applications that require measurements of short wavelength ultraviolet (UVC) radiation under strong visible and near-infrared lights, such as UV used for sterilization purposes, e.g., COVID-19 disinfection. Responsivity above 0.1 A/W in the UVC range was achieved, and improved blindness to visible and infrared (IR) light demonstrated by implementing back-end dielectric layers transparent to the UV, in combination with differential sensing circuits with polysilicon UV filters. Degradation of the developed sensors under short wavelength UV was investigated and design and operation regimes allowing decreased degradation were discussed. Compared with other embedded solutions, the current design is implemented in a mass-production CMOS SOI technology, without additional masks, and has high sensitivity in UVC.
Fig: (a) A string of PIN photodiodes connected in series by silicide N+, P+, and iSi regions. The diodes are connected by butted silicide. The schematic cross section shows only three connected in series PIN diodes. (b) Cross section of a lateral PIN diode with contacts.



Nature India has highlighted Prof. Santanu Mahapatra work on energy storage in 2d #semi



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January 28, 2022 at 01:50PM
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Sam Zeloof talks about his 1200 transistor chip



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January 28, 2022 at 01:54PM
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