13. ITG/GMM-Fachtagung Analog 2013

13. ITG/GMM-Fachtagung Analog 2013
4. - 6. März in Aachen
Entwicklung von Analogschaltungen mit CAE-Methoden

Die Registrierung ist eröffnet!

Call For Papers:

Programm und Anmeldeformular:

Why- and how- to integrate Verilog-A compact models in SPICE simulators

Article first published online: 20 JUL 2012
by Maria-Anna Chalkiadaki1, Cédric Valla2, Frédéric Poullet2 and Matthias Bucher1 (1. Department of Electronic and Computer Engineering, Technical University of Crete, 73100 Chania, Greece and 2. Dolphin Integration, 38242 Meylan, France)

SUMMARY: This article presents a fast and accurate way to integrate and validate Verilog-A compact models in SPICE-like simulators. Modifications in the models’ Verilog-A source code may be required prior to their conversion into low-level C language by a code generator. The most common of these modifications is discussed. The generated C code is then directly compiled in the target simulator resulting in an equivalent SPICE model. The comparison between Verilog-A and SPICE models in the same simulation environment, for simple and complex circuits, validates the procedure. Performance tests for demanding designs are carried out for both models. Results highlight the higher simulation speed and lower memory consumption of SPICE models.

Synopsys Accelerates Adoption of FinFET Technology with Delivery of Production-Proven Design Tools and IP

From YahooFinance: (see their page for the original post)



Synopsys, Inc. (SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced immediate availability of its comprehensive solution for FinFET-based semiconductor designs. The solution includes a range of DesignWare^®Embedded Memory and Logic Library IP; silicon-proven design tools from the Galaxy^™ Implementation Platform; and foundry-endorsed extraction, simulation and modeling tools. It also includes TCAD and mask synthesis products used by foundries for FinFET process development. The three-dimensional structure of FinFET devices represents a significant change in transistor manufacturing that impacts design implementation tools, manufacturing tools and design IP. Developed over a period of five years through engineering collaboration with leading foundries, research institutes and early adopters, Synopsys' FinFET solution delivers production-proven technologies to manage the change from planar to 3-D transistors. The full-line solution provides a strong foundation of EDA tools and IP needed to accelerate deployment of FinFET technology which offers improved power, performance and area for semiconductor designs.
"Synopsys continues to make significant investments to develop a complete solution for adoption of new process geometries and devices, including FinFETs," said Antun Domic, senior vice president and general manager of Synopsys' Implementation Group. "Synopsys' extensive collaboration with all the partners within the FinFET ecosystem, including foundries, early adopters and research institutions, allows us to deliver best-in-class technologies and to enable the market to realize the full potential of this new transistor design."
"With our new 14nm-XM offering, we have accelerated our leading-edge roadmap to deliver a FinFET technology optimized for the expanding mobile market," said Gregg Bartlett, senior vice president, chief technology officer at GLOBALFOUNDRIES. "Collaboration with partners has been a key element of our ability to deliver this innovative FinFET solution. We have collaborated early with Synopsys in multiple areas, including modeling of the FinFET devices in HSPICE. We continue our collaboration to accelerate adoption of FinFET technology for our mutual customers."
"Our FinFET collaboration with Synopsys is key to maintaining our semiconductor leadership position," said Dr. Kyu-Myung Choi, senior vice president of System LSI Infrastructure Design Center, Samsung Electronics Co., Ltd. "Our foundry and semiconductor design expertise, combined with Synopsys' broad EDA tool and IP development experience enabled us to address FinFET-related challenges effectively. We continue to engage in strong collaboration to maximize the benefits of FinFET technology."
"Very early on, we successfully demonstrated the power and performance benefits of using FinFET 3-D transistors," said Dr. Chenming Hu, distinguished professor of microelectronics at University of California, Berkeley, widely regarded as the pioneer of FinFET technology. "To make these demonstrations possible, my team worked closely with Synopsys R&D on a number of areas including device simulation. We continue to collaborate with Synopsys to deliver more innovations for FinFET deployment."
FinFET-ready IP  Working closely with leading foundries for more than five years enabled Synopsys to gain design expertise and a deep understanding of IP architectures. This close collaboration has resulted in the successful deployment of Synopsys' DesignWare Embedded Memory and Logic Library IP solutions on FinFET to key customers. A broader range of IP is planned for development in 2013. The DesignWare Embedded Memory and Logic Library IP is architected to achieve the full benefits of the FinFET technology, delivering superior results in the areas of performance, leakage and dynamic power, and low voltage operation.
FinFET-ready Design Tools   The shift from planar to FinFET-based 3-D transistors is a significant change that requires close R&D collaboration among tool developers, foundries and early adopters to deliver a strong EDA foundation.  Developed through a multi-year collaboration with FinFET ecosystem partners, Synopsys' solution accelerates time to market of FinFET-based designs.  The comprehensive solution includes IC Compiler for physical design, IC Validator for physical verification, StarRC^™ for parasitic extraction, SiliconSmart for characterization, CustomSim^™ and FineSim for FastSPICE simulation and HSPICE^® for device modeling and circuit simulation.
FinFET-ready Manufacturing Tools    The small geometries and 3-D nature of FinFETs require new approaches to optimize device performance and leakage, and to address the effect of process variations. Target device performance and leakage is achieved through the optimization of the fin geometry, stress engineering and other factors. Process variations stem from random dopant fluctuations, line edge roughness, layout-induced stress and other sources, which together impact device and circuit performance. Synopsys has been collaborating with foundries on the Sentaurus^™ TCAD and Proteus^™ mask synthesis products to address these issues. The Sentaurus product line enables foundries to optimize FinFET processing and design devices that meet the performance and leakage targets while mitigating the impact of process variation. The Proteus product line provides foundries with a comprehensive solution for performing full-chip proximity corrections.

[mos-ak] C4P: Spring MOS-AK/GSA Workshop in Munich; April 11-12, 2013

Together with the workshop host, Prof. Dr. Doris Schmitt-Landsiedel, Lehrstuhl fur Technische Elektronik, TUM and Extended MOS-AK/GSA TPC Committee, we have pleasure to invite to the spring MOS-AK/GSA Workshop in Munich <http://www.mos-ak.org/munich_2013/>

Venue:

Lehrstuhl fur Technische Elektronik

Room: 5325, 5th floor <http://www.lte.ei.tum.de/index.html>

Technische Universitat Munchen 

Arcisstr. 21 D-80333 Munchen

Important Dates:

• Call for Papers - Jan. 2013
  
• 2nd Announement - Feb. 2013
  
• Final Workshop Program - March, 2013
  
• MOS-AK/GSA Workshop - April 11-12, 2013
  

R&D topics to be covered include the following:

• Advances in semiconductor technologies and processing
  
• Compact Modeling (CM) of the electron devices
  
• Verilog-A language for CM standardization
  
• New CM techniques and extraction software
  
• CM of passive, active, sensors and actuators
  
• Emerging Devices, CMOS and SOI-based memory cells
  
• Microwave, RF device modeling, high voltage device modeling
  
• Nanoscale CMOS devices and circuits
  
• Technology R&D, DFY, DFT and IC Designs
  
• Foundry/Fabless Interface Strategies

Extended MOS-AK/GSA Committee

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SPICE Models No Longer Only A Foundry’s Worry

A nice post at chipdesign:

By Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, Inc.

 

SPICE Models Play a Critical Role in Both Modeling and Design Communities

Circuit designers work with foundry libraries to evaluate a foundry process before they run real circuit designs. It, therefore, becomes necessary to understand the models and use them properly. Complexities of modern libraries have made it inefficient or almost impossible to understand them by browsing into the files.

A library can easily contain many different sections besides core models in a macro (sub-circuit) format, such as multiple corner model sections, statistical model sections, mismatch model components, models for layout dependent effects and reliability models. Without a good understanding of those details, simulations by combining those model sections may lead to inaccurate results.

Second, foundry models often are not built for specific applications. Design companies are investing in SPICE models by doing model validations, customizing models for specific needs or even building their own models. High-end systems-on-chip (SoCs) are now integrating more functionalities and may have different operation modes, evaluated by performance, power, area, lifetime, cost (yield) and time to market.

Design specifications are tougher, but the room to maneuver has shrunk. One set of generic models can’t meet the requirements for all different applications. Thus, it’s worthwhile for design companies to identify the real needs of their applications, then work with foundries or third parties or build their own capabilities to make model libraries more application specific and provide more value for their designs.

Third, the key motivation for a circuit designer to understand foundry model libraries is the impact of process variations on circuit performance and yield. Although process engineers have tried different ways to mitigate variation sources during manufacturing, some remain in a design that are fundamental and must be managed during different design stages, including global and local random variations or LDE.

Designers can only cross their fingers if they do not know the possible results before tapeout. Modeling engineers have figured out ways to model those systematic and random variation effects. The next step is to apply that information and analyze the impact to a design.

Strain engineering improves device performance, but leads to the strong layout dependence of device characteristics. Designers then need to consider the impact of LDE during pre-layout design, layout design, LVS extraction and post-layout verifications. Understanding the LDE based on the models would help designers better optimize area versus performance, and reduce differences between pre- and post-layout designs to shorten design time.

Increasing random variations, especially the local mismatch for paired transistors, affect the final chip yield and performance. Traditional PVT analysis and selective Monte Carlo analysis give limited information that can help achieve chip’s functionalities, but not the possible yield or performance distributions.

A reliable and practical design for yield (DFY) flow with fast and accurate statistical simulation engine is required. Moreover, before using DFY tools for yield analysis targeting yield and performance trade-off, designers need to know how corner models and statistical models are defined. Otherwise analysis results, based on improper use of the variation models, will offer the wrong direction for design optimizations. 

... read more at the source...