[mos-ak] MOS-AK/GSA Bordeaux workshop press release

MOS-AK/GSA Modeling Working Group Holds Summer Workshop in Bordeaux

Experts Share Insight on Compact Device Modeling with Emphasis on Simulation-Aware Models
http://www.gsaglobal.org/2012/10/mos-akgsa-modeling-working-group-holds-summer-workshop-in-bordeaux/

SAN JOSE, Calif. (October 1, 2012) – The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, has delivered their 10th compact modeling workshop, presented on Sept. 21, 2012 as an integral part of the ESSDERC/ESSCIRC Conference in Bordeaux (F). The event was organized receiving full sponsorship provided by the leading industrial partners including Agilent Technologies (USA), LFoundry (D), CSEM (CH), STMicroelectronics (F), and AMS (A). The French Branch of IEEE EDS, FP7 COMON Project, Eurotraining and MOSIS Services were among the workshop technical program promoters. More than 50 international academic researchers and modeling engineers attended three sessions to hear 16 technical compact modeling talks and poster presentations. 

The workshop's three sessions focused on the nanowire TFET and organic TFT technologies, advanced compact modeling for analog/RF IC design application, computer-aided design (CAD), EDA simulations highlighting recent developments of Verilog-A compact models and its standardization. The 10th MOS-AK/GSA ESSDERC/ESSCIRC workshop was opened by invited researchers highlighting active women contributions to compact modeling R&D. The speakers discussed: the EKV model for LC-VCO optimization (M. H. Fino, UNL); physics-based analytical model of nanowire TFETs (E. Gnani, Uni. Bologna); analytical models for disordered and polycrystalline organic TFTs (M. Raja, Uni. Liverpool); Hall effect sensors performance assessment using 3D physical simulations (M.-A. Paun, EPFL); and physical compact model of a CBRAM cell (M. Reyboz, CEA/LETI).  

Afterward invited international modeling experts presented: device modeling DC measurements challenges (F. Sischka, Agilent Technologies); surface-potential-based compact model of AlGaN/GaN HEMT power transistors (P. Martin, CEA/LETI); millimeter-wave CMOS device modeling and issues (K. Okada, TITech); measurement and modeling of CMOS devices in short millimeter wave (M. Fujishima, Hiroshima University);  thermal network extraction in ultra-thin-body SOI MOSFETs (Y. S. Chauhan, UC Berkeley); compact modeling of SiC JFET power devices (M. Bucher, TUC Chania); SMASH-ACMI for integration and validation of Verilog-A compact models in a SPICE simulator (G. Depeyrot, Dolphin Integration); parametric yield-oriented IC design based on cumulative distribution function and open-source EDA tools (D. Tomaszewski, ITE); analytical calculation of surface-potential in AlGaAs/GaAs and AlGaN/GaN HEMT devices (S. Khandelwal analytical 2D model for source/drain band-to-band tunneling in silicon double-gate TFETs (M. Graef, THM) gate-level modeling for CMOS circuit simulation with ultimate FinFETs (N. Chevillon, InESS). The session oral and poster presentations are available for download at http://mos-ak.org/bordeaux/

The MOS-AK/GSA Modeling Working Group coordinates several upcoming modeling events: a winter Q4/2012 MOS-AK/GSA meeting in San Francisco, CA, USA, followed by a spring Q2/2013 MOS-AK/GSA meeting in Munich, a special compact modeling session at the MIXDES Conference in Gdynia, Poland (https://www.mixdes.org); and an autumn Q3/2013 MOS-AK/GSA workshop in Bucharest, Romania.

About MOS-AK/GSA Modeling Working Group:

In January 2009, GSA merged its efforts with MOS-AK, a well-known industry compact modeling volunteer group primarily focused in Europe, to re-activate its Modeling Working Group. Its purpose, initiatives and deliverables coincide with MOS-AK's purpose, initiatives and deliverables. The Modeling Working Group plays a central role in developing a common language among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact model standardization and related tools for model development, validation/implementation and distribution.www.gsaglobal.org/working-groups/analog-mixed-signal 

About GSA:

The Global Semiconductor Alliance mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 30 countries across the globe.www.gsaglobal.org

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[mos-ak] C4P: 5th International MOS-AK/GSA Workshop in San Francisco, Dec. 12, 2012

Together with the Organizing Committee and Extended MOS-AK/GSA TPC Committee, we have pleasure to invite to the 5th International MOS-AK/GSA Workshop in San Francisco, Dec. 12, 2012 http://www.mos-ak.org/sanfrancisco_2012/ The event will be organized in timeframe of the IEDM and CMC meetings.

Venue:

swissnex San Francisco

730 Montgomery Street

San Francisco, CA 94111, USA

Important Dates:

• Call for Papers - Oct. 2012
  
• Submission deadline - Nov. 15, 2012
  
• Final Workshop Program - Nov. 30 2012
  
• MOS-AK/GSA Workshop - Dec. 12, 2012
  

R&D Topics to be covered include the following:

• Advances in semiconductor technologies and processing
  
• Compact Modeling (CM) of the electron devices
  
• Verilog-A language for CM standardization
  
• New CM techniques and extraction software
  
• CM of passive, active, sensors and actuators
  
• Emerging Devices, CMOS and SOI-based memory cells
  
• Microwave, RF device modeling, high voltage device modeling
  
• Nanoscale CMOS devices and circuits
  
• Technology R&D, DFY, DFT and IC Designs
  
• Foundry/Fabless Interface Strategies
  

Extended MOS-AK/GSA Committee

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[mos-ak] MOS-AK/GSA Bordeaux workshop on-line publications

The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, has delivered 10th subsequent compact modeling workshop which was organized on Sept. 21, 2012 as an integral part of the ESSDERC/ESSCIRC Conference in Bordeaux (F). The event was organized receiving full organization sponsorship provided by the leading industrial partners including Agilent Technologies (USA), LFoundry (D), CSEM (CH), STMicroelectronics (F), and AMS (A). The French Branch of IEEE EDS, FP7 COMON Project, Eurotraining and MOSIS Services were among the workshop technical program promoters. More than 50 international academic researchers and modeling engineers attended three sessions to hear 16 technical compact modeling talks and poster presentations.

The workshop's three sessions focused on the nanowire TFET and organic TFT technologies, advanced compact modeling for analog/RF IC design application, computer-aided design (CAD), EDA simulations highlighting recent developments of Verilog-A compact models and its standardization. The 10th MOS-AK/GSA ESSDERC/ESSCIRC workshop was opened by fifth invited female researchers highlighting active women contribution to compact modeling R&D. Afterward invited international modeling experts presented their recent modeling work. The session oral and poster presentations are available for download at http://mos-ak.org/bordeaux/

The MOS-AK/GSA Modeling Working Group coordinates several upcoming modeling events: 

• winter Q4/2012 MOS-AK/GSA meeting in San Francisco, CA (USA) <http://www.mos-ak.org/sanfrancisco_2012/>
  
• spring Q2/2013 MOS-AK/GSA meeting in Munich (D)
  
• special compact modeling session at the MIXDES Conference in Gdynia, (PL) <https://www.mixdes.org>  
  
• autumn Q3/2013 MOS-AK/GSA workshop in Bucharest, (RO)
  

Extended MOS-AK/GSA Committee

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Posted by Adele HARS on August 31, 2012, at Advanced Substrate News

Power & Performance: GSS Sees SOI Advantages for FinFETS

Are FinFETs better on SOI? In a series of papers, high-profile blogs and subsequent media coverage, Gold Standard Simulations (aka GSS) has indicated that, yes, FinFETs should indeed be better on SOI.
To those of us not deeply involved in the research world, much of this may seem to come out of nowhere.  But there’s a lot of history here, and in this blog we’ll take a look at what it’s all about, and connect a few dots.

The GSS IEDM ’11 Paper

GSS is a recent spin-off of Scotland’s University of Glasgow – but there’s nothing new to the research community about these folks.  The core GSS-U.Glasgow team has been presenting important papers on device modeling at IEDM (which is one of the most prestigious of our industry’s conferences) and elsewhere for many years.
At the risk of stating the obvious, accurate simulations are incredibly important. Technologists need to be able to predict what results they can expect from different possible transistor design options before selecting the most promising ones.  Then they also need to provide reliable models to designers who will use them before committing chips to silicon.  One of the biggest challenges is predicting variability, which as we all know is getting worse as transistors scale to ever-smaller dimensions.
At IEDM ’11 last December, GSS-U.Glasgow presented Statistical variability and reliability in nanoscale FinFETs.  This covered  “A comprehensive full-scale 3D simulation study of statistical variability and reliability in emerging, scaled FinFETs on SOI substrate with gate-lengths of 20nm, 14nm and 10nm and low channel doping…”.  Essentially they concluded that scaling FinFETs on SOI should be no problem – and in fact the statistical variability of a 10nm FinFET on SOI would be about the same as the industry’s currently seeing in 45nm bulk CMOS.
That paper was based on work that the GSS-U.Glasgow team had done on two major European projects: the EU ENIAC MODERN project, and the EU FP7 TRAMS project.  It’s perhaps worth looking a little more closely at what those projects are about – and who’s involved:

• A key objective of the MODERN (for Modeling and Design of Reliable, process variation-aware Nanoelectronic devices, circuits and systems) is to develop “effective methods for evaluating the impact of process variations on manufacturability, design reliability and circuit performance”.  Other partners in the project include ST, Leti, NXP, Infineon, Numonyx (now Micron) and Synopsys.
• The objective of the TRAMS (for ‘Tera-scale Reliable Adaptive Memory Systems’) project is “to investigate in depth potential new design alternatives and paradigms, which will be able to provide reliable memory systems out of highly unreliable nanodevices at a reasonable cost and design effort”. Other partners in the project include Intel, imec, and UPC/BarcelonaTech.

READ MORE AT THE SOURCE

CMRF Workshop (at BCTM)

CMRF Workshop (at BCTM)
Wednesday October 3, 2012, in Portland, Oregon, USA

Session Chair: Colin McAndrew

As with previous years the Workshop on Compact Modeling for RF/Microwave Applications (CMRF) is being held in conjunction with BCTM. The workshop has an interactive dynamic, and this year includes a Forum of experts who will assess the present major needs in modeling.

1:00–1:30 PM – Advanced SiGe HBT Modeling with HICUM Level 0 (v1.3) for RF and mmW Applications
D. Celi and N. Derrier

This presentation deals with advanced bipolar modeling using the latest revision of HICUM/L0 (1.3). Following an overview of test structures and measurement setup used for bipolar transistors, the new HICUM/L0 formulations are described. Subsequently a workflow for parameter extraction is detailed that is suitable for advanced SiGe heterojunction bipolar transistors for mmW applications. As a last point the possibilities and limitations of the model and the parameter extraction are discussed.

1:30–2:00 PM – Dynamic Ageing Modeling for Reliability Simulation
B. Ardouin

Semiconductor device behavior is not static but changes over time, and the amount of change depends on details of the voltages and currents a device experiences. This presentation will review recent development of a dynamic ageing model for HiCuM 2.3 and provides details of Verilog-A implementation and pragmatic modeling issues related to self-consistent integration of transistor degradation in accelerated time based on realistic transient circuit operation.

2:00–2:30 PM – End-to-End Modeling for Handset Power Amplifiers – It’s Not Just Two Transistors!
P. Zampardi, Y. Yang, K. Kwok, B. Li, A. Metzger, C. Cismaru, H. Shao, W. Sun, and M. Fredriksson

The short design cycle for handset power amplifiers relies on accurate models for ALL components used in the design, not just the “two HBTs” used for the power transistors. As the complexity of these amplifiers (usually used in front-end modules) has increased, so has the required accuracy for simulating the package, control circuitry, and the RF chain itself. This presentation will show some of the challenges and solutions developed to address the development of high-yield commercial power amplifiers and the design flow for their realization.

2:50–3:20 PM – Practical Modeling: When Less is More
A. DiVergilio

The primary goal of compact modeling is to allow designs to be carried out quickly and efficiently. Therefore, model accuracy is not the only metric of model effectiveness. No matter what the circuit, significant portions of the design cycle can benefit more from rapid iteration than from absolute accuracy. Overly-complicated models slow down simulation and, at worst, prevent convergence all-together, especially for large designs. This presentation discusses trade-offs that can be made between speed and accuracy, emphasizing the flexibility that can be achieved through high-level modeling languages, such as Verilog-A, when applied to device-level model development.

3:20–4:20 PM – Forum: “Grand Challenges in Modeling”
Queen Marie Ballroom

Models are by definition imperfect, but what are the biggest opportunities for improvement that will have the biggest bang-for-the-buck in design? This forum will attempt to answer that question, and formulate a prioritized list of items that will be published on the BCTM web site.

Participants:

• Bertrand Ardouin (XMOD technologies)
• Adam DiVergilio (Tektronix)
• Mikhail Shirokov (Triquint Semiconductor)
• Peter Zampardi (Skyworks Solutions)
• Colin McAndrew (Moderator; Freescale)