[C4P] ESSDERC / ESSCIRC September 23-26, 2019 Kraków, POLAND

September 23-26, 2019 Kraków, POLAND

ESSDERC/ESSCIRC annual Conference is the most important European forum for the presentation and discussion of recent advances in solid-state devices and circuits.

CALL for PAPERS - click below!

CALL FOR PAPERS

ESSCIRC tracks: Analog  Data Converters RF and mm-Wave Frequency Generation Wireless and Wireline Systems Sensors, Imager and Biomedical Digital, Security and Memory Power Management ESSDERC tracks: CMOS Devices and Technology Opto-, Power and Microwave Devices Physical Modeling of Materials and Devices Compact Modeling of Devices and Circuits Memory Devices and Technology Emerging non-CMOS Devices and Technologies Sensor Devices and Technology

Technical Co-Sponsorship ESSDERC Financial Sponsor ESSCIRC Financial Sponsor

ORGANIZERS

DIAMOND SPONSOR

RIGAKU

CALL FOR PAPERS All submissions must be received by 8th April 2019 PAPER SUBMISSION Manuscript guidelines as well as instructions on how to submit electronically will be soon available on the Conference website. Papers must not exceed four A4 pages with all illustrations and references included.

Papers submitted for review must clearly state:     - the purpose of the work     - how and to what extent it advances the state-of-the art     - specific results and their impact

After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by  31th May 2019. At the same time, the complete program will be published on the Conference website. An oral presentation will be given at the Conference for each accepted paper. No-shows will result in the exclusion of the papers from any conference related publication. The submitted final PDF files should be IEEE Xplore compliant.

For each paper independently, at least one co-author is required to register for the Conference (one registration-one paper policy).

ESSDERC 49th European Solid-State Device Research Conference ESSCIRC 45th European Solid-State Circuits Conference September 23-26, 2019Kraków, POLAND

https://esscirc-essderc2019.org LOCAL SCIENTIFIC SECRETARIAT Krzysztof Kasinski (AGH UST, PL) krzysztof.kasinski@agh.edu.pl Robert Szczygiel (AGH UST, PL) robert.szczygiel@agh.edu.pl ESSDERC/ESSCIRC 2019 ORGANIZING SECRETARIAT Foundation for AGH University of Science and Technology www.fundacja.agh.edu.pl e-mail: kf@agh.edu.pl Anna Inglot – Conference Manager phone: +48 504 004 517

Copyright 2018 Foundation for AGH UST in Cracow. All rights reserved. "You are receiving this email because you expressed interest in news and events about ESSDERC/ESSCIRC 2019"

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New Czech law makes ICT #neutrality a #right https://t.co/wLElZIQj2Y #paper

New Czech law makes ICT #neutrality a #right https://t.co/wLElZIQj2Y #paper

— Wladek Grabinski (@wladek60) December 9, 2018

from Twitter https://twitter.com/wladek60

December 09, 2018 at 12:40PM
via IFTTT

Analysis of #DIBL Effect and Negative Resistance Performance for }NCFET Based on a Compact #SPICE #Model https://t.co/nPHYOs9Kwk

Analysis of #DIBL Effect and Negative Resistance Performance for }NCFET Based on a Compact #SPICE #Model https://t.co/nPHYOs9Kwk

— Wladek Grabinski (@wladek60) November 27, 2018

from Twitter https://twitter.com/wladek60

November 27, 2018 at 06:19PM
via IFTTT

Explicit #Model of Channel Charge, Backscattering, and Mobility for #Graphene #FET in Quasi-#Ballistic Regime https://t.co/lpR01Q50eg

Explicit #Model of Channel Charge, Backscattering, and Mobility for #Graphene #FET in Quasi-#Ballistic Regime https://t.co/lpR01Q50eg

— Wladek Grabinski (@wladek60) November 27, 2018

from Twitter https://twitter.com/wladek60

November 27, 2018 at 04:44PM
via IFTTT

An Illustrated Subway Map of Human Anatomy https://t.co/viL7vi1dDV #modeling

An Illustrated Subway Map of Human Anatomy https://t.co/viL7vi1dDV #modeling

— Wladek Grabinski (@wladek60) November 25, 2018

from Twitter https://twitter.com/wladek60

November 25, 2018 at 07:07AM
via IFTTT

Compact #Terahertz #SPICE #Model: Effects of Drude Inductance and Leakage https://t.co/EilnJUx4tD

Compact #Terahertz #SPICE #Model: Effects of Drude Inductance and Leakage https://t.co/EilnJUx4tD

— Wladek Grabinski (@wladek60) November 23, 2018

from Twitter https://twitter.com/wladek60

November 23, 2018 at 09:13PM
via IFTTT

Optimization and #Scaling of #Ge-Pocket #TFET (#paper) https://t.co/yJlBGPCPH6

Optimization and #Scaling of #Ge-Pocket #TFET (#paper) https://t.co/yJlBGPCPH6

— Wladek Grabinski (@wladek60) November 23, 2018

from Twitter https://twitter.com/wladek60

November 23, 2018 at 04:49PM
via IFTTT

#Mobility Calculation of Ge Nanowire #Junctionless and Inversion-Mode Nanowire NFETs With Size and Shape Dependence (#paper) https://t.co/6hlQOts03n

#Mobility Calculation of Ge Nanowire #Junctionless and Inversion-Mode Nanowire NFETs With Size and Shape Dependence (#paper) https://t.co/6hlQOts03n

— Wladek Grabinski (@wladek60) November 23, 2018

from Twitter https://twitter.com/wladek60

November 23, 2018 at 04:47PM
via IFTTT

High-k Spacer Consideration of Ultrascaled Gate-All-Around #Junctionless Transistor in Ballistic Regime (#paper) https://t.co/kZdPay7S4J

High-k Spacer Consideration of Ultrascaled Gate-All-Around #Junctionless Transistor in Ballistic Regime (#paper) https://t.co/kZdPay7S4J

— Wladek Grabinski (@wladek60) November 23, 2018

from Twitter https://twitter.com/wladek60

November 23, 2018 at 03:20PM
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[mos-ak] [Final Program] 11th International MOS-AK Workshop; Silicon Valley, December 5, 2018

11th International MOS-AK Workshop

(co-located with the IEDM and CMC Meetings)

Silicon Valley, December 5, 2018

<http://www.mos-ak.org/silicon_valley_2018/>

Together with Sivaco team, the MOS-AK workshop host as well as International MOS-AK Board of R&D Advisers: Larry Nagel, Omega Enterprises Consulting (USA), Andrei Vladimirescu, UCB (USA); ISEP (FR) and all the Extended MOS-AK TPC Committee, we have pleasure to invite to consecutive, 11th International MOS-AK Workshop is Silicon Valley.

Scheduled, subsequent 11th MOS-AK SPICE/Compact Modeling Workshop organized in the Silicon Valley, aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and TCAD/EDA tool developers and vendors. The MOS-AK workshop program is available online: <http://www.mos-ak.org/silicon_valley_2018/>

Venue:

Silvaco

2811 Mission College Blvd., 6th Floor

Santa Clara,  California  95054

Online Registration is still open

(any related enquiries can be sent to registration@mos-ak.org)

Postworkshop Publications:

Selected best MOS-AK technical presentation will be recommended for further publication
in a special issue of the International Journal of High Speed Electronics and Systems

W.Grabinski on the behalf of International MOS-AK Committee

WG22112018

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The Experimental Side of #Modeling - Read online https://t.co/m883tQBNI3

The Experimental Side of #Modeling - Read online https://t.co/m883tQBNI3

— Wladek Grabinski (@wladek60) November 22, 2018

from Twitter https://twitter.com/wladek60

November 22, 2018 at 06:43PM
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A Path to Energy #Efficiency and #Reliability for ICs: Fully Depleted Silicon-on-Insulator (#FDSOI) Devices Offer Many Advantages - in IEEE Solid-State Circuits Magazine, vol. 10, no. 4, pp. 24-33, Fall 2018 https://t.co/cnPoHeQHIu #paper

A Path to Energy #Efficiency and #Reliability for ICs: Fully Depleted Silicon-on-Insulator (#FDSOI) Devices Offer Many Advantages - in IEEE Solid-State Circuits Magazine, vol. 10, no. 4, pp. 24-33, Fall 2018 https://t.co/cnPoHeQHIu #paper

— Wladek Grabinski (@wladek60) November 18, 2018

from Twitter https://twitter.com/wladek60

November 19, 2018 at 12:10AM
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7 reasons I love #opensource and you should too https://t.co/YwtVU50Wts https://t.co/XAvfO6kHve

7 reasons I love #opensource and you should too https://t.co/YwtVU50Wts pic.twitter.com/XAvfO6kHve

— Wladek Grabinski (@wladek60) November 9, 2018

from Twitter https://twitter.com/wladek60

November 09, 2018 at 05:01PM
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#Franz is made in Vienna, Austria with lots of by Stefan Malzner & the amazing community. https://t.co/pUfl4P1ng0 #opensource

#Franz is made in Vienna, Austria with lots of by Stefan Malzner & the amazing community. https://t.co/pUfl4P1ng0 #opensource

— Wladek Grabinski (@wladek60) November 7, 2018

from Twitter https://twitter.com/wladek60

November 07, 2018 at 07:32PM
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Device #Modeling of MgO-Barrier Tunneling Magnetoresistors for Hybrid Spintronic-CMOS https://t.co/sHrPJQm09t

Device #Modeling of MgO-Barrier Tunneling Magnetoresistors for Hybrid Spintronic-CMOS https://t.co/sHrPJQm09t

— Wladek Grabinski (@wladek60) November 2, 2018

from Twitter https://twitter.com/wladek60

November 02, 2018 at 09:41PM
via IFTTT

ISDCS 2019 in Hiroshima

The International Symposium on Devices, Circuits and Systems & Workshop on Nanoelectronics will take place in Hiroshima (Japan), on March 6-8 2019.

http://www.isdcs2019.hiroshima-u.ac.jp/

The ISDCS is a premium international forum for scholars, scientists, educators, students and engineers to exchange their latest findings and technological advances in the field of devices, circuits and systems. 

One of the topics is Physics, Analysis and Modeling of Devices. 

Other topics;

Photonics and Optoelectronics of Advanced Materials



Digital and Analog Circuits and Their System Applications



Neural Networks & Neuromorphic Circuits and Systems



Circuit Testing and Verifications



IoT Circuits and Systems



AI Circuits for Machine Learning Systems



Beyond CMOS Circuits and Hybrid systems



Intelligent Systems and Robotics



Environment Electronics and

Their Applications



Visual Communications & Multimedia Signal Processing

This symposium is initiated by IIEST Shibpur in collaboration with Hiroshima University, which will be held annually in India and in Japan alternatively. The first event was held at IIEST Shibpur.　The 1^st ISDCS-2018 conference proceedings are published in IEEE-explore.  

Deadline: November 15 2018.


 

IEEE LM Workshop on History of microchips in Switzerland

The Swiss IEEE LM has organized local Workshop on "History of microchips in Switzerland". This workshop is a follow-on of the IEEE Milestone celebration of Feb.22, 2018 in Neuchatel and was held in the same building of the Uni. Neuchatel at Rue A.L. Breguet 2, room 3416. The event was organized and chaired by Hugo Wyss, IEEE LM, with following agenda:

Session 1 (2:30 - 3:50pm): From Germanium to Silicon, 1955 - 1970

Speakers:

• W. Grabinski (EDS)
• M. Lamoth (Favag)
• J.-D. Chauvy (CEH)
• H. Wyss (IEEE LM)
• E. Vittoz (early CEH period)

Coffee break at Cafeteria, first floor, 3:55 - 4:10 pm

Session 2 (4:15 - 5:50pm): From Bipolar to CMOS, 1970 - 1980

Speakers:

• H. Wyss  (IEEE LM)
• N. de Rooji (IMT)
• P.-R. Beljean (AMSTN)
• others (open discussion)

The workshop was closed with a standing apero at Cafeteria.

The IEEE Milestone for the developments of Swiss quartz watch
(Uni. Neuchatel at Rue A.L. Breguet 2)

J.-D. Chauvy talk during Session 1: From Germanium to Silicon, 1955 - 1970;
chaired by H. Wyss, IEEE LM (sitting at very right)

An 1" wafer with one of the very first Swiss integrated circuits

Qucs-S 0.0.21 released

Qucs-S 0.0.21 has been released by Vadim Kuznetsov. It's a special Qucs version that allows to run Ngspice/Xyce simulators from the Qucs GUI. This release contains mostly bugfixes and small improvements. Here the short changelog:

1. Redesign of Parameter Sweep. Enabled sweep for log and list parameter type.
2. Fixed Voltage probe bug
3. Fixed missing phase of AC source
4. Added SMD resistor model

See release notes and download links here:
https://github.com/ra3xdh/qucs_s/releases/tag/0.0.21

Linux tarball and DEB/RPM packages are available. Windows installer will be added later.
See also https://ra3xdh.github.io/ for documentation and more info about Qucs-S.

---

Follow Qucs-devel mailing list

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Qucs-devel@lists.sourceforge.net

https://lists.sourceforge.net/lists/listinfo/qucs-devel

The #Digitization Of #China And Opportunities For #OpenSource Collaboration https://t.co/RNgs4kYilz

The #Digitization Of #China And Opportunities For #OpenSource Collaboration https://t.co/RNgs4kYilz

— Wladek Grabinski (@wladek60) October 26, 2018

from Twitter https://twitter.com/wladek60

October 26, 2018 at 01:01PM
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FOSDEM 2019 CAD and Open Hardware Devroom Call for Participation

This is the call for participation in the FOSDEM 2019 devroom on Computer Aided Design (CAD) tools and Open Hardware, to be held on Sunday 3 February 2019 in Brussels, Belgium. We are looking for contributions under the form of talks and tutorials covering the following main topics:

• Printed Circuit Board (PCB) design tools (e.g. KiCad and gEDA)
• Analogue and digital simulators (e.g. ngspice, Qucs, Gnucap, Xyce, GHDL, Icarus and Verilator)
• Any other EDA tools such as high-level tools for digital hardware design (e.g. Migen) and HDL synthesis tools (e.g. Yosys)
• Field solvers such as openEMS
• Mechanical 2D and 3D CAD tools such as LibreCAD, FreeCAD, OpenSCAD and SolveSpace
• Open Hardware projects such as the Teres laptop and the lowRISC SoC
• Inter-project opportunities for collaboration

We hope to provide an opportunity for attendees to bring themselves up to date on the latest FOSS CAD and Open Hardware developments, share knowledge and identify opportunities to collaborate on development tasks. This devroom is an evolution of the EDA devroom we organised in 2015, 2016 and 2017, which enlarged its scope in the CAD and Open

Hardware devroom in 2018.

Please submit your proposals at
https://penta.fosdem.org/submission/FOSDEM19 

before 1 December 2018.

Important dates
8 December 2018: deadline for submission of proposals
15 December 2018: announcement of final schedule
3 February 2019: devroom day

Michael Shur winning the 2018 IEEE EDS J.J. Ebers Award

Congratulations to Prof. Michael Shur for winning the 2018 IEEE EDS J.J. Ebers Award "For pioneering the concept of ballistic transport in nanoscale semiconductor devices"

Recent Winners of the J.J. Ebers Award

2017 - Kang L. Wang "For contributions and leadership in strained SiGe and magnetic memory technologies"

2016 - Jaroslav Hynecek "For the pioneering work and advancement of CCD and CMOS image sensor technologies"

2015 - Jack Yuan-Chen Sun "For sustained leadership and technical contributions to energy efficient foundry CMOS technologies"

2014 - Joachim N. Burghartz "For contributions to integrated spiral inductors for wireless communication ICs and ultra-thin silicon devices for emerging flexible electronics"

2013 - Nobukazu Teranishi "For development of the Pinned Photodiode concept widely used in Image Sensors”

2012 - Yuan Taur "For contributions to the advancement of several generations of CMOS process technologies"

2011 - Stuart Ross Wenham “For technical contributions and successful commercialization of high efficiency solar cells”

2010 - Mark E. Law “For contributions to widely used silicon integrated circuit process modeling”

1st Latin American Electron Devices Conference in Colombia

The 1st Latin American Electron Devices Conference (LAEDC 2019) will be held from February 24 to 27 2019 in Armenia, Colombia.

It will take place in parallel with the 2019 Latin American Symposium on Circuits and Systems (2019 LASCAS), also from February 24 to 27 2019 in Armenia, Colombia.


LAEDC is intended to be a top international conference about electron devices. It is thought to become the Latin American equivalent to ESSDERC in Europe. As ESSDERC is held in parallel with a solid state circuits conference, ESSDERC, LAEDC will be organized in combination with LASCAS.

LAEDC will also be the Latin American equivalent to the Electron Devices Technology and Manufacturing Conference (EDTM), organized every year in Asia.

Proceedings will be published by IEEE and will be available on IEEE Xplore.

There is a negotiation to publish a Special Issue in a top journal  containing extended versions of selected papers presented in LAEDC.

One of the topics of LAEDC is Modeling and Simulation. All electron devices can be targeted.

The deadline for paper submission is October 15 2018.

Armenia City is the capital of the department of Quindio. It is located in the Colombian region known as the coffee triangle. Since 2011, this region is recognized by the UNESCO as a world cultural heritage due to its exceptional landscapes that are the mixture of natural beautifulness and cultural traditions around the coffee growing. Different theme parks related to cultural and agricultural traditions are also located in the department of Quindio, which turns out the LAEDC an opportunity not only for academic exchange but also for knowing and enjoying the traditions around the coffee growing.

As Publication Chair, I strongly encourage researchers in device modeling to submit papers to the  1st Latin American Electron Devices Conference!

New offer of a Ph D scholarship about Device modeling in Tarragona (Spain)

We offer one scholarship for a Ph D student position in the Department of Electronic Engineering in the Universitat Rovira i Virgili (URV), in Tarragona, Spain.

The duration of the grant will be for three years.  The position will start between February and April 2019.

The candidate should have a Bachelor or Master degree in Electrical Engineering, Electronic Engineering, Telecommunication Engineering or Physics. A good background in Semiconductor Physics, Semiconductor Devices, or Integrated Circuit Design will be highly appreciated.

The work to be done by the candidate will be focused on the development of new techniques of characterization and modeling of devices for flexible and printed electronics, including sensing applications, in particular organic and oxide TFTs.

The NEPHOS group at URV is one of the most powerful teams in Europe in the area of compact modeling of semiconductor devices. We are currently coordinating a European Union funded project (DOMINO) about those topics.

Required documents for applicants

Applicants are required to send to the address specified below the following documents (in English or Spanish):

1) a full Curriculum Vitae (as complete as possible) with passport number

2) Copy of their diploma

3) copy of their passport

4) Academic certificate (translated into English by an official translator) including their marks (it is important that the number of hours or credits of each subject appears). It is also very important that the document specifies what is the minimum mark for passing a given subject and what is the maximum mark that can be awarded.

Candidates are requested to send their documents by e-mail to:

Prof. Benjamin IñiguezDepartment of Electronic, Electrical and Automatic Control Engineering

Universitat Rovira i Virgili (URV)

Avinguda Països Catalans, 26

43007 Tarragona (Spain)

 Email: benjamin.iniguez@gmail.com 

Tel: +34977558521 Fax:+34977559610

Deadline for documents submission: October 20 2018.
 

You can contact Prof. Benjamin Iñiguez (Benjamin.Iniguez@gmail.com) for more information.

Tarragona is a medium city (100000 inhabitants) with a Mediterranean climate and many recreation opportunities (nice beaches, theme parks, nature preserves, mountain hiking, touristic resorts and facilities). It is located 100 km Southwest of Barcelona, and it is very well connected by train, bus, highways and even low cost flights from its own airport. Additional information about the University and the department can be found at: www.urv.cat

[mos-ak] [2nd Announcement and C4P] 11th International MOS-AK Workshop, Silicon Valley, December 5, 2018

Arbeitskreis Modellierung von Systemen und Parameterextraktion 

Modeling of Systems and Parameter Extraction Working Group

11th International MOS-AK Workshop

(co-located with the IEDM and CMC Meetings)

Silicon Valley, December 5, 2018

Together with Silvaco, lead sponsor and local organization team, International MOS-AK Board of R&D Advisers as well as all the Extended MOS-AK TPC Committee, we have pleasure to invite to consecutive, 11th International MOS-AK Workshop which will be organized at Silvaco HQ on Dev. 5, 2018 (co-located with the IEDM and CMC Meetings)

Planned 11th International MOS-AK Workshop aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring academic and industrial experts in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors. 

Venue: 

Silvaco
2811 Mission College Blvd., 6th Floor
Santa Clara, California 95054

Online Workshop Registration is open 

(any related enquiries can be sent to registration@mos-ak.org)

Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:

• Compact Modeling (CM) of the electron devices
• Advances in semiconductor technologies and processing
• Verilog-A language for CM standardization
• New CM techniques and extraction software
• Open Source TCAD/EDA modeling and simulation
• CM of passive, active, sensors and actuators
• Emerging Devices, TFT, CMOS and SOI-based memory cells
• Microwave, RF device modeling, high voltage device modeling
• Nanoscale CMOS devices and circuits
• Technology R&D, DFY, DFT and reliability/ageing IC Designs
• Foundry/Fabless Interface Strategies

Important Dates: 

• Call for Papers - Sept. 2018
  
• 2nd Announcement - Nov. 2018
  
• Final Workshop Program - Oct. 2018
  
• MOS-AK Workshop: Dec. 5, 2018
  

Online Abstract Submission is open 

(any related enquiries can be sent to abstract@mos-ak.org)

Postworkshop IJHSES Publications:

Selected best MOS-AK technical presentation will be recommended for further publication in a special issue of the International Journal of High Speed Electronics and Systems

Extended MOS-AK Committee

WG041018

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[mos-ak] [2nd Announcement and Call for Papers] 2nd MOS-AK/India Conference, IIT Hyderabad, Feb. 25-27, 2019

Arbeitskreis Modellierung von Systemen und Parameterextraktion 

Modeling of Systems and Parameter Extraction Working Group

2nd MOS-AK/India Conference

IIT Hyderabad

Feb. 25-27, 2019 

Together with the MOS-AK/India Steering Committee and executive local organizers at the IIT Hyderabad as well as all the Extended MOS-AK TPC Committee, we have pleasure to invite to the 2nd MOS-AK/India Conference at IIT Hyderabad between Feb. 25-27, 2019 

Venue: 

Indian Institute of Technology (IIT) Hyderabad
Hyderabad, Kandi
Telangana State, India

Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:

Compact Modeling Track

Circuits and Systems Track

Advances in semiconductor technologies and processing Compact Modeling (CM) of the electron devices Verilog-A language for CM standardization New CM techniques and extraction software FOSS TCAD/EDA modeling and simulation CM of passive, active, sensors and actuators Emerging Devices, TFT and SOI-based memory cells Organic, Bio/Med devices/technology modeling Microwave, RF device modeling, HV/Power device modeling Nanoscale CMOS devices and circuits Technology R&D reliability/ageing, DFY, DFT  Foundry/Fabless Interface Strategies

Analog Circuits Biomedical and Life-Science Circuits, Systems and Applications Circuits and Systems for Communication Emerging Technologies for Circuits and Systems HP/HV IC Designs Memory Circuits and Systems Mixed Signal Circuits RF/mm-Wave IC Design and Technology Sensory Systems System-on-Chip and CAD Testing Technology VLSI Systems & Applications And any other IC design related topic

Online	Abstract Submission (any related enquiries can be sent to secretary.mosak.india@gmail.com)
	Original unpublished works in topics related to the following areas (but not limited to) can be submitted for publication. The proceedings of the conference will be submitted to IEEE Explore. Best Paper Award: Gold leaf, Silver leaf and Bronze leaf certificates will be given to best papers.
	Highest Ranked papers from regular submission will be invited to extend their paper in the form of a book chapter. All these submission will be published in the form of a book titled "Compact Modeling: Technology, Devices, IC Design" by River Publishers, the technical program promoters of MOS-AK/India 2019 Conference.
Author	Instruction and Registration Details available as a pdf document

Important Dates:

Call for Papers - 1 Sept. 2018

2nd Announcement -  1 Oct. 2018

Paper and Tutorial Submission Deadline - 1 Nov. 2018

Notification of Acceptance - 15 Dec. 2018

Registration and Camera Ready Paper Submission - 10 Jan. 2019

Final Conference Program - 15 Jan. 2019

MOS-AK/India Conference - February 25-27, 2019

Online registration (to be open in Jan. 2019; any related enquiries can be sent secretary.mosak.india@gmail.com)

Extended MOS-AK Committee

WG010118

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Microsoft #MSDOS #opensource https://t.co/e7Qeg2fMqH

Microsoft #MSDOS #opensource https://t.co/e7Qeg2fMqH

— Wladek Grabinski (@wladek60) September 30, 2018

from Twitter https://twitter.com/wladek60

September 30, 2018 at 06:09PM
via IFTTT

New Charge Pumping Current #Model Assuming Exponential Tails in the Trap Energy Distribution. This modified expression leads to a different method of extracting the trap emission time constant https://t.co/LUtOI11Och

New Charge Pumping Current #Model Assuming Exponential Tails in the Trap Energy Distribution. This modified expression leads to a different method of extracting the trap emission time constant https://t.co/LUtOI11Och

— Wladek Grabinski (@wladek60) September 28, 2018

from Twitter https://twitter.com/wladek60

September 28, 2018 at 12:20PM
via IFTTT