Showing posts with label SPICE model. Show all posts
Showing posts with label SPICE model. Show all posts

Aug 17, 2020

[paper] SPICE model of p‐Si TFET

Sola Woo Juhee Jeon Sangsig Kim 
A SPICE model of p‐channel silicon tunneling field‐effect transistors for logic applications
IJNM: 06 August 2020; DOI: 10.1002/jnm.2793

1Department of Electrical Engineering,Korea University, Seoul, South Korea

Abstract: In this study, we propose a SPICE model of p-channel silicon tunneling field-effect transistors (TFETs) for logic applications. To verify our model, electrical characteristics of fabricated p-TFETs are calibrated by utilizing TCAD and SPICE simulations. We simulate various logic gates, such as complementary TFET (c-TFET) inverters, c-TFET NAND gates, and c-TFET NOR gates using our TFET model. Our simulation shows that a c-TFET inverter can be operated at VDD as low as 0.3?V and that c-TFET logic gates based on our model can operate ~1000 times higher frequency than conventional TFET logic gates.
FIG: 2D structure of p-TFET for our simulation 
and its simulated/measured transfer characteristics at VDS=-1.0V

Acknowledgements: This research was partly supported by the MOTIE (Ministry of Trade, Industry & Energy) (10067791) and KSRC (Korea Semiconductor Research Consortium) support program for the development of the future semiconductor device, the Brain Korea 21 Plus Project in 2020, and Samsung electronics.

May 25, 2020

[paper] SPICE PCM Model

A SPICE Model of Phase Change Memory for Neuromorphic Circuits
Xuhui Chen1, Huifang Hu1, Xiaoqing Huang1, Weiran Cai2, Ming Liu3 (Fellow, Ieee), Chung Lam4,  Xinnan Lin1 (Member, IEEE), Lining Zhang5 (Senior Member, IEEE)
and Mansun Chan6 (Fellow, IEEE)
1The Shenzhen Key Lab of Advanced Electron Device and Integration, ECE, Peking University Shenzhen Graduate School, Shenzhen 518055 CN
2Institute of Microscale Optoelectronics, Shenzhen University, Shenzhen 518061 CN
3Key Laboratory of Microelectronics Devices and Integration Technology, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, and the University of Chinese Academy of Sciences, Beijing 100049 CN
4Jiangsu Advanced Memory Technology Co., Ltd, Huaian 223302 CN
5School of Electronic and Computer Engineering, Peking University, Shenzhen 518055, CN
6HKUST Shenzhen Research Institute, Shenzhen 518057, China, and Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, HK

doi: 10.1109/ACCESS.2020.2995907

Abstract: A phase change memory (PCM) model suitable for neuromorphic circuit simulations is developed. A crystallization ratio module is used to track the memory state in the SET process, and an active region radius module is developed to track the continuously varying amorphous region in the RESET process. To converge the simulations with bi-stable memory states, a predictive filament module is proposed using a previous state in iterations of nonlinear circuit matrix under a voltage-driven mode. Both DC and transient analysis are successfully converged in circuits with voltage sources. The spiking-timedependent- plasticity (STDP) characteristics essential for synaptic PCM are successfully reproduced with SPICE simulations verifying the model’s promising applications in neuromorphic circuit designs. Further on, the developed PCM model is applied to propose a neuron circuit topology with lateral inhibitions which is more bionic and capable of distinguishing fuzzy memories. Finally, unsupervised learning of handwritten digits on neuromorphic circuits is simulated to verify the integrity of models in a large-scale-integration circuits. For the first time in literature an emerging memory model is developed and applied successfully in neuromorphic circuit designs, and the model is applicable to flexible designs of neuron circuits for further performance improvements. 
FIG: Schematic diagram of commonly used PCM mushroom structure
URL: https://IEEExplore.IEEE.org/stamp/stamp.jsp?tp=&arnumber=9097232&isnumber=6514899

Feb 8, 2018

BSIM3v3 to EKV2.6 Model Parameter Extraction

BSIM3v3 to EKV2.6 Model Parameter Extraction and Optimisation
using LM Algorithm on 0.18um Technology node
Kirmender Singh and Piyush Jain
Int. Journal of Electronics and Telecommunications 2018 Vol.64 No.1 pp.5-11

Abstract: The industry standard BSIM3v3 and BSIM4.0 have been replaced by BSIM6.0 compact MOSFET model for deep submicron technology node. The BSIM6.0 is next generation, defacto industry standard model for bulk MOSFET. This model is charge based which is continuous from weak to strong inversion of operation. The core of analytical and physical BSIM6 model[3] is charge, with drain current equation expressed in form of source (qs) and drain charge (qd). This model has all its governing equations continuous and can be used to develop design methodology using IC based approach. But its method of computing qs and qd is complicated which is different from Vittoz traditional charge calculation method. The continuous interpolation equation of drain current as adopted by EKV2.6 although is empirical but its compact expression is preferred by analog designer to get intuitive design guidance. BSIM6 is a combined effort by BSIM and EKV modeling groups based on charge based continuous equations. Although EKV2.6 model is not valid for deep submicron process as it only includes submicron short channel effects like velocity saturation (VS), vertical field mobility reduction (VFMR), Drain induced barrier lowering (DIBL), channel length modulation (CLM) etc. But it still offers some benefits to have first cut design methodology because of its much simplified analytical equations. The inversion coefficient (IC) has found extensive acceptance in designer community as it offers enhanced design elegance in EKV then more complicated BSIM model. This paper discuses first step in analog design process by extracted core EKV2.6 intrinsic model parameters from industry standard BSIM3v3 model on 0.18µ technology node. The 0.18µ technology is chosen as it is still more common technology node in analog circuit design. The model parameters are extracted for different bins and optimisation is done using nonlinear optimisation LM algorithm. The optimised EKV2.6 parameters are validated with currentvoltage(I-V), intrinsic voltage gain (Avi) and Early voltage circuit parameter (VA) with BSIM3v3 model [read more...]

Flow-chart of BSIM to EKV conversion steps
(source:
D. Stefanovic and M. Kayal “Structured Analog CMOS Design" Springer Publications, 2008)

Oct 17, 2017

[paper] Accurate diode behavioral model with reverse recovery

Stanislav Banáša,b, Jan Divínab, Josef Dobešb, Václav Paňkoa
aON Semiconductor, SCG Czech Design Center, Department of Design System Technology, 1. maje 2594, 756 61 Roznov pod Radhostem, Czech Republic
bCzech Technical University in Prague, Faculty of Electrical Engineering, Department of Radioelectronics, Technicka 2, 166 27 Prague 6, Czech Republic
Volume 139, January 2018, Pages 31–38

Highlights:

  • The complex robust time and area scalable Verilog-A model of diode containing reverse recovery effect has been developed.
  • Due to implemented reverse recovery effect the model is useful especially for high-speed or high-voltage power devices.
  • The model can be used as stand-alone 2-terminal diode or as a parasitic p-n junction of more complex lumped macro-model.
  • Two methods of model parameter extraction or model validation have been demonstrated.

ABSTRACT: This paper deals with the comprehensive behavioral model of p-n junction diode containing reverse recovery effect, applicable to all standard SPICE simulators supporting Verilog-A language. The model has been successfully used in several production designs, which require its full complexity, robustness and set of tuning parameters comparable with standard compact SPICE diode model. The model is like standard compact model scalable with area and temperature and can be used as a stand-alone diode or as a part of more complex device macro-model, e.g. LDMOS, JFET, bipolar transistor. The paper briefly presents the state of the art followed by the chapter describing the model development and achieved solutions. During precise model verification some of them were found non-robust or poorly converging and replaced by more robust solutions, demonstrated in the paper. The measurement results of different technologies and different devices compared with a simulation using the new behavioral model are presented as the model validation. The comparison of model validation in time and frequency domains demonstrates that the implemented reverse recovery effect with correctly extracted parameters improves the model simulation results not only in switching from ON to OFF state, which is often published, but also its impedance/admittance frequency dependency in GHz range. Finally the model parameter extraction and the comparison with SPICE compact models containing reverse recovery effect is presented [read more...]

FIG: Solving the recursive calculation of reverse recovery charge