Showing posts with label Communications. Show all posts
Showing posts with label Communications. Show all posts

Jan 31, 2024

[paper] THz Measurements, Antennas, and Simulations

Fawad Sheikh 1, Andreas Prokscha 1, Johannes M. Eckhardt 2, Tobias Doeker 2, Naveed A. Abbasi 3, Jorge Gomez-Ponce 3,4, Benedikt Sievert 5, Jan Taro Svejda 5, Andreas Rennings 5, Jan Barowski 6, Christian Schulz 6, Ilona Rolfes 6, Daniel Erni 5, Andreas F. Molisch 3, Thomas Kürner 2, and Thomas Kaiser 1
THz Measurements, Antennas, and Simulations: From the Past to the Future
Invited Paper in IEEE Journal of Microwaves, vol. 3, no. 1, pp. 289-304, Jan. 2023
DOI: 10.1109/JMW.2022.3216210

1 Institute of Digital Signal Processing, UDE, Duisburg (D)
2 Institute for Communications Technology, TU Braunschweig (D)
3 Wireless Devices and Systems Group, University of Southern California, Los Angeles (USA) 
4 ESPOL, Facultad de Ingeniería en Electricidad y Computación, Guayaquil (EC)
5 ATE, University of Duisburg-Essen, and CENIDE Duisburg (D)
6 Institute of Microwave Systems, Ruhr University, Bochum (D)

Abstract: In recent years, terahertz (THz) systems have become an increasingly popular area of research thanks to their unique properties such as extremely high data rates towards Tb/s, submillimeter localization accuracy, high resolution remote sensing of materials, and remarkable advances in photonics and electronics technologies. This article traces the progress of the THz measurements, antennas and simulations, from historical milestones to the current state of research and provides an outlook on the remaining challenges.

FIG: Realized gain measurement of the integrated antenna prototype compared to the estimation of the corresponding equivalent circuit (EC) model in E- and H-plane at 290GHz (a)
and micrograph of the antenna prototype (b)

AcknowledgmentThis work was supported in part by Deutsche Forschungsgemeinschaft for Projects M01, M02, M03, M04, C05, and S03, under Project 287022738 TRR 196, in part by the Ministry of Culture and Science of the State of North Rhine-Westphalia (MKW NRW) through Project terahertz.NRW, and in part by the Open Access Publication Fund of the University of Duisburg-Essen. The work of Jorge Gomez-Ponce was supported by Foreign Fulbright Ecuador SENESCYT Program. The work of Johannes M. Eckhardt, Tobias Doeker, and Thomas Kürner was supported in part by the Federal Ministry of Education and Research (BMBF), Germany, through 6G Research and Innovation Cluster 6G-RIC under Grant 16KISK031 and in part by German Research Foundation (DFG) under Grant FOR 2863, “Meteracom - Metrology for THz Communications.” The work of Jorge Gomez-Ponce, Naveed A. Abbasi, and Andreas F. Molisch was supported by SRC, DARPA, NSF, NIST, and Samsung Research America through ComSenTer Program. This work did not involve human subjects nor animals in its research.


Oct 13, 2023

[conference] FIRST 2023


Website: http://sme.tju.edu.cn/info/1095/2265.htm
English: https://www.aconf.org/conf_194081.html

Date: 30 Oct 2023 (Mon) to 31 Oct 2023 (Tue)
Main Organizer: Tianjin University
Venue: Online

Theme: Interdisciplinarity: The Fusion of Technologies (Semiconductor, Artificial Intelligence, Internet-of-Things, and Communications)

The inaugural FIRST international conference will be held online on Monday, 30th and Tuesday 31st October 2023. Many world-renowned professors, experts and researchers in communication and semiconductor technologies and other related fields at home and abroad will attend this conference. This international conference aims to discuss the open problems and present new solutions that address the challenges of future communication systems, artificial intelligence, internet-of-things, and chip design. Specifically, the role of semiconductors in future communications will be presented and how can the semiconductor and communication industry emerge stronger after the pandemic will be discussed.

This FIRST international conference will be open to relevant enterprises and experts in the field of semiconductors and integrated circuits, providing a professional multi-disciplinary and multi-field exchange and cooperation platform for enterprises, universities and research institutes in the field of semiconductors and integrated circuits, providing innovative ideas for today's increasingly complex and difficult product development, combining cutting-edge scientific research and product innovation more effectively. At the same time, it lays a solid foundation for more in-depth school-enterprise cooperation.

Registration(注册网址): 中文站 - https://www.aconf.cn/conf_194081.html