[paper] Next Wave for AI/ML in Physical Design

Andrew B. Kahng

Solvers, Engines, Tools and Flows: The Next Wave for AI/ML in Physical Design

ISPD ’24 Proceedings

March 12–15, 2024, Taipei, Taiwan.

DOI 10.1145/3626184.3635277

Abstract: It has been six years since an ISPD-2018 invited talk on “Machine Learning Applications in Physical Design”. Since then, despite considerable activity across both academia and industry, many R&D targets remain open. At the same time, there is now clearer understanding of where AI/ML can and cannot (yet) move the needle in physical design, as well as some of the difficult blockers and technical challenges that lie ahead. Some futures for AI/ML-boosted physical design are visible across solvers, engines, tools and flows and in contexts that span generative AI, the modeling of “magic” handoffs at flow interstices, academic research infrastructure, and the culture of benchmarking and open-source EDA.

Fig: OpenROAD as a new EDA playground for ML researchers

Acknowledgments: Many thanks to Sayak Kundu, Bodhisatta Pramanik, Zhiang Wang and Dooseok Yoon for their help with the figures and text in this paper. Discussions with Siddhartha Nath, Igor Markov, Chuck Alpert and Ilgweon Kang are also gratefully acknowledged. Research at UCSD is partially supported by DARPA, Samsung, the C-DEN center, and gifts from Google, Intel and others.

[conference] FIRST 2023

Website: http://sme.tju.edu.cn/info/1095/2265.htm

English: https://www.aconf.org/conf_194081.html

Date: 30 Oct 2023 (Mon) to 31 Oct 2023 (Tue)

Main Organizer: Tianjin University

Venue: Online

Theme: Interdisciplinarity: The Fusion of Technologies (Semiconductor, Artificial Intelligence, Internet-of-Things, and Communications)

The inaugural FIRST international conference will be held online on Monday, 30th and Tuesday 31st October 2023. Many world-renowned professors, experts and researchers in communication and semiconductor technologies and other related fields at home and abroad will attend this conference. This international conference aims to discuss the open problems and present new solutions that address the challenges of future communication systems, artificial intelligence, internet-of-things, and chip design. Specifically, the role of semiconductors in future communications will be presented and how can the semiconductor and communication industry emerge stronger after the pandemic will be discussed.

This FIRST international conference will be open to relevant enterprises and experts in the field of semiconductors and integrated circuits, providing a professional multi-disciplinary and multi-field exchange and cooperation platform for enterprises, universities and research institutes in the field of semiconductors and integrated circuits, providing innovative ideas for today's increasingly complex and difficult product development, combining cutting-edge scientific research and product innovation more effectively. At the same time, it lays a solid foundation for more in-depth school-enterprise cooperation.

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