Tuesday, October 15, 2013


ED Germany – by Joachim N. Burghartz 

The German Chapter of IEEE EDS sponsored the annual spring compact modeling workshop of the MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, held April 11– 12, 2013. The meeting was supported by Prof. Doris Schmid-Landsiedel and the staff of the Institute for Technical Electronics, TUM, Munich, who is one of the local coordinators of the ED German Chapter. More than 30 international academic researchers and modeling engineers attended three sessions to listen to 12 technical compact modeling presentations. As in previous years this well-established effort has been coordinated by Wladek Grabinski, Switzerland. The workshop's three sessions focused on common compact modeling actions. Sessions included: (i) How to consolidate and build consistent simulation hierarchy at all levels of advanced TCAD numerical modeling; (ii) Compact/ SPICE modeling for Analog / Mixed Signal circuits; and (iii) Corner modeling and statistical simulations. The MOS-AK/GSA speakers were K.-W. Pieper (Infineon), M. Sylvester (MunEDA), B. Iñiguez (URV), I. Nickeleit (Agilent), L. Heiss (LTE, TUM); T. Schulz (Intel), C. Jungemann (RWTH), M. Brinson (London Metropolitan University), B.-Y. Nguyen (SOITEC), A. Kloes (THM), U. Monga (Intel), and M. Bucher (TUC). The event was accompanied by a series of the software/hardware demos by MOS-AK/GSA industrial partners: Agilent, MunEDA and Tanner EDA. The session technical and software/ hardware demo presentations are available for download at: <http:// www.mos-ak.org/munich_2013/>. 

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