Call for Papers
The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of the leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.
Date and Location
- Conference date: September 5-7, 2012
- Abstract submission deadline: April 1, 2012
- Conference location: Sheraton Denver Downtown Hotel, Denver, Colorado, USA
- Webpage: http://www.ece.umd.edu/sispad2012
Original papers are solicited in the following subject areas:
The abstract should describe the nature of the presentation, together with references. The text must be single-spaced with 11pt or 12pt font. The abstract is limited to two pages including figures, tables and references. Abstracts should be submitted in PDF format.
For more information, please visit:http://www.ece.umd.edu/sispad2012/