Wednesday, March 7, 2012

SISPAD'2012 - Second call for papers

Call for Papers
The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of the leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.
Date and Location
  • Conference date: September 5-7, 2012
  • Abstract submission deadline: April 1, 2012
  • Conference location: Sheraton Denver Downtown Hotel, Denver, Colorado, USA
  • Webpage:
Original papers are solicited in the following subject areas:
  • Electronic Transport in Semiconductor Materials and Devices
  • Device Modeling and Simulation
  • Sensors, Biosensors and Electromechanical Systems Simulation
  • Process and Equipment Modeling and Simulation
  • Compact Models
  • Physical-Level Circuit Simulation
  • New Algorithms for Process and Device Modeling
  • Simulation of Nano and Quantum Devices
  • User Interfaces and Visualization
  • Simulation of Power Devices
  • Photovoltaics and Other Green Technologies
The abstract should describe the nature of the presentation, together with references. The text must be single-spaced with 11pt or 12pt font. The abstract is limited to two pages including figures, tables and references. Abstracts should be submitted in PDF format.
For more information, please visit:

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