Apr 14, 2020

#paper: Meng Zhang and Dragan Damjanovic; Quasi-rayleigh model for modeling hysteresis of piezoelectric actuators; Smart Materials and Structures; DOI: https://t.co/0lOX07NnAU https://t.co/WaSgY5lYML https://t.co/Dux8Lpe4wq


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April 14, 2020 at 02:24PM
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ICMTS2020 #paper: Cutoff Frequency Fluctuation in RF-MOSFETs

2020 ICMTS, April 6-9, Edinburgh (UK)
Novel Statistical Modeling and Parameter Extraction Methodology
of Cutoff Frequency for RF-MOSFETs
Chika Tanaka, Yasuhiko Iguchi, Atsushi Sueoka, and Sadayuki Yoshitomi
Memory Division, Kioxia Corporation
2-5-1, Kasama, Sakae-ku, Yokohama, 247-8585, Japan

Abstract: The cutoff frequency fluctuation in RF-MOSFET has been investigated. Detailed analysis for capacitance fluctuation as well as the extraction of an intrinsic MOSFET parameter were performed. The extracted process parameters were verified by the framework of effective mobility. The global statistical model of cutoff frequency was successfully developed in terms of capacitance fluctuation, considering intrinsic (channel and bulk charge) and extrinsic (overlap and fringe) capacitance components separately and identifying the major variability sources for cutoff frequency by using extracted parameter.
Fig: Calculated σfT is plotted against σfT obtained from measured data.




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Apr 11, 2020

Fwd: MIXDES 2020 moves online

------- Forwarded message ---------
From: MIXDES 2020 Organising Committee <mixdes2020@dmcs.p.lodz.pl>
Date: Thu, 9 Apr 2020 at 22:03
Subject: MIXDES 2020 moves online
To: <wladek@grabinski.ch>


Dear Colleagues,

As the Covid-19 disease is spreading worldwide and we have not yet seen
the peak, we have decided to move current edition of MIXDES to the
Internet. Hopefully next year we will be able to meet face to face. In
the meantime please keep your calendars blocked for the original
conference dates (June 25-27), and prepare to join us online. We will
inform you about the details later.

We are planning to reduce the conference fee to the level of ca. 100 Euro.

As in the previous years, the Conference Proceedings containing all the
presented papers will still be published on IEEE Xplore, so you do not
have to worry about visibility of your papers.


Wishing you Happy Easter and hoping that you stay safe,

Mariusz Orlikowski

--
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Fwd: Immediate changes for ESSCIRC-ESSDERC 2020 in Grenoble

------- Forwarded message ---------
From: Andreia CATHELIN <andreia.cathelin@st.com>
Date: Thu, 9 Apr 2020 at 17:11
Subject: Immediate changes for ESSCIRC-ESSDERC 2020 in Grenoble
To: Andreia CATHELIN <andreia.cathelin@st.com>
CC: Andreia CATHELIN <andreia.cathelin@st.com>, Sylvain CLERC <sylvain.clerc@st.com>, Maud VINET <maud.vinet@cea.fr>, ANDRIEU François 200489 <francois.andrieu@cea.fr>, Dominique THOMAS <dominique.thomas@st.com>, ERNST Thomas 175262 <thomas.ernst@cea.fr>, andrea.baschirotto@unimib.it <andrea.baschirotto@unimib.it>, huang@iis.ee.ethz.ch <huang@iis.ee.ethz.ch>


Grenoble, April 9th, 2020

 

Dear TPC members of ESSCIRC-ESSDERC conference,

 

First of all, we truly hope this email finds you in good health, together with family and friends!

 

Together with our sponsoring IEEE Societies, SSCS and EDS, ESSCIRC-ESSDERC is closely monitoring developments related to the rapidly evolving COVID-19 pandemic. The health and safety of our members is the number one priority of our societies. As of today April the 9th, 2020, more than one third of the Global population is under severe confinement, as a result of the protective public health measures imposed by the different governments, states or provinces. The situation is still evolving rapidly and dramatically, unfortunately in an unpredictable way.

 

Given this uncertain situation, we, the organizing committee of ESSxxRC2020 Grenoble and the ESSCIRC-ESSDERC Steering committee, have decided to propose a new format for our conference:

 

From a practical point of view:

For all the authors who have been or were about to prepare papers for this version of ESSCIRC-ESSDERC, we strongly encourage you to submit your publications directly to the following IEEE journals:

  • For ESSCIRC, please see https://sscs.ieee.org/publications:
    • IEEE SSC-L, Solid-State Circuits Letters (same 4-pages format as ESSCIRC)
      • The SSCS has just created a Special Section on ESSCIRC 2020, inside the SSC-Letters: https://mc.manuscriptcentral.com/ssc-l
      • When submitting their manuscript, authors need to select: Special Section on ESSCIRC 2020. It is open for submissions from April 9, 2020 to May 4, 2020.
      • The authors having accepted papers through this path will be kindly invited in September 2021 to present this same work in a Special Oral Session of ESSCIRC2021.
    • IEEE JSSC, Journal of Solid-State Circuits
    • IEEE O-JSSC, Open-Journal of Solid-State Circuits (open access)

  • For ESSDERC, please see https://eds.ieee.org/publications :
    • IEEE EDL, Electron Devices Letters (same 4-pages format as ESSDERC) 
    • IEEE TED, Transactions on Electron Devices
    • IEEE JEDS, Journal of Electron Devices Society (open access)
    • We are actively working with EDS to propose a similar Special Section for ESSDERC together with ED-L.

 

In 2021, we are planning to resume to a usual conference development schedule with tentative dates of: 

  • paper submission deadline on April 19th, 2021,
  • the conference in Grenoble, September 6-9, 2021.

All the topology of the conference with regards to the different tracks and TPC members stays exactly the same for 2021. You might as well be solicited by the different IEEE journals for anonymous reviews, please do provide all your support, as they will get a much larger volume of publications than regular.

 

The 2022 version of ESSCIRC-ESSDERC will take place in September 2022 in Milano. We thank very much to Andrea Baschirotto&team for their immediate proactivity, flexibility and cooperation.

 

This information shall be posted as well on our website within the hour, and we will massively announce it also on social media. Please do not hesitate to spread this information to your personal network.

 

Thank you very much for your continued trust, and stay safe!

 

Kind regards,

 

Andreia Cathelin, TPC chair ESSCIRC

Francois Andrieu, TPC chair ESSDERC

Sylvain Clerc, TPC co-chair ESSCIRC

Maud Vinet, TPC co-chair ESSDERC

Thomas Ernst, Conference Chair

Dominique Thomas, Conference Co-Chair

Qiuting Huang, ESSCIRC-ESSDERC Steering Committee Chair

 

 

Andreia Cathelin | Tel: +33 476926603 | Mobile: +33 607649918

Technology & Design Platform | Strategy & Innovation/Ecosystem | Technology R&D Fellow

 

STMicroelectronics Crolles2

850 rue Jean Monnet | 38926 Crolles Cedex | France

 

Knowledge is proud that he has learned so much,
Wisdom is humble that he knows no more.

The Task, Book 6, 'The Winter Walk at Noon' (published 1785). William Cowper

 

 

 

--
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Apr 9, 2020

#Resignation of Mauro Ferrari – Statement by the #ERC's Scientific Council https://t.co/7rVa8pkFnO #paper https://t.co/NoQidE1Tko


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April 09, 2020 at 09:53AM
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Apr 7, 2020

#OpenSource Innovation: #Alibaba now boasts over 180 open-source projects https://t.co/XOdk8ONDpz https://t.co/y240CR2HvZ https://t.co/mXHpJfC4yX


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April 07, 2020 at 10:53AM
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Apr 6, 2020

#paper: T. Joshi, Y. Singh and B. Singh, "Extended-Source Double-Gate Tunnel FET With Improved DC and Analog/RF Performance," in IEEE TED, vol. 67, no. 4, pp. 1873-1879, April 2020 https://t.co/Pj1MYX1aF1 https://t.co/S2UjuAbMwn


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April 06, 2020 at 11:05AM
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