An Update on the OpenPDK for IC Design (by Daniel Payne)

IC designers use EDA tools to implement their logical and physical design, and these tools require foundry-specific information for:

• Design Rule Checking (DRC)
• Layout Versus Schematic (LVS)
• Library Symbols
• Parasitic EXtraction (PEX)

This foundry information is called a Process Design Kit or PDK for short. Now put yourself in the place of the foundry or IDM, and you want to support EDA tools from multiple vendors like: Cadence Design Systems, Mentor Graphics, Synopsys, Silvaco and Tanner EDA. That adds up to a lot of QA and PDK development effort to support so many EDA vendors and tools. There has to be an easier way to create PDKs instead of one vendor at a time.




Read more at the original source

[mos-ak] [2nd announcement] Spring MOS-AK Workshop in London

Spring MOS-AK Workshop in London

Together with the workshop host, Prof. Bal Virdee, Londonmet, FIET MIEEE, and Prof. Mike Brinson, Londonmet, as well as Extended MOS-AK/GSA TPC Committee, we have pleasure to invite to the spring MOS-AK Workshop in London

Venue:

London Metropolitan University 

Graduate Centre

166-220 Holloway Road

London N7 8DB

Important Dates:

• Call for Papers - Dec 2013
  
• 2nd Announcement - Jan. 2014
  
• Final Workshop Program - Feb. 2014
  
• MOS-AK Workshop - March 28-29 2014

R&D topics to be covered include the following:

• Advances in semiconductor technologies and processing
  
• Compact Modeling (CM) of the electron devices
  
• Verilog-A language for CM standardization
  
• New CM techniques and extraction software
  
• CM of passive, active, sensors and actuators
  
• Emerging Devices, CMOS and SOI-based memory cells
  
• Microwave, RF device modeling, high voltage device modeling
  
• Nanoscale CMOS devices and circuits
  
• Technology R&D, DFY, DFT and IC Designs
  
• Foundry/Fabless Interface Strategies
  

Abstract Submission:

Authors should submit an abstract using on-line MOS-AK submission form (any related enquiries can be sent to abstract@mos-ak.org)

Postworkshop publications:

selected best MOS-AK technical presentation will be recommended for further publication in a special issue of the International Journal of Numerical Modelling: Electronic Networks, Devices and Fields

Extended MOS-AK/GSA Committee

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[mos-ak] [on-line publications] 6th International MOS-AK Workshop Washington DC Dec.11, 2013

Recent, 6th International MOS-AK/GSA Workshop on Dec.11, 2013 in Washington DC was organized to discuss SPICE/compact modeling and its standardization with a freewheeling session to review modeling activities of the CMC, IEEE EDS CMTC, NEEDS NanoHub and MOS-AK Groups. The workshop's presentations are available on-line at <http://www.mos-ak.org/washington_dc_2013/>

Please also distribute further information about next MOS-AK related events among all who are interested in the SPICE/compact modeling:

IWCM at DAC ASP Singapore (SG) Jan. 23, 2014 

http://www.ece.nus.edu.sg/stfpage/elehy/aspdac2014/

Q2 2014 MOS-AK London (UK) March'2014

http://www.mos-ak.org/london_2014/

MIXDES Lwow (UA) June 19-21, 2014

http://mixdes2014.lp.edu.ua/Mixdes3/tekst/view/special

Q3 MOS-AK at 44th ESSDERC / 40th ESSCIRC Venice (I) Sept. 26, 2014

http://www.mos-ak.org/venice_2014/

Already now, I am looking forward to meet you at one of our MOS-AK modeling events, soon.

-- with regards - wladek;
--

Arbeitskreis Modellierung von Systemen und Parameterextraktion 
Modeling of Systems and Parameter Extraction Working Group
--
Over two decades of Enabling Compact Modeling R&D Exchange

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http://www.mos-ak.org

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[mos-ak] SPICE Development Roadmap

The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, delivered its annual autumn compact modeling workshop on Sept. 20, 2013 as an integral part of the ESSDERC/ESSCIRC Conference in Bucharest (RO). The event received full sponsorship from leading industrial partners including Agilent Technologies, LFoundry and Microchip. More than 30 international academic researchers and modeling engineers attended two sessions to hear 12 technical compact modeling presentations and posters including the keynote by Larry Nagel.

The MOS-AK keynote speaker, Larry Nagel, delivered "SPICE in the Twenty-First Century" talk drawing a roadmap of future SPICE development directions. So how will SPICE evolve in the future?  [read more]

In the meantime please also visit <http://www.mos-ak.org/washington_dc_2013/> where we will continue the discussion of all compact/SPICE modeling topics.

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SISPAD 2014 1st Call for Papers

2014 International Conference on Simulation of Semiconductor Processes and Devices

September 9-11, 2014

Workshop, September 8

Mielparque Yokohama, Yokohama, Japan

The call for papers is also available on SISPAD2014 Web site. Deadline for submission of SISPAD abstracts: March 31, 2014


Any inquiries on submission should be sent to:

• Steering Chair:  Shinji Odanaka  (Osaka Univ)
• Conference Chair:  Nobuya Mori  (Osaka Univ)
• Program Chair:  Kenichiro Sonoda  (Renesas)
• Program Co-Chair:  Shigeyasu Uno  (Ritsumeikan Univ)

[read more...]

[mos-ak] [Final Program] 6th International MOS-AK/GSA Workshop Washington DC Dec.11, 2013

Final program of 6th International MOS-AK/GSA Workshop on Dec.11, 2013 in Washington DC is available online:

http://www.mos-ak.org/washington_dc_2013/

The program includes a freewheeling session organized to review modeling activities of the CMC, IEEE EDS CMTC, NEEDS NanoHub and MOS-AK Groups.

Event venue:

Embassy of Switzerland

2900 Cathedral Ave, NW,  

Washington, DC 20008 

USA 

Free On-line Workshop Registration is open, now.

Extended MOS-AK/GSA Committee:

• Wladek Grabinski, GMC Suisse; MOS-AK/GSA Group Manager
• Harrison Beasley, Technical WG Manager, GSA
  MOS-AK/GSA North America
• Chair: Pekka Ojala, Exar Corporation
• Co-Chair: Geoffrey Coram, Analog Devices
• Co-Chair: Prof. Jamal Deen, U.McMaster
• Co-Chair: Roberto Tinti, Agilent EEsof Division
  MOS-AK/GSA South America
• Chair: Prof. Gilson I Wirth; UFRGS; Brazil
• Co-Chair: Prof. Carlos Galup-Montor, UFSC; Brazil
• Co-Chair: Sergio Bampi, UFRGS, Brazil
• Co-Chair: Antonio Cerdeira Altuzarra, Cinvestav - IPN, Mexico
  MOS-AK/GSA Europe
• Chair: Ehrenfried Seebacher, AMS, Austria
  
• Co-Chair: Alexander Petr, XFab, Germany
  
• Co-Chair: Prof. Benjamin Iniguez, URV, Spain
  MOS-AK/GSA Asia/South Pacific
  
• Chair: Sadayuki Yoshitomi, Toshiba 
  
• Co-Chair: Xing Zhou, NTU Singapore    
  
• Co-Chair: A.B. Bhattacharyya, JIIT New Delhi

 

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2014 Workshop on Compact Modeling at techconnectworld.com

Abstracts due: December 13th, 2013

Synopsis: Compact Models (CMs) for circuit simulation have been at the heart of CAD tools for circuit design over the past decades, and are playing an ever increasingly important role in the nanometer system-on-chip (SOC) era. As the mainstream MOS technology is scaled into the nanometer regime, development of a truly physical and predictive compact model for circuit simulation that covers geometry, bias, temperature, DC, AC, RF, and noise characteristics becomes a major challenge.

Workshop on Compact Modeling (WCM) Is one of the first of its kind in bringing people in the CM field together. The objective of WCM is to create a truly open forum for discussion among experts in the field as well as feedback from technology developers, circuit designers, and CAD tool vendors. The topics cover all important aspects of compact model development and deployment, within the main theme - compact models for circuit simulation.

Symposium Chair: Professor Xing Zhou Nanyang Technological University, Singapore