Dec 8, 2020

Incize Newsletter (Q4-2020)


on research & development at Incize
 
Incize currently has 7 ongoing research projects. The research projects revolve around materials and innovative characterization techniques to serve the 5G technologies and beyond. Take a look at two projects: Porous Silicon and Contactless Measurements.

Porous Silicon

Pre-processed and Post-processed (Incize's solution) porous silicon integration. From research and development to prototyping, we customise it to fit your application needs. Check out our porous services here.

Contactless Measurements

Incize is working towards contactless measurements to enable quick characterization with a dedicated research project. After two years of R&D in Phase 1, Phase 2 has just kicked off with the funds of the Walloon Region and cooperation with the 'haute école de la province de Liège'.
Want to co-develop a R&D project? Our experts are here for you.
Contact us
Incize interview - SOI Industry Consortium

Interview with SOI Industry Consortium

5G is imminent. Incize researches new materials, and how to respond to new challenges in design and characterization for 5G communication systems/technologies, and beyond. 

Mostafa Emam, founder and CEO of Incize talks about how the company is getting ready for 5G in an interview for SOI Industry Consortium.
Read the article here.
Meet our new team member - Romain

Meet Romain


In October 2020, Romain Tuyaerts joined Incize as a senior engineer. Romain is now part of the process team, his current research interests include micro-fabrication techniques, and the integration of porous silicon in various applications such as RF microelectronics.
 

Romain received his master degree in physical engineering, with an orientation in nanotechnologies. 
He continued with a PhD in materials science at UCLouvain, obtained in 2018, focused on the coupling between micro-structure, mechanical, optical, and electrical properties of transparent conductive oxides deposited by reactive sputtering.
Visit Incize website, now
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[Reuters] Joined EU Forces to Invest in Processors and #semi Technologies

 


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December 08, 2020 at 10:58AM
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Dec 7, 2020

How hot is the #180nm node today?

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[C4P] FoodCAS 2021

Call for Papers
the FoodCAS 2021 conference
on May 27th 2021, in Daegu, Korea 

Main scope of FoodCAS Satellite Event @ISCAS 2021 is to bring together contributions about innovative CAS-based solutions for the Food Chain

For any information, please contact
  • danilo.demarchi@polito.it
  • victor.grimblatt@synopsys.com

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Dec 4, 2020

ePIXfab workshop: opportunities and challenges

ePIXfab workshop - Fabless start-ups developing PIC-based products: opportunities and challenges

Online at ECOC 2020
on December 6 at 1.30 PM (Central European Time)

Photonic Integrated Circuits (PICs) have stamped their presence in the optical transceiver market through the launch of various transceiver products by key players of that market. In the last few years, many fabless startups are leading an equally impressive entry of PICs into new markets to offer solutions for sensing, medical diagnostics, LiDAR, 5G, artificial intelligence, and many other applications. PIC technologies and associated services are gaining maturity at an unprecedented pace. This rapidly consolidating ecosystem can fulfill the demands of fabless companies operating in new markets. 

 

 

Aim of workshop
  • Present how various startups develop innovative products in various new markets based on PICs
  • Address outstanding challenges faced by fabless companies with respect to the capabilities of the PIC ecosystem

December

6

Sign up today. 
(Register via ECOC website and choose workshop 7)

 

Speakers

 

Keynote by
Andrew Rickman OBE
Chairman & CEO
Rockley Photonics
Timing: 1.45 PM to 2:15 PM (CET)
 

 

 

Invited talk
Mark Wade
President, CTO, & Co-Founder
Ayar Labs
Timing: 2:15 – 2:30 PM (CET)
 

 

 

Invited talk
Thijs Spuesens
CTO
Sentea Fiber Optic Sensing
Timining: 2.30 PM – 2:45 PM (CET)

 

 

Invited talk
Zhan Su
Team Leader
Lightelligence
Timing: 2:45 PM – 3:00 PM (CET)

 

 

Invited talk
Sven Otte
CEO
Sicoya
Timing: 3:30 PM – 3:45 PM (CET)

 

 

Invited talk
Steven Miller
CTO & Co-founder
Voyant Photonics
Timing: 3:45 PM – 4:00 PM (CET)

 

 

Invited talk
Shuren Hu
Principle Engineer
SiLC Technologies
Timing: 4:00 PM – 4:15 PM

 

 

Fee

 

  • ECOC Workshop only: 30 Euro
  • Other rates: check the ECOC website

 

 

Organized by

 

 

Copyright © 2020
ePIXfab - the European Silicon Photonics Alliance
All rights reserved.

Our mailing address is:
iGent Tower, Technologiepark-Zwijnaarde 126, 9052 Ghent (Belgium)

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You can update your preferences or unsubscribe from this list.

 

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Oak Ridge National Laboratory’s Summit System remains the world’s fastest supercomputer with an astonishing speed of 148.6 petaflops (one petaflop computer system can perform 1,000,000,000,000,000 floating-point operations per second) https://t.co/IXKaSvbaSc #semi https://t.co/h9vrh5yg0z


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Dec 3, 2020

[C4P] e-Engineering 2021 Conference


 
 
 
 
 
 
 

THE WORLD'S PREMIER FORUM DEDICATED TO PRESENTING AND DISCUSSING E-ENGINEERING COURSES e-ENGINEERING'2021 

INTERNATIONAL e-ENGINEERING EDUCATION SERVICES CONFERENCE

22 -23 JUNE, 2021 

WADI MUSA (PETRA), JORDAN 

(The conference may follow a hybrid or fully online model depending on the pandemic evolution) 

Conference website: https://e-engineering.org/ With the technical co-sponsorship support of the IEEE Education Society and the IEEE Jordan Section. 

KEY DATES:
  • Submission deadline: January 10, 2021
  • Notification of acceptance: March 1, 2021
  • Camera-ready manuscript: April 5, 2021

PAPER SUBMISSION: https://e-engineering.org/ 

The INTERNATIONAL e-ENGINEERING EDUCATION SERVICES CONFERENCE (e-ENGINEERING'2021) is the world's premier forum dedicated to presenting and discussing e-Engineering courses implementation. The goal is to exchange ideas and best practices in all aspects related to the set up of e-Engineering courses, with a focus on undergraduate and graduate courses as well as vocational and lifelong learning training. The conference seeks to disseminate the concept of e-Engineering, and the responses it brings to the continuous need for enlarging and improving engineering education in a rapidly changing world. e-ENGINEERING 2021 will take place in Wadi Musa, near the ancient archaeological site of Petra, Jordan, a UNESCO World Heritage Site, and it is organised by the Tafila Technical University (TTU). You are invited to participate and submit your contributions to e-ENGINEERING 2021. 

The areas of interest include (but are not limited to) the following e-Engineering topics:

** Implementation strategies
* Curriculum building
* Course organization
* Learning platforms
* Learning strategies
* Learning scenarios

** Pedagogical aspects
* Pedagogical innovations
* Gamification strategies
* e-Lecturing and e-Tutoring
* Students assessment and e-Rubric

** Remote experimentation
* Simulation tools
* Virtual laboratories
* Virtual instrumentation interfaces
* Remote laboratories
* Remote robotic laboratories
* Remote experiments interfaces
* Scheduling access to remote experiments
* Security issues

** Organizational aspects
* Teachers training
* Technicians training
* Financial models
* Teachers payment
* Quality assessment
* Accreditation processes
* Legal aspects 

** Course examples
* Successful implementations of e-Engineering courses

** Any other aspects related to e-Engineering courses

Publications: The official language of the Conference is English. 

All papers will be double-blind peer-reviewed by, at least, three reviewers based on full paper submission. e-ENGINEERING 2021 will produce formal electronic Proceedings, which will include all accepted scientific papers, with ISBN to be submitted to possible indexation in the IEEEXplore Digital Library and other bibliographical search engines. No show papers will be excluded from indexation. For inclusion in the formal Proceedings, papers accepted for oral presentation require a final 6 to 8 pages manuscript, while papers accepted for poster presentation require a final 2 to 4 pages manuscript. Best Paper Award: The e-ENGINEERING 2021 Best Paper Award will be announced during the closing session. 


For more information, please visit the conference website: https://e-engineering.org/ If you have any questions, do not hesitate to email conference@e-engineering.org
Program Chairs Manuel Gericota, IPP, Portugal Sammy Verslype, KU Leuven, Belgium
 
 
 
 

If you wish to unsubscribe from conference eNotices, please visit the IEEE Communications Preference and Policies page and uncheck the "Local IEEE Communications" box. 
 
 
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[EMPHASIS] Virtual Launch Event

Virtual Launch Event 
of EMPHASIS Research Centre
University of Cyprus

In case you missed any parts of the event, the recording can be found at the link below on our YouTube channel:

For more information, please reach out 
iezekiel@ucy.ac.cy  EMPHASIS Director 

Sincerely,
Chrysafis Andreou, PhD
Lecturer
Department of Electrical and Computer Engineering
Emphasis Research Centre
University of Cyprus

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[FOSDEM 2021] Open Source Computer Aided Design and Modeling devroom

We are pleased to announce the CfP for: 
Open Source Computer Aided Design and Modeling devroom 
at FOSDEM 2021, 
on Sunday, 7 February 2021 
FOSDEM website:
FOSDEM Code of Conduct:

We hope you'll join us for a full day of talks, demos and interesting discussions on designing, modeling and testing hardware using Open Source tools. This year's event will be fully virtual and will feature multiple channels for talks, Q&A as well as hallway discussions.

We welcome any talk proposals about the creation of physical objects.

Topics of interest include, but are not limited to:
- Open Hardware projects
- Circuit Design
    * Printed circuit board design tools
    * Circuit simulation
- 3d modeling and analysis
    * Solid modeling tools
    * Meshing, modeling and transforming physical representations
    * Finite element analysis
- 3d printing
    * 3d slicing tools
    * Motor control
- Machine design and integration
    * ECAD/MCAD integration
    * Thermal analysis
    * Wire modeling
- Physical Model Data storage
    * Data representation and optimization
    * Version control in hardware data storage
    * Collaborative and team-based hardware design techniques

Slots will be allocated for short (20 minutes) and long (40 minutes) talks. Speakers need to specify their preferred format. Both include time for questions and answers. Depending on the number of submissions, submitters may be asked to utilize an alternate time format.

The submission process
Please submit your proposals at
https://penta.fosdem.org/submission/FOSDEM21

If you already have a Pentabarf account (for example as a result of having submitted a proposal in the past), make sure you use it to log in and submit your proposal. Do not create a new account if you already have one.

Please include the following information with your submission:
- Abstract
- Preferred Session length
- Speaker bio
- Link to any hardware / code /slides for the talk

When you submit your proposal (creating an "Event" in Pentabarf), make sure you choose the "Open Source Computer Aided Modeling and Design" in the track drop-down menu. Otherwise, your proposal may go unnoticed. Fill in at least a title and abstract for the proposed talk and a suggested duration. Keep in mind that much of the value in these meetings comes from the discussions, so please allot at least 20% of the talk time for questions and answers.

Important dates
- Call for papers available: 2 December 2020
- Call for participation closes: 20 December 2020
- Devroom schedule available: 24 December 2020
- Talk recording uploads due: no later then 14 January 2020
- Devroom day: Sunday 7 February 2021 (09:00 to 17:00)
Recordings
Because this year's conference will be fully virtual, all talks must be pre-recorded.  These will be verified for sound and video quality prior to the conference.

Each accepted talk will have a dedicated chaperone to help you through the process of recording, encoding and uploading your talk.

The recordings will be published under the same license as all FOSDEM
content (CC-BY).
open-hardware-devroom mailing list
open-hardware-devroom@lists.fosdem.org
https://lists.fosdem.org/listinfo/open-hardware-devroom
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