Untether #AI #SDK Allows Bare-Metal #Programming https://t.co/bvY91RKIpi #semi https://t.co/9PjNvyah6G
— Wladek Grabinski (@wladek60) Jan 17, 2023
from Twitter https://twitter.com/wladek60
January 17, 2023 at 09:29PM
via IFTTT
Jan 17, 2023
Untether #AI #SDK Allows Bare-Metal #Programming
from Twitter https://twitter.com/wladek60
January 17, 2023 at 09:29PM
via IFTTT
UPCOMING – Winter School in III-Sb applications
UPCOMING
QUANTIMONY’s Winter School in III-Sb Applications: non-volatile Memories: a Modelling Perspective will take place from February 27th to March 3rd 2023 at the premises of the Technical University of Berlin.
The 5-day event will focus on the design and scalable production of a new III-Sb patented memory device (ULTRARAM TM). There will be a combination of specialised lectures by international experts, and hands-on tutorials/lab sessions as well as live demonstrations of the latest TCAD/EDA tools organised by the Technical University of Berlin.
The event will provide with an excellent opportunity for networking with leaders in the field.
List of Confirmed Speakers Invited Speakers and Hands - on Session:
- Prof. Dr. Manus Hayne, Lancaster University Birth of the ULTRARAM TM Concept
- Prof. Dr. Dieter Bimberg, Technische Universität Berlin Quantum Dot-Based Flash Memories: The Holy Grail at Sunrise?
- Dr. Petr Klenovský, Masaryk University, Brno Modeling Electronic states of IlI-Sb guantum systems on GaP substrate
- Dr. Wladek Grabinski, MOS-AK (EU) FOSS TCAD/EDA Tools for Compact Modeling
- Prof. Vihar Georgiev, James Watt School of Engineering, Glasgow Nano-electronic Simulation Software (NESS): a flexible nano-device simulation platform
- PD Dr. Uwe Bandelow, WIAS Berlin TBA
- Prof. Claudia Dr.axl, Humboldt Universität Berlin Unsupervised learning for insight into high-throughput calculations
- Rabea Pons, Comsol, Göttingen Introduction into COMSOL and hands-on session
- Prof. Dr. Mathieu Luisier, ETH Zürich TBA
- Dr. Marc Bescond, Faculté des Sciences de Saint Jérôme, NQS group, Marseille TBA
- Dr. Chetan Gupta, Micron Technology (R&D) Industry perspective on memory technologies
- Prof. Dr. Jannik Wolters, Deutschen Zentrum für Luft- und Raumfahrt / TU Berlin Quantum Memories and Introduction into Quantum Technologie
Jan 15, 2023
33rd IEEE MIEL 2023
We would like to inform you that 33rd IEEE International Conference on Microelectronics (MIEL 2023) will be held in Niš from October 16th-18th, 2023.
Accepted papers will be published in the Proceedings of the MIEL 2023 Conference, and included in IEEE Xplore database, subject to regular registration of at least one of the authors before August 31st, 2023.
We are pleased to invite you, as an expert in the field of microelectronics, to submit a paper to MIEL 2023 Conference and to encourage colleagues to do it. The deadline for the submission of two page-extended summaries (including figures, tables, and references) is April 28th, 2023.
We are pleased to invite you, as an expert in the field of microelectronics, to submit a paper to MIEL 2023 Conference and to encourage colleagues to do it. The deadline for the submission of two page-extended summaries (including figures, tables, and references) is April 28th, 2023.
Important Dates
Best regards,
Vojkan Davidović
Danijel Danković
http://miel.elfak.ni.ac.rs/
Please contact miel@elfak.ni.ac.rs for further information.
- December 31, 2022 First Announcement and Call for Papers
- April 28, 2023 Deadline for Receipt of Abstracts
- June 23, 2023 Notification on Acceptance of Papers
- August 31, 2023 Deadline for registration
- August 31, 2023 Deadline for Receipt of Papers
- September 22, 2023 Dispatch of Conference Programme
Best regards,
Vojkan Davidović
Danijel Danković
http://miel.elfak.ni.ac.rs/
Please contact miel@elfak.ni.ac.rs for further information.
Jan 14, 2023
#TSMC is mulling an automotive #semi #fab in #Europe https://t.co/TDeiZXztLu https://t.co/MQ3nH0XlOR
#TSMC is mulling an automotive #semi #fab in #Europe https://t.co/TDeiZXztLu https://t.co/MQ3nH0XlOR
— Wladek Grabinski (@wladek60) Jan 13, 2023
from Twitter https://twitter.com/wladek60
January 14, 2023 at 12:40AM
via IFTTT
Jan 12, 2023
[Paper] Time-Efficient Adaptive Procedure for Identification of Multitone X-Parameters
Konstanty Łukasik , Graduate Student Member, IEEE, Paweł Barmuta , Member, IEEE,
Troels S. Nielsen, Member, IEEE, Wojciech Wiatr , Life Member, IEEE,
and Dominique M. M.-P. Schreurs, Fellow, IEEE,
"Time-Efficient Adaptive Procedure for Identification of Multitone X-Parameters"
in IEEE Transactions on Instrumentation and Measurement,
vol. 72, pp. 1-9, 2023, Art no. 1000609,
DOI 10.1109/TIM.2022.3232171.
Abstract: A novel measurement procedure for the time-efficient identification of multitone X-parameters of active microwave devices and circuits is introduced. Over a given bandwidth, the procedure allows for an adaptive selection of key spectral components necessary for determining the X-parameters characteristics with a minimum measurement effort. The sequential selection is based on the divide-and-conquer algorithm. It results in a huge reduction of the measurement time in comparison to the situation when model coefficients at all spectral components are identified. To validate the procedure, an off-the-shelf broadband power amplifier (PA) was characterized under wideband large-signal excitation conditions. Moreover, small-signal terms at all relevant frequencies were collected as a reference and compared with the results provided by a time-efficient adaptive procedure (TEAP). The proposed method resulted in twenty times reduction in the number of samples required to characterize the PA. As an application example, the small-signal coefficients identified with the TEAP are used to correct characterization results for the measurement instrument’s output mismatch. The mismatch-corrected output signal of the PA under test was represented accurately with the error-vector-magnitude of only 0.132%.
FIG: Block diagram of the measurement setup used for performing experiments.
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