Sep 23, 2022

'Moore's Law Is Dead,' Says Nvidia CEO Says - Slashdot https://t.co/AJY0GBJOpv #semi https://t.co/QFRTwAud1D


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September 23, 2022 at 10:07PM
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Sep 21, 2022

Distinguished Lecturer Program on "FOSS TCAD/EDA Tools SPICE and Verilog-A Modeling Flow"

We are glad to inform you that the IEEE Student Branch MNIT Jaipur in association with IEEE EDS Student Branch Chapter MNIT Jaipur is organizing an invited talk on ''FOSS TCAD/EDA Tools SPICE and Verilog-A Modeling Flow''  by Dr Wladek Grabinski, R&D SPICE Manager, MOS-AK (EU)

There is no registration fee, however prior registration is required. This invited talk will be held in online mode.

E-certificate will be provided to all registered participants.

Title: ''FOSS TCAD/EDA Tools SPICE and Verilog-A Modeling Flow"

Abstract:Compact/SPICE models of circuit elements (passive, active, MEMS, RF, Microwave, Photonics) are essential to enable advanced IC design using nanoscaled semiconductor technologies. Compact/SPICE models are also a communication means between the semiconductor foundries and the IC design teams to share and exchange all engineering and design information. To explore all related interactions, we are discussing selected FOSS CAD tools along the complete technology/design tool chain from nanascaled technology processes; thru the compact modeling; to advanced IC transistor level design support. New technology and device development will be illustrated by application examples of the FOSS TCAD tools: Cogenda TCAD and DEVSIM. Compact modeling will be highlighted by review topics related to its parameter extraction and standardization of the experimental and measurement data exchange formats. Application and use of these tools for advanced IC design (e.g. analog/RF, Microwave, Photonics applications) directly depends on the quality of the compact model implementations in these tools as well as reliability of extracted models and generated libraries/PDKs. Discussing new model implementation into the FOSS CAD tools (Gnucap, Xyce, ngspice and Qucs as well as others) we will also address an open question of the compact/SPICE model Verilog-A standardization. We hope that this presentation will be useful to all the researchers and engineers actively involved in the developing compact/SPICE models as well as designing the integrated circuits in particular at the semiconductor device level and then trigger further discussion on the compact/SPICE model Verilog-A standardization and development supporting FOSS CAD tools.

Registration Link: 

https://forms.gle/xnkEo2i92UzdjK5PA

Joining Link:

http://meet.google.com/cpd-mopg-eea

Date: 22nd September 2022

Time: 03:00-04:00 PM IST

We are looking forward to active participation from your side.


Girdhar Gopal

Research Scholar, MNIT Jaipur

Chair, Student Branch Chapter 

MNIT, Jaipur

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Sep 20, 2022

[https://t.co/ESTgq7BilY] Automated SoC, Mixed-Signal Design using OpenROAD and OpenFASoC #RTL #GDSII #OpenSource #semi https://t.co/F1wjbbSWnO


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September 20, 2022 at 02:59PM
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Sep 19, 2022

Fwd: Call for Papers: ICAEEET-2022

 CALL FOR PAPERS

 International  Conference  on  Advancement  in Electrical & Electronics Engineering and Technology (ICAEEET-2022)

Mode of Conference - Online

November 10-11, 2022

Bansal Institute of Engineering and Technology

Lucknow, Uttar Pradesh, India

Technically Associated With
IEEE UP Section



Greetings from Bansal IET, Lucknow.

It is a matter of immense pleasure to inform you that the Department of Electrical Engineering, Bansal Institute of Engineering and Technology, Lucknow is going to organize the International  Conference  on Advancement  in Electrical & Electronics Engineering and Technology (ICAEEET-2022) during November 10-11, 2022. International  Conference  on  Advancement  in Electrical & Electronics Engineering and Technology (ICAEEET) focused  on  advancement in electrical and electronics engineering and interdisciplinary research in  computer,  instrumentation,  automation,  and communication engineering.  ICAEEET aims to bring together researchers, scientists, engineers, scholars and students to exchange and share their experiences, new ideas,  and  research  results.  This  conference  is  about various  aspects  of  engineering,  discussion  on  the practical  challenges  encountered  and  the  solutions adopted.  Expert  talks  are  planned  for  exchange  of ideas and sharing expertise. The conference serves to be a better  platform  to  enrich  research  activities.

The conference website is available at: https://icaeeet.wordpress.com/

We request you to please submit your work and kindly encourage your colleagues, research scholars and students to share their research papers at ICAEEET-2022.

The deadline for paper submission is September 27, 2022 .

Submission portal: https://easychair.org/conferences/?conf=icaeeet2022

We look forward to your participation and support.

 

-- With regards -- ICAEEET-2022 Organizing Committee


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Sep 15, 2022

Micro-Transfer-Printing to be held in Erfurt, Germany, on November 21 & 22, 2022. Register today at: https://t.co/5Dq6B2ZUk6 #semi #microtransferprinting #3Dintegration #heterogenousintegration #advancedpackaging #Erfurt https://t.co/UqTwBCdAnj


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September 15, 2022 at 08:47AM
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