Grenoble, April 9th, 2020
Dear TPC members of ESSCIRC-ESSDERC conference,
First of all, we truly hope this email finds you in good health, together with family and friends!
Together with our sponsoring IEEE Societies, SSCS and EDS, ESSCIRC-ESSDERC is closely monitoring developments related to the rapidly evolving COVID-19 pandemic. The health and safety of our members is the number one priority of our societies. As of today April the 9th, 2020, more than one third of the Global population is under severe confinement, as a result of the protective public health measures imposed by the different governments, states or provinces. The situation is still evolving rapidly and dramatically, unfortunately in an unpredictable way.
Given this uncertain situation, we, the organizing committee of ESSxxRC2020 Grenoble and the ESSCIRC-ESSDERC Steering committee, have decided to propose a new format for our conference:
From a practical point of view:
For all the authors who have been or were about to prepare papers for this version of ESSCIRC-ESSDERC, we strongly encourage you to submit your publications directly to the following IEEE journals:
- For ESSCIRC, please see https://sscs.ieee.org/publications:
- IEEE SSC-L, Solid-State Circuits Letters (same 4-pages format as ESSCIRC)
- The SSCS has just created a Special Section on ESSCIRC 2020, inside the SSC-Letters: https://mc.manuscriptcentral.com/ssc-l
- When submitting their manuscript, authors need to select: Special Section on ESSCIRC 2020. It is open for submissions from April 9, 2020 to May 4, 2020.
- The authors having accepted papers through this path will be kindly invited in September 2021 to present this same work in a Special Oral Session of ESSCIRC2021.
- IEEE JSSC, Journal of Solid-State Circuits
- IEEE O-JSSC, Open-Journal of Solid-State Circuits (open access)
- For ESSDERC, please see https://eds.ieee.org/publications :
- IEEE EDL, Electron Devices Letters (same 4-pages format as ESSDERC)
- IEEE TED, Transactions on Electron Devices
- IEEE JEDS, Journal of Electron Devices Society (open access)
- We are actively working with EDS to propose a similar Special Section for ESSDERC together with ED-L.
In 2021, we are planning to resume to a usual conference development schedule with tentative dates of:
- paper submission deadline on April 19th, 2021,
- the conference in Grenoble, September 6-9, 2021.
All the topology of the conference with regards to the different tracks and TPC members stays exactly the same for 2021. You might as well be solicited by the different IEEE journals for anonymous reviews, please do provide all your support, as they will get a much larger volume of publications than regular.
The 2022 version of ESSCIRC-ESSDERC will take place in September 2022 in Milano. We thank very much to Andrea Baschirotto&team for their immediate proactivity, flexibility and cooperation.
This information shall be posted as well on our website within the hour, and we will massively announce it also on social media. Please do not hesitate to spread this information to your personal network.
Thank you very much for your continued trust, and stay safe!
Kind regards,
Andreia Cathelin, TPC chair ESSCIRC
Francois Andrieu, TPC chair ESSDERC
Sylvain Clerc, TPC co-chair ESSCIRC
Maud Vinet, TPC co-chair ESSDERC
Thomas Ernst, Conference Chair
Dominique Thomas, Conference Co-Chair
Qiuting Huang, ESSCIRC-ESSDERC Steering Committee Chair
Andreia Cathelin | Tel: +33 476926603 | Mobile: +33 607649918
Technology & Design Platform | Strategy & Innovation/Ecosystem | Technology R&D Fellow
STMicroelectronics Crolles2
850 rue Jean Monnet | 38926 Crolles Cedex | France
Knowledge is proud that he has learned so much,
Wisdom is humble that he knows no more.
The Task, Book 6, 'The Winter Walk at Noon' (published 1785). William Cowper