Oct 3, 2019

IEEE EDS Distinguished Lecturer by ED Poland Chapter

IEEE EDS Distinguished Lecturer by ED Poland Chapter
Krzysztof Górecki and Daniel Tomaszewski

EDS Distinguished Lecturer, Professor Mansun Chan (UST, Hong Kong) gave a talk titled “Simulation and Modeling of Dynamic Systems with Time Varying Device Characteristic” on May 21, 2019, at Łukasiewicz Research Network—Institute of Electron Technology (Łukasiewicz ITE), Warsaw, Poland. Approximately 15 persons from ITE and from abroad, traveled to Warsaw for the ESSDERC paper selection meeting and to attend the lecture.

The abstract of the Distinguished Lecture: The existing circuit simulation methodologies are based on time-invariant device models, electrical characteristics and parameters of which do not change over time. However, more recently, many new applications such as neuromorphic computing or artificial neural-network circuits require the use of devices with history dependent behavior. Due to such a behavior different from traditional transistors, which are the focus for the compact modeling community, a new approach to monitor the time dependent characteristics of these devices is necessary. In addition, a new simulation methodology is also required to predict the behavior of such system efficiently. In the presentation, a new approach to simulate dynamic systems was introduced. The proposed approach combined with the modification of simulation flow and compact model construction was introduced. The approach is very general and can be used to cover a wide class of devices with dynamic behavior such as memory function or device performance degradation during a prolonged operation.

A Mini-Colloquium was organized by the ED Poland Chapter in cooperation with: Gdynia Maritime University, Gdynia, Poland, Łukasiewicz Research Network—Instytut Technologii Elektronowej (Łukasiewicz-ITE), Warsaw, Poland, and a Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland. Approximately 20 persons attended the full-day event. Nine interesting talks were presented by internationally recognized experts in the area of nanoelectronics, including three EDS Distinguished Lecturers (DLs).

Prof. Shinichi Takagi (The University of Tokyo) presented a talk “Tunneling FET technology for ultra-low power logic applications” addressing critical issues, technical challenges and viable technologies of TFETs using a variety of semiconductors such as Si, Ge and oxide semiconductors. Device engineering indispensable in improving the performance of TFETs were summarized with emphasis on the source junction formation technology and the optimal material design. The electrical characteristics of TFETs using Si and Ge homo junctions, Ge/strained SOI hetero-junctions and ZnO/(Si, Ge) hetero-junctions were presented as the viable examples.

Prof. Andrzej Strójwąs (PDF Solutions, and Carnegie Mellon University) had a talk “New Product Introduction Challenges in the Bleeding Edge Technology Nodes,” presenting a comprehensive methodology and a full suite of process-design design interaction characterization techniques to enable cost-effective introduction of new products in the 7 nm and below technologies.

Dr. Arkadiusz Malinowski (GlobalFoundries) gave a talk “Will FinFET era last only for 10 years? FinFET scaling challenges for next CMOS technology nodes,” in which challenges related to FinFET metrology/inspection, lithography/overlay, integration/variability, cycle time and cost were addressed.

Dr. Rajiv V. Joshi (DL, IBM Research Division Yorktown Heights) presented a lecture “Variability aware design in nm era.” He highlighted predictive analytical technique based on statistical analysis methodology targeting both memory and custom logic design applications is highlighted. Design case studies both in planar and non-planar technologies were discussed. Finally, the speaker discussed an efficient statistical methodology based on simulation and modeling to evaluate and minimize the aging of memory chips.

Prof. Henryk M. Przewłocki (DL, Łukasiewicz Research Network—ITE Warsaw) presented a talk “Expanding the horizon of photoelectric investigations of the MIS system properties,” in which he discussed an extended theory of the photocurrent vs. gate voltage characteristics, at different wavelengths of light illuminating the structure under test, with diffusion currents taken into account. The theory is in agreement with the relevant experimental characteristics. This opens the possibilities of developing new measurement methods of the MIS system crucial parameters.

Prof. Marcelo Pavanello (DL, Centro Universitario FEI) presented a talk “Performance and modeling of Nanowire-based MOSFETs.” He discussed differences between double-gate, triple-gate and nanowire-based MOSFETs and their characteristics. Also junctionless nanowire transistors (JNTs) were introduced as one of the interesting alternatives for downscaling because of their relative process simplicity compared with inversion-mode nanowires. Different aspects of modeling of the JNT steady-state and dynamic operation was interestingly presented.

Dr. Farzan Jazaeri (EPFL) presented a talk “Cryogenic Electronics and Quantum Computing Architecture.” He made an interesting review of topics of a quantum computation that holds the promise to solve problems that are intractable even for the most powerful supercomputers. Quantum computers process the information stored in quantum bits (qubits). The information in the qubits is fragile, so the qubits must be typically cooled to cryogenic temperature. Spin qubits in silicon were reported that have already been proposed and experimentally demonstrated in academic research laboratories.

Prof. Mike Brinson (London Metropolitan University) presented a talk “Equation-Defined template and synthesis driven compact modelling of semiconductor devices.” He reported current research that links Equation-Defined Device modelling with Verilog-A modules, driven by code templates and synthesis, which in turn result in an improved interactive modelling techniques. Throughout the talk a series of compact device models were introduced to demonstrate the fundamentals and application of the new approach to compact device modelling.

Dr. Władek Grabiński (DL, MOS-AK and GMC) presented a talk “FOSS tools for support of IC modeling and design with special emphasis on Verilog-A standardization.” He discussed selected FOSS CAD tools along complete technology/design tool chain from nanoscaled technology processes. The talk was illustrated by application examples of the FOSS TCAD tools, like Cogenda TCAD and DEVSIM. Compact modeling was related to the parameter extraction and standardization of the experimental and measurement data exchange formats. Finally, present FOSS CAD simulation and design tools: ngspice, Qucs, GnuCap, Xyce were presented.

~ Marcin Janicki, Editor

[IEEE EDS Update] MIXDES 2019, Rzeszów (PL)

26th International Conference “Mixed Design of Integrated Circuits and Systems"'
MIXDES 2019 
By Marcin Janicki

On June 27–29, 2019, Rzeszów, Poland, the International Conference MIXDES 2019 took place. The event was organized by the Lodz University of Technology together with the Warsaw University of Technology. The conference was co-sponsored by Poland Section IEEE ED & CAS Societies, Polish Academy of Sciences (Section of Microelectronics and Electron Technology), and Commission of Electronics and Photonics of Polish National Committee of International Union of Radio Science—URSI. The 3-day conference program included 97 presentations from 28 countries. The following six general invited talks were presented during the conference plenary sessions:
  • Advanced MOS Device Technology for Low Power Logic LSI Shinichi Takagi (The University of Tokyo, Japan)
  • Quantum Bits and Quantum Computing Architecture Farzan Jazaeri (EPFL, Switzerland)
  • Towards Energy-Autonomous Integrated Systems Through Ultra-low Voltage Analog IC Design Viera Stopjaková (Slovak University of Technology in Bratislava, Slovakia)
  • THz Technologies and Applications Thomas Skotnicki (Institute of High Pressure Physics PAS, Poland)
  • What is Killing Moore’s Law? Challenges in Advanced FinFET Technology Integration Arkadiusz Malinowski (GLOBALFOUNDRIES, USA)
  • Yield and Reliability Challenges at 7nm and Below Andrzej Strojwąs (Carnegie Mellon University, USA)
The sessions also included presentations in the frame of four special sessions:
  • Compact Modeling for Nanoelectronics organized by D. Tomaszewski (Institute of Electron Technology, Poland) and W. Grabiński (GMC, Switzerland)
  • Intelligent Distributed Systems organized by M. Drozd (LTC Sp. z o.o., Poland), R. Sztoch, P. Sztoch (FINN Sp. z o.o., Poland), B. Sakowicz and D. Makowski (Lodz University of Technology, Poland)
  • Large Scale Research Facilities organized by A. Napieralski, W. Cichalewski (Lodz University of Technology, Poland)
  • Thermonuclear Fusion Projects organized by S. Simrock (ITER, France), D. Makowski (Lodz University of Technology, Poland), D. Bocian and M. Scholz (Institute of Nuclear Physics, Poland
The next MIXDES 2020 Conference will take place in Wrocław, Poland. The Preliminary Call for Papers is available at http://www.mixdes.org/downloads/call2020.pdf. More information about the past and next MIXDES Conferences can be found at http://www.mixdes.org.
Edited by Mariusz Orlikowski
MIXDES 2019 Conference Secretary

[paper] Gallium Nitride FET Model

Gallium Nitride FET Model
V V Orlov, G I Zebrev
National Research Nuclear University MEPHI, Moscow, Russia
E-mail: gizebrev@mephi.ru

Abstract: We have presented an analytical physics-based compact model of GaN power FET, which can accurately describe the I-V characteristics in all operation modes. The model considers the source-drain resistance, different interface trap densities and self-heating effects. (read more 
https://arxiv.org/ftp/arxiv/papers/1909/1909.05702.pdf)

Introduction: Gallium nitride (GaN) high electron mobility transistor (HEMT) technology has many advantages, that make it a promising candidate for high-speed power electronics. It allows high-power operation at much higher frequencies than silicon laterally diffused metal-oxide-semiconductor field-effect transistors (LDMOSFETs), currently a staple for the cellular base station industry [1]. The high breakdown voltage capability (over 100 V), high electron mobility, and high-temperature performance of GaN HEMTs are the main factors for its use in power electronics applications. Circuits design in both application regimes requires the accurate compact device models that can describe the non-linear I-V characteristics. The current state-of-the-art GaN power transistor circuit models are mostly empirical in nature and contain a large number of fitting parameters. The source-drain series resistance and self-heating make the compact modeling difficult [2]. Currently available models are not enough accurate to describe the I-V characteristics of power GaN HEMTs in all operation modes. This means, that we need a compact physics-based analytical model based on the physical description of the device. In this paper, we present a physics-based GaN power transistor model based on generic approach The paper contains 3 parts. In the first part, we will give a concise description of the model. The specific power HEMT’s effects, such as series resistance and self-heating will be discussed in the second and third parts 

[paper] Prediction of DC-AC Converter Efficiency Degradation

Kenshiro Sato, Dondee Navarro, Shinya Sekizaki, Yoshifumi Zoka, Naoto Yorino,
Hans Jürgen Mattausch, Mitiko Miura-Mattausch, 
Prediction of DC-AC Converter Efficiency Degradation due to Device Aging
Using a Compact MOSFET-Aging Model
IEICE Transactions on Electronics
論文ID 2019ECP5010, [早期公開] 公開日 2019/09/02

Online ISSN 1745-1353, Print ISSN 0916-8524, https://doi.org/10.1587/transele.2019ECP5010,
https://www.jstage.jst.go.jp/article/transele/advpub/0/advpub_2019ECP5010/_article/-char/ja,

Abstract: The degradation of a SiC-MOSFET-based DC-AC converter-circuit efficiency due to aging of the electrically active devices is investigated. The newly developed compact aging model HiSIM_HSiC for high-voltage SiC-MOSFETs is used in the investigation. The model considers explicitly the carrier-trap-density increase in the solution of the Poisson equation. Measured converter characteristics during a 3-phase line-to-ground (3LG) fault is correctly reproduced by the model. It is verified that the MOSFETs experience additional stress due to the high biases occurring during the fault event, which translates to severe MOSFET aging. Simulation results predict a 0.5% reduction of converter efficiency due to a single 70ms-3LG, which is equivalent to a year of operation under normal conditions, where no additional stress is applied. With the developed compact model, prediction of the efficiency degradation of the converter circuit under prolonged stress, for which measurements are difficult to obtain and typically not available, is also feasible.

Oct 2, 2019

Ph D scholarship about semiconductor device modeling in Tarragona (Spain)

We want to get one scholarship for a Ph D student position in the Department of Electronic Engineering in the Department of Electronic Engineering in the Universitat Rovira i Virgili (URV), in Tarragona , Spain. The subject of the Ph D would be o the development of new techniques of characterization and modeling of nanoscale semiconductor devices, in particular two-dimensional semiconductor devices, (which are one of the most promising device structures for downscaling to 1nm), in particular transistors or memristors. It will be related to funding research projects in which the hosting group participates.

The duration of the grant will be 3 years.

The candidate should have a  Master degree in Electrical Engineering, Electronic Engineering, Telecommunication Engineering or Physics, obtained between January 1 2020 and October  2022. A good background in Semiconductor Physics, Semiconductor Devices, or Integrated Circuit Design will be highly appreciated.

Applicants must send to my e-mail address (benjamin.iniguez@urv.cat), and by November 9 2022, a CV together witha copy of the academic certificates indicating the grades obtained for all subjects during their studies (both Bachelor Degree and Master Degree).

Tarragona is a medium city (100000 inhabitants) with a pleasant Mediterranean climate and many recreation opportunities (nice beaches, theme parks, nature preserves, mountain hiking, touristic resorts and facilities). It is located 100 km Southwest of Barcelona, and it is very well connected by train, bus, highways and even low cost flights from its own airport.

My research group in the Department of Electronic Engineering, Universitat Rovira i Virgili (URV) is one of the strongest groups in compact modeling in Europe. We have led or are leading several national and European projects targeting semiconductor device characterization, physics and modeling.