[1st Day Photos] 13th International MOS-AK Workshop

13th International MOS-AK Workshop was organized jointly with THM Giessen who has provided ZOOM meeting platform for the online event. More than 50 registered participants have attended two MOS-AK sessions and followed 7 technical talk during its first day.

MOS-AK session I - 11:00 - 14:00 (PST) on Dec.10, 2020
Chair: Laurie E. Calvet; CNRS-University Paris-Saclay (F)

[1] Material Growth, Characterization of III-V & II-VI Compound Semiconductors and its Use for Various Device Applications

Saxena Praveen Kumar

Tech Next Lab Pvt Ltd (IN)

[2] Contact-controlled transistors: Device characteristics and modelling challenges

Radu Sporea

Uni. Surrey (UK)

[3] Contact-controlled transistors: Specific applications and opportunities

Eva Bestelink

Uni. Surrey (UK)

MOS-AK session II
Chair: Larry Nagel; Omega Enterprises Consulting (USA)

[4] 90 Years of Twoport Matrices and its Impact on Device Measurements and Modeling

Franz Sischka

SisConsult Engineering Office (D)

[5] Some issues on the high-frequency compact modeling of CMOS transistors and related devices

Roberto Murphy

INAOE (MX)

[6] VAMPyRE: Verilog-A Model Pythonic Rule Enforcer

Geoffrey Coram

Analog Devices, Inc. (USA)

[7] Simulate 40X Faster with SmartSpice HPP

Jody Matos

Silvaco (USA)

MOS-AK attendees group photo of 1st MOS-AK workshop day:

MOS-AK attendees group photo (1)

MOS-AK attendees group photo (2)

IEEE Connecting Experts

Dear IEEE Young Professionals,
as part of our IEEE Connecting Experts program, together with IEEE Croatia Section, we are bringing you a panel about design thinking in STEM area and project-based education through interdisciplinary teams, going beyond engineering, to prepare students for the marketplace. The technical talk entitled "Interdisciplinary Project-based Learning" is organized in collaboration with IEEE Croatia Section and is starting tomorrow, December 11 at 15:10 UTC.

MS Teams details
You can join the session here.

About the topic
In this interactive session, the development, design, and implementation of an interdisciplinary project-based learning approach at the WSU will be presented and discussed by the team who designed it and tested its performance. The project called SOAR (STEM-Oriented Alliance for Research) offers a transformative educational experience to students, merging coursework across three different academic disciplines. Science, Technology, Engineering, and Math (STEM) education has been challenged by industries to incorporate business and communication experiences (and vice versa) that prepare students for the workplace. Incorporating interdisciplinary project-based coursework provides experiential learning for students, a skillset that employers indicate as desirable.
The data obtained during the work on the SOAR project suggest that the collaboration in interdisciplinary project-based learning does initially produce disorientation, some trepidation, and confusion. However, ultimately these disorienting dilemmas lead to transformative learning, increased confidence, and cohesion among disciplines. The results of this paper will inform and guide engineering educators in creating interdisciplinary project-based coursework that meets the growing demands of the workplace of today and the future.
To engage in the interactive part of the session, you will need the link: www.pollev.com/jmurray180
All this project, and this Workshop, really is about is how to make students engage their full creativity potentials and make learning more interesting and, ultimately, useful and applicable in the fast-changing economy and society. 

About the speakers

It is our pleasure to host a wonderful team of professors from the Washington State University, Everett:

• Prof. Lucrezia Cuen Paxson, Clinical Assistant Professor, Edward E. Murrow College of Communication,
• Dr. Mark Beattie, Associate Vice Chancellor for Academic Affairs and Clinical Assistant Professor in the School of Hospitality Business Management,
• Dr. Jacob Murray, Clinical Assistant Professor and Program Coordinator for the School of Electrical Engineering and Computer Science,
• Dr. Soobin Seo, Assistant Professor of hospitality business management at the WSU Everett.

LinkedIn links: Lucrezia Cuen Paxson, Jacob Murray, Soobin Seo, Mark Beattie

You can check our real-time schedule of talks in the IEEE Connecting Experts Calendar and follow us and our live streams on our Facebook page or YouTube channel.  

Kind regards,

Dubravko Sabolic - IEEE Croatia Section

Vinko Lesic - IEEE Region 8 Young Professionals

[Foreword] Special Issue on Compact Modeling of Semiconductor Devices

Foreword

Special Issue on Compact Modeling of Semiconductor Devices

DOI: 10.1109/JEDS.2020.3039023

THIS Special Issue is dedicated to recent research in the field of compact modeling of semiconductor devices. This is the first J-EDS Special Issue on compact modeling. In the last years, a number of new semiconductor device structures, for electronic and photonic applications, have been developed. Compact models are needed for the incorporation of these new devices in integrated circuits. Therefore, a Special Issue was needed to present recent compact modeling solutions for semiconductor devices

A total of 8 regular papers and 2 invited papers have been accepted in this Special Issue. All papers, including the invited ones, were subjected to a thorough peer reviewing. A high number of reviewers participated in this process. This has resulted in a Special Issue containing very high-quality papers.  The published papers target compact modeling aspects for a wide number of devices, such as SiGe HBTs, IGBTs, SiC SB diodes, LDMOSFETs, Multi-Gate MOSFETs, RRAMs, TFET SRAMs, and organic TFTs. Open source Verilog-A compil- ing is also targeted by one paper. Different operation regimes and conditions are addressed: charging/discharging, THz, high power, tunneling radiation environments, . . . 

One invited paper, by U. Sharma and S. Mahapatra, addresses the modeling of HCD Kinetics for full VG/VD span under different experimental conditions across architectures and its SPICE implementation The other invited paper, by Fregonese et al., presents a review of THz characterization and modeling of SiGE HBTs.

I [BJ] would like to thank the work done by the rest of the Editors of this Special Issue and also by all the reviewers who participated in this process. And of course, I want to thank all the authors for their interest in submitting papers to this Special Issue. Thanks to authors, reviewers, and editors, this high-quality Special Issue has been possible.

BENJAMIN IÑIGUEZ, Guest Editor-in-Chief Department of Electronic, Electrical and Automatic Control Engineering University Rovira i Virgili 43007 Catalonia, Spain YOGESH SINGH CHAUHAN, Guest Associate Editor Department of Electrical Engineering Indian Institute of Technology Kanpur Kanpur 208016, India SLOBODAN MIJALKOVIC, Guest Associate Editor Simulation Group EDA Division Silvaco Europe Ltd. Cambridgeshire PE27 5JL, U.K. KEJUN XIA, Guest Associate Editor Department of Front End Innovation NXP Semiconductors Chandler, AZ 85224 USA

JUNG-SUK GOO, Guest Associate Editor Department of Compact Model Development GLOBALFOUNDRIES Inc. Santa Clara, CA 95054 USA MARCELO PAVANELLO, Guest Associate Editor Department of Electrical Engineering Centro Universitario FEI 09850-901 São Bernardo do Campo, Brazil MAREK MIERZWINSKI, Guest Associate Editor Department of PathWave Software and Solutions Keysight Technologies Santa Rosa, CA 95403 USA (e-mail: ) WLADEK GRABINSKI, Guest Associate Editor Department of Research and Development Modelling GMC Consulting 1291 Commugny, Switzerland

James D. Meindl, master of integrated circuits, dies at 87

Meindl was a visionary engineer who saw the potential of integrated circuits and was an early proponent of an interdisciplinary approach to engineering research [read more by Andrew Myers]

In 1984, electrical engineering professors James D. Meindl (right) and John Hennessy (center) brainstorm with research engineer John Shott about the MIPS project, which simplified computers with RISC architecture. (Image credit: Chuck Painter / Stanford News Service)

Solid-State Electronics Editorial Board

Solid-State Electronics Editorial Board

DOI: 10.1016/S0038-1101(20)30401-9

FOUNDING EDITOR

Dr W. Crawford Dunlap

EDITORS

Enrique Calleja

Dept. of Electronic Engineering (ISOM), 

ETSI Telecommunication,

Universidad Politécnica de Madrid 

(UPM), 28040 Madrid, Spain

Sorin Cristoloveanu 

Grenoble INP, Ref: LPCS-SSE, 46 av. Felix Viallet, 

F-38031 Grenoble Cedex 1, France

Kuniyuki Kakushima

Tokyo Institute of Technology, Midori-ku, Yokohama, Japan

Alexander Zaslavsky

Solid State Electronics, Brown University Engineering, 

182 Hope Street, Providence, RI 02912, USA

EDITORIAL ADVISORY BOARD

• G. Baccarani, Bologna, Italy
• J. Chennupati, Australian National University, Canberra, Australia 
• L. Colombo, Dallas, TX, USA
• G. Ghibaudo, Grenoble, France
• S. Hall, Liverpool, UK
• T. Hashizume, Saitama, Japan
• R. Huang, Peking University, Beijing, China
• S. Hwang, Yongin-si, Gyeonggi-do, South Korea
• S. Keller, Santa Barbara, CA, USA
• J.-H. Lee, Gwanag-Gu, Seoul, South Korea
• C. McAndrew, Tempe, AZ, USA
• J.-M. Sallese, EPFL, Switzerland
• J. Schmitz, Enschede, Netherlands
• A. Seabaugh, Notre Dame, IN, USA
• M. S. Shur, Troy, NY, USA
• A. Waag, Braunschweig, Germany
• H. Wong, City University of Hong Kong, Kowloon, Hong Kong

Incize Newsletter (Q4-2020)

on research & development at Incize   Incize currently has 7 ongoing research projects. The research projects revolve around materials and innovative characterization techniques to serve the 5G technologies and beyond. Take a look at two projects: Porous Silicon and Contactless Measurements. Porous Silicon Pre-processed and Post-processed (Incize's solution) porous silicon integration. From research and development to prototyping, we customise it to fit your application needs. Check out our porous services here. Contactless Measurements Incize is working towards contactless measurements to enable quick characterization with a dedicated research project. After two years of R&D in Phase 1, Phase 2 has just kicked off with the funds of the Walloon Region and cooperation with the 'haute école de la province de Liège'. Want to co-develop a R&D project? Our experts are here for you. Contact us Incize interview - SOI Industry Consortium Interview with SOI Industry Consortium 5G is imminent. Incize researches new materials, and how to respond to new challenges in design and characterization for 5G communication systems/technologies, and beyond.  Mostafa Emam, founder and CEO of Incize talks about how the company is getting ready for 5G in an interview for SOI Industry Consortium. Read the article here. Meet our new team member - Romain Meet Romain In October 2020, Romain Tuyaerts joined Incize as a senior engineer. Romain is now part of the process team, his current research interests include micro-fabrication techniques, and the integration of porous silicon in various applications such as RF microelectronics.   Romain received his master degree in physical engineering, with an orientation in nanotechnologies.  He continued with a PhD in materials science at UCLouvain, obtained in 2018, focused on the coupling between micro-structure, mechanical, optical, and electrical properties of transparent conductive oxides deposited by reactive sputtering. Visit Incize website, now

[Reuters] Joined EU Forces to Invest in Processors and #semi Technologies

[Reuters] Germany, France, Spain and ten other #EU countries have joined forces to invest in processors and #semi technologies, key to internet-connected devices and data processing, in a push to catch up with the United States and Asia. The signatories include Belgium, Croatia, Estonia, Finland, Greece, Italy, Malta, the Netherlands, Portugal and Slovenia. 

 

https://t.co/5eQORq9B8B pic.twitter.com/Ttro1mNKea

— Wladek Grabinski (@wladek60) December 8, 2020

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from Twitter https://twitter.com/wladek60

December 08, 2020 at 10:58AM
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How hot is the #180nm node today?

How hot is the #180nm node today? https://t.co/tZMSU0L4kf #semi pic.twitter.com/72NoDFodx4

— Wladek Grabinski (@wladek60) December 7, 2020

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from Twitter https://twitter.com/wladek60

December 07, 2020 at 10:09AM
via IFTTT

[C4P] FoodCAS 2021

Call for Papers

the FoodCAS 2021 conference

on May 27th 2021, in Daegu, Korea 

Main scope of FoodCAS Satellite Event @ISCAS 2021 is to bring together contributions about innovative CAS-based solutions for the Food Chain

For any information, please contact

• danilo.demarchi@polito.it
• victor.grimblatt@synopsys.com

ePIXfab workshop: opportunities and challenges

ePIXfab workshop - Fabless start-ups developing PIC-based products: opportunities and challenges Online at ECOC 2020 on December 6 at 1.30 PM (Central European Time) Photonic Integrated Circuits (PICs) have stamped their presence in the optical transceiver market through the launch of various transceiver products by key players of that market. In the last few years, many fabless startups are leading an equally impressive entry of PICs into new markets to offer solutions for sensing, medical diagnostics, LiDAR, 5G, artificial intelligence, and many other applications. PIC technologies and associated services are gaining maturity at an unprecedented pace. This rapidly consolidating ecosystem can fulfill the demands of fabless companies operating in new markets.      Aim of workshop Present how various startups develop innovative products in various new markets based on PICs Address outstanding challenges faced by fabless companies with respect to the capabilities of the PIC ecosystem December 6 Sign up today.  (Register via ECOC website and choose workshop 7)   REGISTER Speakers   Keynote by Andrew Rickman OBE Chairman & CEO Rockley Photonics Timing: 1.45 PM to 2:15 PM (CET)       Invited talk Mark Wade President, CTO, & Co-Founder Ayar Labs Timing: 2:15 – 2:30 PM (CET)       Invited talk Thijs Spuesens CTO Sentea Fiber Optic Sensing Timining: 2.30 PM – 2:45 PM (CET)     Invited talk Zhan Su Team Leader Lightelligence Timing: 2:45 PM – 3:00 PM (CET)     Invited talk Sven Otte CEO Sicoya Timing: 3:30 PM – 3:45 PM (CET)     Invited talk Steven Miller CTO & Co-founder Voyant Photonics Timing: 3:45 PM – 4:00 PM (CET)     Invited talk Shuren Hu Principle Engineer SiLC Technologies Timing: 4:00 PM – 4:15 PM     Fee   ECOC Workshop only: 30 Euro Other rates: check the ECOC website     Organized by     Twitter LinkedIn VISIT OUR PAGE Copyright © 2020 ePIXfab - the European Silicon Photonics Alliance All rights reserved. Our mailing address is: iGent Tower, Technologiepark-Zwijnaarde 126, 9052 Ghent (Belgium) Want to change how you receive these emails? You can update your preferences or unsubscribe from this list.

 

Oak Ridge National Laboratory’s Summit System remains the world’s fastest supercomputer with an astonishing speed of 148.6 petaflops (one petaflop computer system can perform 1,000,000,000,000,000 floating-point operations per second) https://t.co/IXKaSvbaSc #semi https://t.co/h9vrh5yg0z

Oak Ridge National Laboratory’s Summit System remains the world’s fastest supercomputer with an astonishing speed of 148.6 petaflops (one petaflop computer system can perform 1,000,000,000,000,000 floating-point operations per second) https://t.co/IXKaSvbaSc #semi pic.twitter.com/h9vrh5yg0z

— Wladek Grabinski (@wladek60) December 4, 2020

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from Twitter https://twitter.com/wladek60

December 04, 2020 at 09:49AM
via IFTTT