(1st ed. 2025)
By Bharatha Kumar Thangarasu, Nagarajan Mahalingam,
Kaixue Ma, Kiat Seng Yeo
Jenny Stanford Publishing
DOI 10.1201/9781003673569
Abstract: Power consumption has become a critical concern in RF/mm-wave integrated circuit (IC) design thanks to new applications from 5G, mobile computing, artificial intelligence, and the Internet of Things. However, big challenges lie ahead for chip designers when they choose to develop ICs using silicon technology for low-power and high-data-rate applications. This is because silicon technology suffers from undesirable energy dissipation due to its lossy substrate and high resistive wiring loss at GHz frequencies. Nonetheless, silicon remains the most suitable material, satisfying the demands of a rapidly growing semiconductor market through low fabrication cost and ease of achieving system-on-chip or system-in-package integration. While long being neglected, low-power RF/mm-wave design has vaulted to the forefront of attention in recent years due to the demand for ultra-low-power transceivers to achieve sustainability. Designing genuinely ubiquitous transceivers for these new applications requires innovations in both system architecture and circuit implementation.
This book closes the gap between a typical textbook with theories that are difficult to understand and a design-oriented book that offers little insight into actual theories. It evaluates and discusses different circuit topologies, receiver and transmitter architectures, phase-locked loop performance metrics, phase noise analysis, and sub-system-level designs that have yet to be reported in other books.
Table of Contents
- Chapter 1: CMOS RF Active and Passive Devices (pp. 1–49)
- Chapter 2: Transceiver Building Blocks (pp. 50–126)
- Chapter 3: Receiver Sub-System (pp. 127–193)
- Chapter 4: Transmitter Sub-System (pp. 194–238)
- Chapter 5: Transceiver System Integration (pp. 239–347)
- Chapter 6: CMOS RF/mm-Wave Oscillators (pp. 348–401)
- Chapter 7: CMOS Frequency Synthesizers (pp. 402–482)
