Showing posts with label field emission. Show all posts
Showing posts with label field emission. Show all posts

May 23, 2023

[paper] Schottky Barrier FET at Deep Cryogenic Temperatures

Christian Roemer1,2, Nadine Dersch1, Ghader Darbandy1, Mike Schwarz1,
Yi Han3, Qing-Tai Zhao3, Benjamın Iniguez2 and Alexander Kloes1
Compact Modeling of Schottky Barrier Field-Effect Transistors 
at Deep Cryogenic Temperatures
EUROSOI-ULIS 2023
in Tarragona (Catalonia, Spain) on May 10-12 2023

1 NanoP, TH Mittelhessen - University of Applied Sciences, Giessen, Germany
2 DEEEA, Universitat Rovira i Virgili, Tarragona, Spain
3 Peter-Grunberg-Institute (PGI 9), Forschungszentrum Julich, Germany


Abstract: In this paper, a physics-based DC compact model for Schottky barrier field-effect transistors at deep cryogenic temperatures is presented. The model uses simplified tunneling equations at temperatures of ϑ ≈ 0 K in order to calculate the field emission injection current at the device’s Schottky barriers. The compact model is also compared to and verified by measurements of ultra-thin body and buried oxide SOI Schottky barrier field-effect transistors and is able to capture the signature of resonant tunneling effects in the transfer characteristics.

FIG: Band diagram at the source side Schottky junction (left-hand side). The solid blue line is the conduction band of the channel and the blue dashed line shows the metal’s Fermi energy level. The right-hand side subplot shows the tunneling probability, with the exponential part (red line) and the total probability, including the oscillations (green line).



Aug 3, 2017

[paper] On the Physical Behavior of Cryogenic IV and III-V Schottky Barrier MOSFET Devices

On the Physical Behavior of Cryogenic IV and III–V Schottky Barrier MOSFET Devices
Mike Schwarz, Member, IEEE, Laurie E. Calvet, Member, IEEE, John P. Snyder, Member, IEEE, Tillmann Krauss, Udo Schwalke, Senior Member, IEEE, and Alexander Kloes, Senior Member, IEEE
in IEEE TED , vol.PP, no.99, pp.1-8
doi: 10.1109/TED.2017.2726899

Abstract: The physical influence of temperature down to the cryogenic regime is analyzed in a comprehensive study and the comparison of IV and III-V Schottky barrier (SB) double-gate MOSFETs. The exploration is done using the Synopsys TCAD Sentaurus device simulator and first benchmarked with experimental data. The important device physics of both SB-MOSFETs and conventional MOSFETs are reviewed. The impact of temperature on device performance down to the liquid-nitrogen regime is then explored. We find reduced drive currents in SB-MOSFETs fabricated on small effective mass materials and that SB lowering can significantly improve SB-MOSFETs, especially at low temperatures [read more...]

This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination