[paper] Compact Modeling as a Bridge between Technologies and ICs

Compact Modeling as a Bridge 

between Scaled Semiconductor Technologies and Advanced Designs of the Integrated Circuits

AB Bhattacharyya and Wladek Grabinski

IETE Journal of Research 58(3):179-180 (May 2012)

DOI: 10.4103/0377-2063.97322

Abstract: The quality of the integrated circuits analysis, required in present contemporary design flows, is directly linked to the accuracy of its basic components—the Compact Model/Simulation Program with Integrated Circuit Emphasis (SPICE) Model. The compact/SPICE modeling is an essential research activity bridging scaled semiconductor technologies and advanced designs of the integrated circuits. To enable complete access to the new advanced semiconductor technologies, the designers have to frequently update their Computer-Aided Design (CAD) tools with accurate definition of the semiconductor device models that can be implemented into the CAD circuit simulators. The models must preferably be physics-based to account for complex dependencies of the device properties and defined in standard, high-level language, i.e., Verilog-A, to simplify access and implementation into the CAD tools. For the state of the art advanced CMOS technologies (analog, HV, SOI), both modeling and characterization are challenging tasks that will be emphasized in this special issue of Compact Modeling. (REF) Compact Modeling as a Bridge between Scaled Semiconductor Technologies and Advanced Designs of the Integrated Circuits. 

Available from: <http://www.mos-ak.org/india/>

and https://www.researchgate.net/publication/278384752_Compact_Modeling_as_a_Bridge_between_Scaled_Semiconductor_Technologies_and_Advanced_Designs_of_the_Integrated_Circuits