Overview: This industry - wide event has gathered, for over 30 years, industry leaders and widely known experts, in a social - oriented environment. Our contributed papers and invited talks are focused on SOI Technology, Low - Voltage Devices/Circuits/Architectures, and 3D Integration. These 3 technologies will play a major role in tomorrow's industry as they enable application - tailored and Energy / Cost efficient circuit designs.
Important Dates
Paper Submission Deadline: May 22, 2017
Acceptance Notification: July 1, 2017
Monday to Wednesday, Oct. 16-18, 2017: Technical Sessions
Thursday, Oct.19: Fully - Depleted SOI Circuit Design; Full-day Tutorial
Tuesday, Oct.17: Monolithic 3D Half-day Tutorial
Tuesday, Oct.17: Monolithic 3D Half-day Tutorial
Scope: We welcome papers in the following areas: | |
Silicon On Insulator (SOI) | |
• Advanced Materials,
Substrate and Processes • Device Physics, Characterization and Modeling • Device/Circuit Integration • SOI Design, Circuits and Applications |
• Non-Digital Devices and
Applications (RF, HV, Photonics, NEMS, MEMS, Analog...) • New SOI Structures, Circuits and Applications |
Low-Voltage Microelectronics | |
• Space-Based and Unattended
Remote Sensors • Biomedical Devices • Low-Voltage Handheld/wireless systems • Ultra-Low-Power Digital Computation • Analog and RF Technologies |
• Low Voltage Memory
Technologies • Energy Harvesting Techniques • Asynchronous Circuits • Novel Device and Fabrication Technology |
3D Integration | |
• Low Thermal Budget
Processing • Fabrication Techniques and Bonding Methods • Design and Test Methodologies • Processes for Multi Wafer Stacking • 3D IC EDA and Design Technology |
• Heterogeneous Structures • 3D Manufacturing and Logistics • Reliability of 3D Circuits • Fault Tolerant 3D Designs |
Paper Submission:
Prospective authors should prepare a 2page abstract (follow online guidelines).
Acceptance is based on paper’s technical quality and relevance.
Conference manager contact Joyce Lloyd
6930 De Celis Pl., #36
Van Nuys, CA 91406
Tel: +1 818 795 3768
Fax: +1 818 855 8392
No comments:
Post a Comment